Abstract: A method of processing a wafer or other articles by horizontally transporting vertically oriented wafers into one or more process cells. A carrier is rotated from a substantially horizontal orientation to a substantially vertical orientation. A cathode assembly secures the wafer onto the carrier and electrically couples the wafer to a power supply.

Abstract: A method of processing wafers or other articles within a processing cell, entailing transporting a carrier supporting a vertically-oriented wafer horizontally through an inlet opening of a process cell, processing the vertically-oriented wafer within the process cell, and then transporting the carrier out of the process cell horizontally through an outlet opening of the process cell. In one exemplary implementation, the process performed within the cell is a pre-or post- treatment where the wafer is subjected to an acid solution treatment and/or a rinsing with de-ionized water treatment. In another exemplary implementation, the process performed within the process cell is an electroplating of the plating surface of the wafer. Additionally, a method of processing an empty carrier entailing transporting the carrier horizontally through an inlet opening of a process cell, processing the carrier within the process cell, and transporting the carrier out of the process cell horizontally through an outlet opening.

Abstract: A process cell for processing wafers and other planar articles, including a horizontally-transportable carrier for supporting a wafer in a substantially vertical orientation and an enclosure for housing the carrier and performing one or more processes to the wafer. The enclosure including a carrier inlet to allow the horizontal passage of a carrier into the process cell and a carrier outlet to allow the horizontal passage of a carrier to outside of the process cell. One embodiment of a process cell is configured to perform a pre- or post-treatment of a wafer, such as treating the wafer with acid solution and/or with de-ionized water. Another embodiment of the process cell is configured to perform electroplating of the wafer. Another process cell is configured to the process empty carriers, including the striping of undesired plating deposition on cathode contacts.

Abstract: A method of processing a wafer or other articles by horizontally transporting vertically oriented wafers into one or more process cells. A carrier is rotated from a substantially horizontal orientation to a substantially vertical orientation. A cathode assembly secures the wafer onto the carrier and electrically couples the wafer to a power supply.

Abstract: A method of processing wafers or other articles within a processing cell, entailing transporting a carrier supporting a vertically-oriented wafer horizontally through an inlet opening of a process cell, processing the vertically-oriented wafer within the process cell, and then transporting the carrier out of the process cell horizontally through an outlet opening of the process cell. In one exemplary implementation, the process performed within the cell is a pre-or post-treatment where the wafer is subjected to an acid solution treatment and/or a rinsing with de-ionized water treatment. In another exemplary implementation, the process performed within the process cell is an electroplating of the plating surface of the wafer. Additionally, a method of processing an empty carrier entailing transporting the carrier horizontally through an inlet opening of a process cell, processing the carrier within the process cell, and transporting the carrier out of the process cell horizontally through an outlet opening.

Abstract: A wafer processing system for performing horizontal transport of vertically-oriented wafers into one or more process cells to perform vertical processing on the wafers. The wafer processing system includes a loading station for loading wafers onto respective carriers in a horizontal fashion and for rotating the carriers to orient the wafers in a vertical orientation for transport and processing, one or more process cells for processing the wafers in a vertical orientation respectively therein, and an unloading station for rotating the carriers to orient the wafers from a vertical orientation to a horizontal orientation and for unloading the wafer off the carriers in a horizontal fashion. Additionally, the wafer processing system includes a carrier transport system for transporting carriers horizontally from the loading station, to one or more process cells, then to the unloading station, and additionally to a carrier process section for processing of empty carriers.

Abstract: A wafer process methodology characterized by horizontal transport of vertically-oriented wafers into one or more process cells for performing vertical processing on the wafers. The process methodology also includes simultaneous processing of a plurality of vertically-oriented wafers at indexed positions along the horizontal transportation route. Additionally, the process methodology further includes loading of wafers onto carriers in a horizontal fashion and then rotating the carriers to orient the wafers vertically for transport and processing.

Abstract: A wafer plating system horizontally transporting vertically oriented wafers into one or more process cells. The wafer processing system includes a carrier rotatable from a substantially horizontal orientation to a substantially vertical orientation. A cathode assembly secures the wafer onto the carrier and electrically couples the wafer to a power supply.

Abstract: A plating apparatus and methodology is disclosed that is particularly useful in improving the plating rate, improving the plating of via holes, improving the uniformity of the plating deposition across the surface of the wafer, and minimizing damage to the wafer. With regard to improving the plating rate and the plating of via holes, the plating apparatus and method immerses a wafer in a plating fluid bath and continuously directs plating fluid towards the surface of the wafer. Immersing the wafer in a plating fluid bath reduces the occurrence of trapped gas pockets within via holes which makes it easier to plate them. The continuous directing of plating fluid towards the surface of the wafer increases the ion concentration gradient which is, in turn, increases the plating rate.

Abstract: A plating apparatus and methodology is disclosed that is particularly useful in improving the plating rate, improving the plating of via holes, improving the uniformity of the plating deposition across the surface of the wafer, and minimizing damage to the wafer. With regard to improving the plating rate and the plating of via holes, the plating apparatus and method immerses a wafer in a plating fluid bath and continuously directs plating fluid towards the surface of the wafer. Immersing the wafer in a plating fluid bath reduces the occurrence of trapped gas pockets within via holes which makes it easier to plate them. The continuous directing of plating fluid towards the surface of the wafer increases the ion concentration gradient which is, in turn, increases the plating rate.

Abstract: A plating apparatus and methodology is disclosed that is particularly useful in improving the plating rate, improving the plating of via holes, improving the uniformity of the plating deposition across the surface of the wafer, and minimizing damage to the wafer. With regard to improving the plating rate and the plating of via holes, the plating apparatus and method immerses a wafer in a plating fluid bath and continuously directs plating fluid towards the surface of the wafer. Immersing the wafer in a plating fluid bath reduces the occurrence of trapped gas pockets within via holes which makes it easier to plate them. The continuous directing of plating fluid towards the surface of the wafer increases the ion concentration gradient which is, in turn, increases the plating rate.

Abstract: Disclosed is an in-line electrolytic deflash system and method for removing resin bleed and other materials from the leads of an encapsulated electronic component. An encapsulated electronic component is carried on a continuous belt through the system. The component first passes through an electrolytic deflash station which includes tanks filled with a deflash solution for loosening the resin bleed. The component is then rinsed in a low pressure rinse station, and then carried through a high pressure rinse station where the loosened resin bleed is removed from the component. The component is then further rinsed with both tap water and a deionized water. Once the component has been sufficiently rinsed any remaining moisture is blown off the part in an air knife station and the component is then passed through a dryer which completely removes any moisture remaining on the component.

Abstract: Improved apparatus for carrying encapsulated electronic components, having a conveyor belt defined by a horizontal web with a pluraity of identical, flexible tines depending from both sides of the edge of the web. The web is formed into a continuous, endless loop adapted to be carried on a pair of vertical pulleys rotatable on horizontal shafts. Projecting cams, on the face of the web of the belt remote from the dependent tines, engage mating indentations in the periphery of the two pulleys guiding and imparting movement to the belt. The opposing groups of tines are urged apart, by spreader cams, at the beginning and end of the passage of the belt between the lower faces of the two pulleys. Parts to be plated are brought into the space between the tines which, upon exiting from the cams as the conveyor moves entrap the part between them and causing them to move through the plating tanks and treatment stations positioned along the path of the conveyor.

Abstract: An improved transport belt is provided for gripping and carrying parts such as thin and fragile electronic components through production processes including, for example, electroplating steps and the like. The transport belt comprises an elongated upright web carrying a succession of depending gripper units, each including first and second fingers for gripping and carrying the production parts. The first finger is formed generally coplanar with the belt web, whereas the second finger has a generally U-shaped configuration with depending legs on the leading and trailing sides, respectively, of the first finger. The legs are deformed laterally from the plane of the belt web and interconnected at their lower ends by a cross bar which is urged by the legs into spring-loaded contact with the lower end or tip of the first finger.