Patents by Inventor Daniel J. Koch

Daniel J. Koch has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240148429
    Abstract: A method for determining motional branch current in an ultrasonic transducer of an ultrasonic surgical device over multiple frequencies of a transducer drive signal. The method may comprise, at each of a plurality of frequencies of the transducer drive signal, oversampling a current and voltage of the transducer drive signal, receiving, by a processor, the current and voltage samples, and determining, by the processor, the motional branch current based on the current and voltage samples, a static capacitance of the ultrasonic transducer and the frequency of the transducer drive signal.
    Type: Application
    Filed: November 29, 2023
    Publication date: May 9, 2024
    Inventors: Eitan T. Wiener, Jeffrey L. Aldridge, Brian T. Noyes, Jeffrey D. Messerly, James R. Giordano, Robert J. Beetel, III, Nathan J. Price, Matthew C. Miller, Jeffrey P. Wiley, Daniel W. Price, Robert L. Koch, JR., Joseph A. Brotz, John E. Hein
  • Publication number: 20240128131
    Abstract: A camera may capture reflected light from the surface of the wafer during a semiconductor process that adds or removes material from the wafer, such as an etch process. To accurately determine an endpoint for the process, a camera sampling rate and light source intensity may be optimized in the process recipe. Optimizing the light source intensity may include characterizing light intensities that will be reflected from the waiver using an image of the wafer. Pixel intensities may be used to adjust the light source intensity to compensate for more complex wafer patterns. Optimizing the camera sampling rates may include nondestructively rotating a view of the wafer and converting the sampled intensities to the frequency domain. The camera sampling rate may be increased or decreased to remove spatial noise from the image without oversampling unnecessarily. These optimized parameters may then generate a clean, repeatable trace for endpoint determination.
    Type: Application
    Filed: October 14, 2022
    Publication date: April 18, 2024
    Applicant: Applied Materials, Inc.
    Inventors: Avishay Vaxman, Qintao Zhang, Jeffrey P. Koch, David P. Surdock, Wayne R. Swart, David J. Lee, Samphy Hong, Aldrin Bernard Vincent Eddy, Daniel G. Deyo
  • Patent number: 8361769
    Abstract: Cytochrome P450 CYP153A6 from Myobacterium sp. strain HXN1500 was engineered using in-vivo directed evolution to hydroxylate small-chain alkanes regioselectively. Mutant CYP153A6-BMO1 selectively hydroxylates butane and pentane at the terminal carbon to form 1-butanol and 1-pentanol, respectively, at rates greater than wild-type CYP153A6 enzymes. This biocatalyst is highly active for small-chain alkane substrates and the regioselectivity is retained in whole-cell biotransformations.
    Type: Grant
    Filed: November 16, 2009
    Date of Patent: January 29, 2013
    Assignee: U.S. Department of Energy
    Inventors: Daniel J. Koch, Frances H. Arnold
  • Patent number: 8309333
    Abstract: AlkB from Pseudomonas putida was engineered using in-vivo directed evolution to hydroxylate small chain alkanes. Mutant AlkB-BMO1 hydroxylates propane and butane at the terminal carbon at a rate greater than the wild-type to form 1-propanol and 1-butanol, respectively. Mutant AlkB-BMO2 similarly hydroxylates propane and butane at the terminal carbon at a rate greater than the wild-type to form 1-propanol and 1-butanol, respectively. These biocatalysts are highly active for small chain alkane substrates and their regioselectivity is retained in whole-cell biotransformations.
    Type: Grant
    Filed: November 16, 2009
    Date of Patent: November 13, 2012
    Assignee: The United States of America, as represented by Department of Energy
    Inventors: Daniel J. Koch, Frances H. Arnold
  • Patent number: 8285379
    Abstract: An electrical interconnect structure for an implantable medical device includes a feedthrough that has a pin extending therefrom. The pin defines a first end and a middle portion. A bonding surface is formed at the first end of the pin, and the bonding surface has a surface area greater than a cross-sectional area of the pin at its middle portion.
    Type: Grant
    Filed: January 30, 2006
    Date of Patent: October 9, 2012
    Assignee: Medtronic, Inc.
    Inventors: Rajesh V. Iyer, William J. Taylor, Joseph F. Lessar, Mark D. Breyen, Daniel J. Koch
  • Patent number: 8160707
    Abstract: An implantable medical device is provided including a housing, an external circuit element extending outwardly from the housing, an internal circuit enclosed by the housing, a feedthrough array disposed along the housing having at least one filtered feedthrough and at least one unfiltered feedthrough, wherein the unfiltered feedthrough is adapted for connection to the outwardly extending circuit element; and including means for minimizing electromagnetic coupling between the filtered feedthrough and the unfiltered feedthrough.
    Type: Grant
    Filed: January 30, 2006
    Date of Patent: April 17, 2012
    Assignee: Medtronic, Inc.
    Inventors: Rajesh V. Iyer, Daniel J. Koch, Simon E. Goldman, Shawn D. Knowles, William J. Taylor, Joyce K. Yamamoto, Gregory J. Haubrich, Michael Nowak, David Nghiem, Roger L. Hubing, Len D. Twetan
  • Patent number: 7816928
    Abstract: A determination of an equivalent series resistance (ESR) effect for high frequency filtering performance of a filtered feed-through assembly is described. A low frequency signal is introduced to a filtered feed-through assembly. ESR limit of the filtered feed-through is determined based on the low frequency signal.
    Type: Grant
    Filed: March 2, 2009
    Date of Patent: October 19, 2010
    Assignee: Medtronic, Inc.
    Inventors: Rajesh V. Iyer, Ryan J. Jensen, Curtis E. Burgardt, Susan A. Tettemer, Daniel J. Koch, Simon E. Goldman
  • Publication number: 20090160465
    Abstract: A determination of an equivalent series resistance (ESR) effect for high frequency filtering performance of a filtered feed-through assembly is described. A low frequency signal is introduced to a filtered feed-through assembly. ESR limit of the filtered feed-through is determined based on the low frequency signal.
    Type: Application
    Filed: March 2, 2009
    Publication date: June 25, 2009
    Applicant: Medtronic, Inc.
    Inventors: Rajesh V. Iyer, Ryan J. Jensen, Curtis E. Burgardt, Susan A. Tettemer, Daniel J. Koch, Simon E. Goldman
  • Patent number: 7538563
    Abstract: A determination of an equivalent series resistance (ESR) effect for high frequency filtering performance of a filtered feed-through assembly is described. A low frequency signal is introduced to a filtered feed-through assembly. ESR limit of the filtered feed-through is determined based on the low frequency signal.
    Type: Grant
    Filed: September 27, 2005
    Date of Patent: May 26, 2009
    Assignee: Medtronic, Inc.
    Inventors: Rajesh V. Iyer, Ryan J. Jensen, Curtis E. Burgardt, Susan A. Tettemer, Daniel J. Koch, Simon E. Goldman
  • Patent number: 7499817
    Abstract: A determination of an equivalent series resistance (ESR) effect for high frequency filtering performance of a filtered feed-through assembly is described. A low frequency signal is introduced to a filtered feed-through assembly. ESR limit of the filtered feed-through is determined based on the low frequency signal.
    Type: Grant
    Filed: September 27, 2005
    Date of Patent: March 3, 2009
    Assignee: Medtronic, Inc.
    Inventors: Rajesh V. Iyer, Ryan J. Jensen, Curtis E. Burgardt, Susan A. Tettemer, Daniel J. Koch, Simon E. Goldman
  • Patent number: 7187535
    Abstract: A feedthrough assembly for guiding a plurality of terminal pins through the housing of an implantable medical device. The feedthrough assembly comprises a ferrule fixedly coupled to the housing and having an aperture therethrough, and a non-conductive supporting structure fixedly coupled to the plurality of terminal pins and disposed within the aperture. The supporting structure is configured to guide the plurality of terminal pins through the ferrule. A plurality of capacitors, which is fewer in number than the plurality of terminal pins, is fixedly coupled to the supporting structure and electrically coupled between the ferrule and selected ones of the plurality of terminal pins.
    Type: Grant
    Filed: January 30, 2006
    Date of Patent: March 6, 2007
    Assignee: Medtronic, Inc.
    Inventors: Rajesh V. Iyer, Daniel J. Koch, Shawn D. Knowles
  • Publication number: 20040119485
    Abstract: A method for making a probe finger structure including the steps of providing a wafer or wafer portion having an upper layer, a lower layer and an insulating or etch stop layer located between the upper and lower layers. The method further includes the step of etching the lower layer to form a mounting portion, and etching the upper layer to form a plurality of probe fingers. The method also includes the step of locating an electrically conductive material on each of the probe fingers.
    Type: Application
    Filed: December 20, 2002
    Publication date: June 24, 2004
    Inventors: Daniel J. Koch, David R. Keenan, Greg L. Gephart
  • Patent number: 6720635
    Abstract: An electronic component includes a composite semiconductor substrate (110, 810) having a first side (111) opposite a second side (112), a semiconductor device (160, 170) at the first side of the composite semiconductor substrate, and a transducer (400, 600, 900) at the second side of the composite semiconductor substrate.
    Type: Grant
    Filed: December 17, 1999
    Date of Patent: April 13, 2004
    Assignee: Motorola, Inc.
    Inventors: Daniel J. Koch, Bishnu Prasanna Gogoi, Raymond M. Roop
  • Patent number: 6544810
    Abstract: A capacitively sensed micromachined component includes an electrically insulative substrate (120) having a first side (121) and a second side (122) opposite the first side. The component also includes a first layer (130) adjacent to the second side of the electrically insulative substrate where at least a first portion of the first layer located adjacent to the second side of the electrically insulative substrate is infra-red light absorbing and is also electrically conductive. The component further includes a diffusion and chemical barrier layer (240) encapsulating the first layer and the electrically insulative substrate. The component still further includes a capacitively sensed micromachined device (310) on the diffusion and chemical barrier layer.
    Type: Grant
    Filed: August 31, 2000
    Date of Patent: April 8, 2003
    Assignee: Motorola, Inc.
    Inventors: Daniel J. Koch, Paul L. Bergstrom
  • Patent number: 6238935
    Abstract: A method for fabricating a silicon-on-sapphire wafer for processing by silicon-wafer-processing equipment. A layer is deposited on a backside of a silicon-on-sapphire wafer, the layer having optical and electrical properties of silicon, wherein the silicon-on-sapphire wafer may be sensed by a sensor designed to sense a presence of a silicon wafer.
    Type: Grant
    Filed: March 1, 1999
    Date of Patent: May 29, 2001
    Assignee: International Business Machines Corporation
    Inventors: James L. Egley, George M. Gut, Daniel J. Koch, Michael A. Matusewic
  • Patent number: 6228275
    Abstract: A sensor has a support substrate (200), an electrode (110, 510, 710) movable relative to a surface (201) of the support substrate (200) and comprised of a first material, a structure (160, 460, 560, 760) over a portion of the electrode (110, 510, 710) to limit mobility of the electrode (110, 510, 710) and comprised of a second material different from the first material, and bonding pads (170, 470) outside a perimeter of the electrode (110, 510, 710) and comprised of the second material.
    Type: Grant
    Filed: December 10, 1998
    Date of Patent: May 8, 2001
    Assignee: Motorola, Inc.
    Inventors: Daniel J. Koch, Jonathan H. Hammond, Daniel N. Koury, Jr., Jonathan F. Gorrell
  • Patent number: 6046215
    Abstract: This invention provides compounds and a method for the inhibition of serotonin reuptake in mammals.
    Type: Grant
    Filed: July 30, 1998
    Date of Patent: April 4, 2000
    Assignee: Eli Lilly and Company
    Inventors: James E. Audia, Daniel J. Koch, Thomas E. Mabry, Jeffrey S. Nissen, Vincent P. Rocco, Yao-Chang Xu
  • Patent number: 6023091
    Abstract: A sealable air gap (14) is formed between a heating element (16) and a base (11) to improve the thermal isolation of a semiconductor heater (10). A top layer (17) is formed over the heating element (16) which seals the air gap (14) so that the sealable air gap (14) can be at either atmospheric pressure or under a vacuum. The semiconductor heater (10) can be used in a variety of applications including as a heat source to adjust the resistivity of an overlying resistive layer (18). The embodiments of the semiconductor heater (10) also include a chemical sensor (20). Heat from a heating element (26) is used to keep an overlying layer of chemical sensing material (28) at an optimal temperature. The embodiments of the present invention also include a transducer (40) to heat a fluid (52) in a well (55) such as in an ink jet application.
    Type: Grant
    Filed: November 30, 1995
    Date of Patent: February 8, 2000
    Assignee: Motorola, Inc.
    Inventors: Daniel J. Koch, Kenneth G. Goldman, Keith G. Kamekona, Mark D. Summers
  • Patent number: 5889872
    Abstract: A capacitive microphone (10) utilizes a polysilicon diaphragm (14) that overlies an atmospheric cavity (34). The diaphragm is doped and annealed to form a sensitivity of the microphone (10). A silicon cap covers and protects the diaphragm (14) and a fixed plate (18).
    Type: Grant
    Filed: July 2, 1996
    Date of Patent: March 30, 1999
    Assignee: Motorola, Inc.
    Inventors: Kathirgamasundaram Sooriakumar, Daniel J. Koch, Kenneth G. Goldman
  • Patent number: 5877094
    Abstract: A method for fabricating a silicon-on-sapphire wafer for processing by silicon-wafer-processing equipment. A layer is deposited on a backside of a silicon-on-sapphire wafer, the layer having optical and electrical properties of silicon, wherein the silicon-on-sapphire wafer may be sensed by a sensor designed to sense a presence of a silicon wafer.
    Type: Grant
    Filed: April 7, 1994
    Date of Patent: March 2, 1999
    Assignee: International Business Machines Corporation
    Inventors: James L. Egley, George M. Gut, Daniel J. Koch, Michael A. Matusewic