Patents by Inventor Daniel J. Koch
Daniel J. Koch has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240148429Abstract: A method for determining motional branch current in an ultrasonic transducer of an ultrasonic surgical device over multiple frequencies of a transducer drive signal. The method may comprise, at each of a plurality of frequencies of the transducer drive signal, oversampling a current and voltage of the transducer drive signal, receiving, by a processor, the current and voltage samples, and determining, by the processor, the motional branch current based on the current and voltage samples, a static capacitance of the ultrasonic transducer and the frequency of the transducer drive signal.Type: ApplicationFiled: November 29, 2023Publication date: May 9, 2024Inventors: Eitan T. Wiener, Jeffrey L. Aldridge, Brian T. Noyes, Jeffrey D. Messerly, James R. Giordano, Robert J. Beetel, III, Nathan J. Price, Matthew C. Miller, Jeffrey P. Wiley, Daniel W. Price, Robert L. Koch, JR., Joseph A. Brotz, John E. Hein
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Publication number: 20240128131Abstract: A camera may capture reflected light from the surface of the wafer during a semiconductor process that adds or removes material from the wafer, such as an etch process. To accurately determine an endpoint for the process, a camera sampling rate and light source intensity may be optimized in the process recipe. Optimizing the light source intensity may include characterizing light intensities that will be reflected from the waiver using an image of the wafer. Pixel intensities may be used to adjust the light source intensity to compensate for more complex wafer patterns. Optimizing the camera sampling rates may include nondestructively rotating a view of the wafer and converting the sampled intensities to the frequency domain. The camera sampling rate may be increased or decreased to remove spatial noise from the image without oversampling unnecessarily. These optimized parameters may then generate a clean, repeatable trace for endpoint determination.Type: ApplicationFiled: October 14, 2022Publication date: April 18, 2024Applicant: Applied Materials, Inc.Inventors: Avishay Vaxman, Qintao Zhang, Jeffrey P. Koch, David P. Surdock, Wayne R. Swart, David J. Lee, Samphy Hong, Aldrin Bernard Vincent Eddy, Daniel G. Deyo
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Patent number: 8361769Abstract: Cytochrome P450 CYP153A6 from Myobacterium sp. strain HXN1500 was engineered using in-vivo directed evolution to hydroxylate small-chain alkanes regioselectively. Mutant CYP153A6-BMO1 selectively hydroxylates butane and pentane at the terminal carbon to form 1-butanol and 1-pentanol, respectively, at rates greater than wild-type CYP153A6 enzymes. This biocatalyst is highly active for small-chain alkane substrates and the regioselectivity is retained in whole-cell biotransformations.Type: GrantFiled: November 16, 2009Date of Patent: January 29, 2013Assignee: U.S. Department of EnergyInventors: Daniel J. Koch, Frances H. Arnold
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Patent number: 8309333Abstract: AlkB from Pseudomonas putida was engineered using in-vivo directed evolution to hydroxylate small chain alkanes. Mutant AlkB-BMO1 hydroxylates propane and butane at the terminal carbon at a rate greater than the wild-type to form 1-propanol and 1-butanol, respectively. Mutant AlkB-BMO2 similarly hydroxylates propane and butane at the terminal carbon at a rate greater than the wild-type to form 1-propanol and 1-butanol, respectively. These biocatalysts are highly active for small chain alkane substrates and their regioselectivity is retained in whole-cell biotransformations.Type: GrantFiled: November 16, 2009Date of Patent: November 13, 2012Assignee: The United States of America, as represented by Department of EnergyInventors: Daniel J. Koch, Frances H. Arnold
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Patent number: 8285379Abstract: An electrical interconnect structure for an implantable medical device includes a feedthrough that has a pin extending therefrom. The pin defines a first end and a middle portion. A bonding surface is formed at the first end of the pin, and the bonding surface has a surface area greater than a cross-sectional area of the pin at its middle portion.Type: GrantFiled: January 30, 2006Date of Patent: October 9, 2012Assignee: Medtronic, Inc.Inventors: Rajesh V. Iyer, William J. Taylor, Joseph F. Lessar, Mark D. Breyen, Daniel J. Koch
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Patent number: 8160707Abstract: An implantable medical device is provided including a housing, an external circuit element extending outwardly from the housing, an internal circuit enclosed by the housing, a feedthrough array disposed along the housing having at least one filtered feedthrough and at least one unfiltered feedthrough, wherein the unfiltered feedthrough is adapted for connection to the outwardly extending circuit element; and including means for minimizing electromagnetic coupling between the filtered feedthrough and the unfiltered feedthrough.Type: GrantFiled: January 30, 2006Date of Patent: April 17, 2012Assignee: Medtronic, Inc.Inventors: Rajesh V. Iyer, Daniel J. Koch, Simon E. Goldman, Shawn D. Knowles, William J. Taylor, Joyce K. Yamamoto, Gregory J. Haubrich, Michael Nowak, David Nghiem, Roger L. Hubing, Len D. Twetan
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Patent number: 7816928Abstract: A determination of an equivalent series resistance (ESR) effect for high frequency filtering performance of a filtered feed-through assembly is described. A low frequency signal is introduced to a filtered feed-through assembly. ESR limit of the filtered feed-through is determined based on the low frequency signal.Type: GrantFiled: March 2, 2009Date of Patent: October 19, 2010Assignee: Medtronic, Inc.Inventors: Rajesh V. Iyer, Ryan J. Jensen, Curtis E. Burgardt, Susan A. Tettemer, Daniel J. Koch, Simon E. Goldman
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Publication number: 20090160465Abstract: A determination of an equivalent series resistance (ESR) effect for high frequency filtering performance of a filtered feed-through assembly is described. A low frequency signal is introduced to a filtered feed-through assembly. ESR limit of the filtered feed-through is determined based on the low frequency signal.Type: ApplicationFiled: March 2, 2009Publication date: June 25, 2009Applicant: Medtronic, Inc.Inventors: Rajesh V. Iyer, Ryan J. Jensen, Curtis E. Burgardt, Susan A. Tettemer, Daniel J. Koch, Simon E. Goldman
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Patent number: 7538563Abstract: A determination of an equivalent series resistance (ESR) effect for high frequency filtering performance of a filtered feed-through assembly is described. A low frequency signal is introduced to a filtered feed-through assembly. ESR limit of the filtered feed-through is determined based on the low frequency signal.Type: GrantFiled: September 27, 2005Date of Patent: May 26, 2009Assignee: Medtronic, Inc.Inventors: Rajesh V. Iyer, Ryan J. Jensen, Curtis E. Burgardt, Susan A. Tettemer, Daniel J. Koch, Simon E. Goldman
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Patent number: 7499817Abstract: A determination of an equivalent series resistance (ESR) effect for high frequency filtering performance of a filtered feed-through assembly is described. A low frequency signal is introduced to a filtered feed-through assembly. ESR limit of the filtered feed-through is determined based on the low frequency signal.Type: GrantFiled: September 27, 2005Date of Patent: March 3, 2009Assignee: Medtronic, Inc.Inventors: Rajesh V. Iyer, Ryan J. Jensen, Curtis E. Burgardt, Susan A. Tettemer, Daniel J. Koch, Simon E. Goldman
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Patent number: 7187535Abstract: A feedthrough assembly for guiding a plurality of terminal pins through the housing of an implantable medical device. The feedthrough assembly comprises a ferrule fixedly coupled to the housing and having an aperture therethrough, and a non-conductive supporting structure fixedly coupled to the plurality of terminal pins and disposed within the aperture. The supporting structure is configured to guide the plurality of terminal pins through the ferrule. A plurality of capacitors, which is fewer in number than the plurality of terminal pins, is fixedly coupled to the supporting structure and electrically coupled between the ferrule and selected ones of the plurality of terminal pins.Type: GrantFiled: January 30, 2006Date of Patent: March 6, 2007Assignee: Medtronic, Inc.Inventors: Rajesh V. Iyer, Daniel J. Koch, Shawn D. Knowles
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Publication number: 20040119485Abstract: A method for making a probe finger structure including the steps of providing a wafer or wafer portion having an upper layer, a lower layer and an insulating or etch stop layer located between the upper and lower layers. The method further includes the step of etching the lower layer to form a mounting portion, and etching the upper layer to form a plurality of probe fingers. The method also includes the step of locating an electrically conductive material on each of the probe fingers.Type: ApplicationFiled: December 20, 2002Publication date: June 24, 2004Inventors: Daniel J. Koch, David R. Keenan, Greg L. Gephart
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Patent number: 6720635Abstract: An electronic component includes a composite semiconductor substrate (110, 810) having a first side (111) opposite a second side (112), a semiconductor device (160, 170) at the first side of the composite semiconductor substrate, and a transducer (400, 600, 900) at the second side of the composite semiconductor substrate.Type: GrantFiled: December 17, 1999Date of Patent: April 13, 2004Assignee: Motorola, Inc.Inventors: Daniel J. Koch, Bishnu Prasanna Gogoi, Raymond M. Roop
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Patent number: 6544810Abstract: A capacitively sensed micromachined component includes an electrically insulative substrate (120) having a first side (121) and a second side (122) opposite the first side. The component also includes a first layer (130) adjacent to the second side of the electrically insulative substrate where at least a first portion of the first layer located adjacent to the second side of the electrically insulative substrate is infra-red light absorbing and is also electrically conductive. The component further includes a diffusion and chemical barrier layer (240) encapsulating the first layer and the electrically insulative substrate. The component still further includes a capacitively sensed micromachined device (310) on the diffusion and chemical barrier layer.Type: GrantFiled: August 31, 2000Date of Patent: April 8, 2003Assignee: Motorola, Inc.Inventors: Daniel J. Koch, Paul L. Bergstrom
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Patent number: 6238935Abstract: A method for fabricating a silicon-on-sapphire wafer for processing by silicon-wafer-processing equipment. A layer is deposited on a backside of a silicon-on-sapphire wafer, the layer having optical and electrical properties of silicon, wherein the silicon-on-sapphire wafer may be sensed by a sensor designed to sense a presence of a silicon wafer.Type: GrantFiled: March 1, 1999Date of Patent: May 29, 2001Assignee: International Business Machines CorporationInventors: James L. Egley, George M. Gut, Daniel J. Koch, Michael A. Matusewic
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Patent number: 6228275Abstract: A sensor has a support substrate (200), an electrode (110, 510, 710) movable relative to a surface (201) of the support substrate (200) and comprised of a first material, a structure (160, 460, 560, 760) over a portion of the electrode (110, 510, 710) to limit mobility of the electrode (110, 510, 710) and comprised of a second material different from the first material, and bonding pads (170, 470) outside a perimeter of the electrode (110, 510, 710) and comprised of the second material.Type: GrantFiled: December 10, 1998Date of Patent: May 8, 2001Assignee: Motorola, Inc.Inventors: Daniel J. Koch, Jonathan H. Hammond, Daniel N. Koury, Jr., Jonathan F. Gorrell
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Patent number: 6046215Abstract: This invention provides compounds and a method for the inhibition of serotonin reuptake in mammals.Type: GrantFiled: July 30, 1998Date of Patent: April 4, 2000Assignee: Eli Lilly and CompanyInventors: James E. Audia, Daniel J. Koch, Thomas E. Mabry, Jeffrey S. Nissen, Vincent P. Rocco, Yao-Chang Xu
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Patent number: 6023091Abstract: A sealable air gap (14) is formed between a heating element (16) and a base (11) to improve the thermal isolation of a semiconductor heater (10). A top layer (17) is formed over the heating element (16) which seals the air gap (14) so that the sealable air gap (14) can be at either atmospheric pressure or under a vacuum. The semiconductor heater (10) can be used in a variety of applications including as a heat source to adjust the resistivity of an overlying resistive layer (18). The embodiments of the semiconductor heater (10) also include a chemical sensor (20). Heat from a heating element (26) is used to keep an overlying layer of chemical sensing material (28) at an optimal temperature. The embodiments of the present invention also include a transducer (40) to heat a fluid (52) in a well (55) such as in an ink jet application.Type: GrantFiled: November 30, 1995Date of Patent: February 8, 2000Assignee: Motorola, Inc.Inventors: Daniel J. Koch, Kenneth G. Goldman, Keith G. Kamekona, Mark D. Summers
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Patent number: 5889872Abstract: A capacitive microphone (10) utilizes a polysilicon diaphragm (14) that overlies an atmospheric cavity (34). The diaphragm is doped and annealed to form a sensitivity of the microphone (10). A silicon cap covers and protects the diaphragm (14) and a fixed plate (18).Type: GrantFiled: July 2, 1996Date of Patent: March 30, 1999Assignee: Motorola, Inc.Inventors: Kathirgamasundaram Sooriakumar, Daniel J. Koch, Kenneth G. Goldman
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Patent number: 5877094Abstract: A method for fabricating a silicon-on-sapphire wafer for processing by silicon-wafer-processing equipment. A layer is deposited on a backside of a silicon-on-sapphire wafer, the layer having optical and electrical properties of silicon, wherein the silicon-on-sapphire wafer may be sensed by a sensor designed to sense a presence of a silicon wafer.Type: GrantFiled: April 7, 1994Date of Patent: March 2, 1999Assignee: International Business Machines CorporationInventors: James L. Egley, George M. Gut, Daniel J. Koch, Michael A. Matusewic