Patents by Inventor Daniel J. Mellinger

Daniel J. Mellinger has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7538344
    Abstract: The present invention provides photolithographic device and method for photolithography process window. The photolithography device comprises a substrate; and a pattern layer having radiant energy transparent portions and radiant energy blocking portions, where the pattern layer has features with a varying overlay. The overlay tolerance is determined by varying the misalignment the features of the pattern. The photolithography device is a reticle. The method for determining an optimum photolithography process window comprises exposing a portion of a wafer to a pattern produced by a reticle, the pattern having a varying overlay that produces multiple photolithography conditions, wherein each photolithography condition has an overlay tolerance; and stepping the reticle across a remaining portion of the wafer, where each step exposes an other region of the wafer to the pattern producing multiple photolithography conditions.
    Type: Grant
    Filed: January 4, 2005
    Date of Patent: May 26, 2009
    Assignee: International Business Machines Corporation
    Inventors: Daniel J. Mellinger, Timothy C. Milmore, Matthew C. Nicholls
  • Patent number: 6967709
    Abstract: The present invention provides photolithographic device and method for optimizing the photolithography process window. The photolithography device comprises a substrate; and a pattern layer having radiant energy transparent portions and radiant energy blocking portions, where the pattern layer has features with a varying overlay. The overlay tolerance is determined by varying the misalignment the features of the pattern. The photolithography device is a reticle. The method for determining an optimum photolithography process window comprises exposing a portion of a wafer to a pattern produced by a reticle, the pattern having a varying overlay that produces multiple photolithography conditions, wherein each photolithography condition has an overlay tolerance; and stepping the reticle across a remaining portion of the wafer, where each step exposes an other region of the wafer to the pattern producing multiple photolithography conditions.
    Type: Grant
    Filed: November 26, 2003
    Date of Patent: November 22, 2005
    Assignee: International Business Machines Corporation
    Inventors: Daniel J. Mellinger, Timothy C. Milmore, Matthew C. Nicholls