Abstract: To fabricate a ribbon connector for microwave integrated circuit use, an as fired, unclad alumina substrate is coated with a thin film of gold applied by sputter metallization. The thin layer of gold is then built up to a required ribbon thickness by an electroplating process. The thicker layer of gold is then etched by means of standard gold etching techniques where dimensions of the formed ribbons are determined by the precision process of photo reduction and masking rather than cutting and shaping of parts. This process also provides a convenient way to store and transfer these specially shaped ribbons and is amenable to use in mass production environments.