Patents by Inventor Daniel J. Quinn

Daniel J. Quinn has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Deep penetrating focused array
    Patent number: 7016261
    Abstract: Disclosed herein is a single point seismic system comprising an array of air guns disposed within a frame. The array includes a cluster of air guns on one of its ends and a reduction in chamber size of the air guns along the length of the array. On the end of the array opposite the cluster the array can comprise a series of air guns whose chamber size is an order of magnitude less than the chamber size of the guns comprising the cluster. The middle of the array can comprise a series of air guns whose respective chamber volumes differ by an order of magnitude. The frame of the present invention is generally wholly submerged during operation and does not interfere with the seismic signal produced by the firing of the air guns.
    Type: Grant
    Filed: December 9, 2002
    Date of Patent: March 21, 2006
    Assignee: Baker Hughes, Incorporated
    Inventors: Daniel J. Quinn, John W. Gillespie
  • Deep penetrating focused array
    Publication number: 20040109389
    Abstract: Disclosed herein is a single point seismic system comprising an array of air guns disposed within a frame. The array includes a cluster of air guns on one of its ends and a reduction in chamber size of the air guns along the length of the array. On the end of the array opposite the cluster the array can comprise a series of air guns whose chamber size is an order of magnitude less than the chamber size of the guns comprising the cluster. The middle of the array can comprise a series of air guns whose respective chamber volumes differ by an order of magnitude. The frame of the present invention is generally wholly submerged during operation and does not interfere with the seismic signal produced by the firing of the air guns.
    Type: Application
    Filed: December 9, 2002
    Publication date: June 10, 2004
    Applicant: BAKER HUGHES, INCORPORATED
    Inventors: Daniel J. Quinn, John W. Gillespie
  • Integrated-circuit leadframe adapted for a simultaneous bonding operation
    Patent number: 4722060
    Abstract: A leadframe for an integrated circuit includes a set of individual leads temporarily connected in an array; each lead having an exterior portion shaped in a standard form and an interior portion shaped to form a standard array of contacts and to have the same spring constant for deflections perpendicular to the plane of the leadframe.
    Type: Grant
    Filed: March 22, 1984
    Date of Patent: January 26, 1988
    Assignee: Thomson Components-Mostek Corporation
    Inventors: Daniel J. Quinn, Robert H. Bond, Wayne A. Mulholland, Steven Swendrowski, Michael A. Olla, Jerry S. Cupples, Barbara R. Mozdzen, Linda S. Wilson, Linn Garrison
  • Automatic assembly of integrated circuits
    Patent number: 4627151
    Abstract: A system for the assembly and packaging of integrated circuits employs circuit dice that have contact pads in a standard array; a leadframe having leads configured to have the same spring constant; a method for removing selected dice from a wafer array under computer control; and a method of simultaneously bonding all leads to the die.
    Type: Grant
    Filed: March 22, 1984
    Date of Patent: December 9, 1986
    Assignee: Thomson Components-Mostek Corporation
    Inventors: Wayne A. Mulholland, Daniel J. Quinn, Robert H. Bond, Michael A. Olla