Abstract: Long chain fatty acids such as stearic acid are novel additives in a composition comprising a polymer binder plus a ceramic powder and various other additives, which can be fired to become a thin, flat sheet of ceramic. A typical process using this composition includes aggressive mixing such as ball milling, followed by doctor blade tape casting. The fatty acid additive in addition to other materials used as dispersing agents provides a cast composition which is less susceptible to cracking during drying than previous tape casting compositions.

Abstract: A circuit package comprises at least one IC chip bonded directly in a hole provided in a wafer such that the surface of the chip and the surface of the wafer are in the same plane thereby accommodating TAB bonding of the chip to bonding pads provided on the wafer. The structure can include multilayer circuitry on the wafer.

Abstract: A method of forming adherent metallized coatings on a substrate which is useful for the manufacture of printed circuit boards as well as other metal coated articles involves providing the substrate with a rubber-modified epoxy surface or coating, sputter etching at least 50 A. from the surface followed by vacuum depositing an adherent thin metal film of Cr, Ni, Ni-V alloy, Pt, Pd or Ti onto the substrate. Another metal layer is then provided over the adherent thin film.

Abstract: A method for depositing aluminum films on a substrate comprises exposing the substrate to vapors of an aluminum hydride-trialkylamine complex and exposing the surface to ultraviolet light in the areas where aluminum deposition is desired.

Abstract: A method of forming adherent metallized coatings on a substrate which is useful for the manufacture of printed circuit boards as well as other metal coated articles involves providing the substrate with a rubber-modified epoxy surface or coating, sputter etching at least 50 A. from the surface followed by vacuum depositing an adherent thin metal film of Cr, Ni, Ni-V alloy, Pt, Pd or Ti onto the substrate. Another metal layer is then provided over the adherent thin film.

Abstract: A method of electrolessly plating a substrate having a rubber-modified epoxy surface includes the steps of preheating the substrate and while still warm, sputter etching at least 50A. from its surface. The substrate is then vacuum metalized with an adhesion promoting metal film, coated with a catalytic layer and a metal is electrolessly deposited thereover.

Abstract: A printed circuit board is made from a substrate having a copper clad layer thereon by means of first providing spaced through-holes through the substrate, mechanically scrubbing the surface of the substrate and then sputter etching the surface of the substrate so as to remove at least 50A. thereof from the surface and then vacuum metallizing the through-holes subsequent to sputter etching without breaking the vacuum and then finally forming a circuit pattern on the substrate by usual subtractive techniques.