Abstract: One embodiment of the invention is a method for evaluating a material such as low-k dielectric, by a stress-generating test tool such as a needle. The evaluation object is shaped as a stack of adhering layers: low-k dielectric, first metal (preferably copper), barrier metal (preferably tantalum nitride), and second metal (preferably aluminum). A numerical correlation is established between a cracking in the barrier metal layer caused by probing and a damage in the layer of insulating material-to-be-tested. A predetermined number of locations of the top metal layer is selected for the probing step comprising touch-down, applying force, and lifting is repeated so that the number of repeats provide a pre-determined statistical confidence level.

Abstract: An apparatus for electrical testing having probes (201) constructed of metal elements (201a) of about equal size bonded together in substantially linear sequence. Further an insulating holder (202) having first and second surfaces and a plurality of metal-filled vias (210) traversing the holder from the first to the second surface; the vias form contact pads on the first and second surfaces. The contact pads (210a) of the first holder surface have a probe attached so that the probe is positioned about normal to the surface. A sheet (203) of resilient insulating material, which has first and second surfaces and a thickness traversed by a plurality of conducting traces (220), has its first sheet surface attached to the second holder surface so that at least one of the traces contacts one of the contact pads, respectively, to provide an electrical path to the second sheet surface.