Patents by Inventor Daniel J. Theis

Daniel J. Theis has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11906759
    Abstract: An optical film having a first surface, an opposing second surface, and a thickness normal to the first and second surfaces is cut. Cutting the film forms a channel at least partially through the thickness of the film. A light control material is printed proximate to a surface of the film. The ink traverses through the channel by capillary motion.
    Type: Grant
    Filed: May 20, 2019
    Date of Patent: February 20, 2024
    Assignee: 3M Innovative Properties Company
    Inventors: Daniel J. Theis, Tri D. Pham, Bradley S. English, Steven J. Botzet, Qingbing Wang, Shu-Ching Fan
  • Publication number: 20230138304
    Abstract: A diagnostic device includes a sensor stack with multiple panels of a porous material disposed in planes parallel to one another and in face-to-face contact with each other. At least a portion of the panels of the porous material include hydrophobic regions and hydrophilic regions configured to provide a sample flow path for migration of a fluid sample through the sensor stack from one panel to another in the hydrophilic regions. A wicking layer is on a major surface of the sensor stack.
    Type: Application
    Filed: March 26, 2021
    Publication date: May 4, 2023
    Inventors: Mikhail L. Pekurovsky, Matthew S. Stay, Henrik B. van Lengerich, Ann M. Gilman, Sonnie L. Hubbard, Hannah J. Loughlin, Satinder K. Nayar, Kevin T. Reddy, Timothy J. Rowell, Matthew R.D. Smith, Ronald P. Swanson, Daniel J. Theis, Deniz Yuksel Yurt
  • Publication number: 20220260760
    Abstract: An optical system is disclosed and includes an image sensor (112), a plurality of microlenses (142), at least one microlens of the plurality of microlenses defining a microlens height and a microlens diameter. The optical system also includes a plurality of light-blocking structures (146), at least one light-blocking structure of the plurality of light-blocking structures defining a light-blocking structure height and a light-blocking structure width. An aperture array (134) includes a plurality of apertures (138), each aperture being aligned with a microlens of the plurality of microlenses, and the microlenses and the light-blocking structures extend from the aperture array toward the image sensor. The systems, structures and features disclosed herein can improve a signal-to-noise ratio when detecting images, via the optical sensor, from behind a display.
    Type: Application
    Filed: July 7, 2020
    Publication date: August 18, 2022
    Inventors: Zhaohui Yang, Tri D. Pham, Matthew S. Stay, Matthew R.D. Smith, Daniel J. Theis, Serena L. Schleusner, Jathan D. Edwards
  • Publication number: 20220184262
    Abstract: Aspects of the present disclosure relate to a sensor device having an integrated circuit and a monitoring loop coupled to the integrated circuit. The monitoring loop includes a first conductive trace and a second conductive trace, each having a first end electrically coupled to the integrated circuit and a second end. The monitoring loop includes a sterilant-responsive switch electrically coupling the second ends of the first conductive trace and the second conductive trace. The sterilant-responsive switch has a first impedance state and a second impedance state. The sterilant-responsive switch modifies an electrical connection between the first conductive trace and the second conductive trace based on exposure to an adequate environmental condition in an adequate sterilization process. The sensor device also includes an antenna coupled to the integrated circuit forming an antenna loop that is distinct from the monitoring loop.
    Type: Application
    Filed: April 21, 2020
    Publication date: June 16, 2022
    Inventors: Wensheng XIA, Naiyong Jing, Kara A. Meyers, Ankit Mahajan, Benjamin J. M√ľnstermann, Nicholas T. Gabriel, G. Marco Bommarito, Daniel J. Theis, Roger W. Barton, Mikhail L. Pekurovsky
  • Publication number: 20220113457
    Abstract: The disclosed patterned wavelength-selective material and process for making the patterned wavelength-selective material uses patterned applied adhesive and a structurally weak wavelength-selective material that includes portions that contact the adhesive and break to remain in contact with the adhesive. In one embodiment, the wavelength-selective material comprises an array of sections with cuts at least partially through a wavelength-selective film at each section secured to the adhesive. In another embodiment, the wavelength-selective film comprises a transfer stack of layers.
    Type: Application
    Filed: July 23, 2019
    Publication date: April 14, 2022
    Inventors: Kui CHEN-HO, Douglas S. DUNN, Tien Yi T.H. WHITING, Bryan T. WHITING, Taylor J. KOBE, Anthony F. SCHULTZ, Duane D. FANSLER, Jonah SHAVER, John A. WHEATLEY, Susannah C. CLEAR, Daniel J. THEIS, John T. STRAND, Thomas J. METZLER, Kevin W. GOTRIK, Scott J. JONES
  • Patent number: 11294106
    Abstract: A unitary optical film stack comprising a light redirecting film assembly; a light diffusion film assembly; and an optical adhesive; wherein the light redirecting film assembly and the light diffusion film assembly are physically coupled non-continuously to minimize optical coupling.
    Type: Grant
    Filed: February 10, 2017
    Date of Patent: April 5, 2022
    Assignee: 3M Innovative Properties Company
    Inventors: Tri D. Pham, Qingbing Wang, Daniel J. Theis, Encai Hao, Keith R. Bruesewitz
  • Patent number: 11284521
    Abstract: A composite article includes a conductive layer with nanowires on at least a portion of a flexible substrate, wherein the conductive layer has a conductive surface. A patterned layer of a low surface energy material is on a first region of the conductive surface. An overcoat layer free of conductive particulates is on a first portion of a second region of the conductive surface unoccupied by the patterned layer. A via is in a second portion of the second region of the conductive surface between an edge of the patterned layer of the low surface energy material and the overcoat layer. A conductive material is in the via to provide an electrical connection to the conductive surface.
    Type: Grant
    Filed: June 22, 2016
    Date of Patent: March 22, 2022
    Assignee: 3M INNOVATIVE PROPERTIES, COMPANY
    Inventors: Matthew S. Stay, Shawn C. Dodds, Ann M. Gilman, Mikhail L. Pekurovsky, Daniel J. Theis, Matthew R. D. Smith
  • Patent number: 11279859
    Abstract: Methods of passivating an adhesive via printing an ink onto a release liner, and adhesive articles or products made by the same are provided. An ink pattern is printed onto a release liner to form a pattern of features. The features are at least partially embedded in an adhesive layer such that when the release liner is peeled from the adhesive layer, the passivation features remain with the layer of adhesive to form selected areas having adjusted adhesive functionality. Articles including the passivated adhesive on a release liner are also disclosed.
    Type: Grant
    Filed: November 29, 2017
    Date of Patent: March 22, 2022
    Assignee: 3M INNOVATIVE PROPERTIES COMPANY
    Inventors: Matthew R. D. Smith, Matthew S. Stay, Mikhail L. Pekurovsky, Daniel J. Theis, Thomas J. Metzler, Shawn C. Dodds
  • Publication number: 20220048286
    Abstract: Methods, apparatuses and systems for printing an ink pattern on a moving web via die cutting are provided. A die roll including an inked pattern of die blades contacts a substrate to cut or cleave the substrate surface. While the die blades withdraw from the substrate, at least some of the ink transfers from the die blades to the cut substrate to form an ink pattern.
    Type: Application
    Filed: October 16, 2019
    Publication date: February 17, 2022
    Inventors: Thomas J. Metzler, Kara A. Meyers, Saagar A. Shah, Mikhail L. Pekurovsky, Matthew S. Stay, Shawn C. Dodds, Kevin T. Reddy, John T. Strand, Daniel J. Theis, Jeremy O. Swanson, Daniel M. Lentz
  • Publication number: 20210325585
    Abstract: The disclosed patterned wavelength-selective material and process for making the patterned wavelength-selective material uses selectively located barriers to the adhesive regions. A structurally weak wavelength-selective material includes portions that contact the adhesive regions and break to remain in contact with the adhesive. The wavelength-selective material does not contact the adhesive regions covered by the barrier and is removed leaving a wavelength-selective film in a pattern at the adhesive regions.
    Type: Application
    Filed: July 19, 2019
    Publication date: October 21, 2021
    Inventors: Kui CHEN-HO, Douglas S. DUNN, Matthew S. STAY, Daniel J. THEIS, John T. STRAND, Shawn C. DODDS, Thomas J. METZLER, Kevin W. GOTRIK, Scott J. JONES
  • Publication number: 20210191003
    Abstract: A unitary optical film stack comprising a light redirecting film assembly; a light diffusion film assembly; and an optical adhesive; wherein the light redirecting film assembly and the light diffusion film assembly are physically coupled non-continuously to minimize optical coupling.
    Type: Application
    Filed: February 10, 2017
    Publication date: June 24, 2021
    Inventors: TRI D. PHAM, QINGBING WANG, DANIEL J. THEIS, ENCAI HAO, KEITH R. BRUESEWITZ
  • Publication number: 20210178622
    Abstract: Methods and apparatuses for generating fiducials via die cutting are provided. Laterally arranged die cutting members and fiducial-making members are provided onto a roller to respectively cut a first pattern and a fiducial mark on the same side of a web in a rotatory die cutting process. The fiducial mark is used to register a second pattern provided by a downstream station to the first pattern.
    Type: Application
    Filed: October 18, 2018
    Publication date: June 17, 2021
    Inventors: Thomas J. Metzler, James Zhu, Daniel J. Theis, David D. Miller, Donald G. Peterson, Mikhail L. Pekurovsky
  • Publication number: 20210116611
    Abstract: An optical film having a first surface, an opposing second surface, and a thickness normal to the first and second surfaces is cut. Cutting the film forms a channel at least partially through the thickness of the film. A light control material is printed proximate to a surface of the film. The ink traverses through the channel by capillary motion.
    Type: Application
    Filed: May 20, 2019
    Publication date: April 22, 2021
    Inventors: Daniel J. Theis, Tri D. Pham, Bradley S. English, Steven J. Botzet, Qingbing Wang, Shu-Ching Fan
  • Patent number: 10971468
    Abstract: Processes for automatic registration between a solid circuit die and electrically conductive interconnects, and articles or devices made by the same are provided. The solid circuit die is disposed on a substrate with contact pads aligned with channels on the substrate. Electrically conductive traces are formed by flowing a conductive liquid in the channels toward the contact pads to obtain the automatic registration.
    Type: Grant
    Filed: November 16, 2017
    Date of Patent: April 6, 2021
    Assignee: 3M INNOVATIVE PROPERTIES COMPANY
    Inventors: Ankit Mahajan, Mikhail L. Pekurovsky, Matthew S. Stay, Daniel J. Theis, Ann M. Gilman, Shawn C. Dodds, Thomas J. Metzler, Matthew R. D. Smith, Roger W. Barton, Joseph E. Hernandez, Saagar A. Shah, Kara A. Meyers, James Zhu, Teresa M. Goeddel, Lyudmila A. Pekurovsky, Jonathan W. Kemling, Jeremy K. Larsen, Jessica Chiu, Kayla C. Niccum
  • Patent number: 10705266
    Abstract: An optical film assembly comprising a first optical film, a coupling member, and a second optical film wherein the first optical film comprises a prismatic film, the second optical film comprises a diffuser, wherein the coupling member is bonded to the first optical film and to the second optical film such that the first optical film and second optical film are physically coupled, and the coupling member is bonded to at least one of the first optical film and the second optical film non-continuously such that an optically effective air gap is provided. Also, a method for making such optical film assemblies.
    Type: Grant
    Filed: August 5, 2016
    Date of Patent: July 7, 2020
    Assignee: 3M Innovative Properties Company
    Inventors: Qingbing Wang, Encai Hao, Tri D. Pham, Daniel J. Theis, Matthew S. Stay
  • Publication number: 20200150789
    Abstract: A display film includes a transparent energy dissipation layer having a glass transition temperature of 27 degrees Celsius or less and a Tan Delta peak value of 0.5 or greater, and a transparent conductor layer disposed on the transparent energy dissipation layer. The conductive display films including transparent conductors and a flexible substrate that can protect a display window and survive folding tests intact while maintaining the desired electric conductive properties.
    Type: Application
    Filed: July 19, 2018
    Publication date: May 14, 2020
    Inventors: Joseph W. WOODY, V, David Scott THOMPSON, Matthew S. STAY, Michael A. JOHNSON, Daniel J. THEIS, Ann Marie GILMAN, Shawn C. DODDS
  • Patent number: 10492305
    Abstract: A composite article includes a conductive layer on at least a portion of a flexible substrate, wherein the conductive layer has a conductive surface. A patterned layer of a low surface energy material is on a first region of the conductive surface. An overcoat layer free of conductive particulates is on a first portion of a second region of the conductive surface unoccupied by the patterned layer. A via is in a second portion of the second region of the conductive surface between an edge of the patterned layer of the low surface energy material and the overcoat layer. A conductive material is in the via to provide an electrical connection to the conductive surface.
    Type: Grant
    Filed: June 23, 2016
    Date of Patent: November 26, 2019
    Assignee: 3M INNOVATIVE PROPERTIES COMPANY
    Inventors: Matthew S. Stay, Shawn C. Dodds, Ann M. Gilman, Mikhail L. Pekurovsky, Daniel J. Theis, Matthew R. D. Smith
  • Publication number: 20190322906
    Abstract: Methods of passivating an adhesive via printing an ink onto a release liner, and adhesive articles or products made by the same are provided. An ink pattern is printed onto a release liner to form a pattern of features. The features are at least partially embedded in an adhesive layer such that when the release liner is peeled from the adhesive layer, the passivation features remain with the layer of adhesive to form selected areas having adjusted adhesive functionality. Articles including the passivated adhesive on a release liner are also disclosed.
    Type: Application
    Filed: November 29, 2017
    Publication date: October 24, 2019
    Inventors: Matthew R.D. Smith, Matthew S. Stay, Mikhail L. Pekurovsky, Daniel J. Theis, Thomas J. Metzler, Shawn C. Dodds
  • Publication number: 20190273061
    Abstract: Processes for automatic registration between a solid circuit die and electrically conductive interconnects, and articles or devices made by the same are provided. The solid circuit die is disposed on a substrate with contact pads aligned with channels on the substrate. Electrically conductive traces are formed by flowing a conductive liquid in the channels toward the contact pads to obtain the automatic registration.
    Type: Application
    Filed: November 16, 2017
    Publication date: September 5, 2019
    Inventors: Ankit Mahajan, Mikhail L. Pekurovsky, Matthew S. Stay, Daniel J. Theis, Ann M. Gillman, Shawn C. Dodds, Thomas J. Metzler, Matthew R.D. Smith, Roger W. Barton, Joseph E. Hernandez, Saagar A. Shah, Kara A. Meyers, James Zhu, Teresa M. Goeddel, Lyudmila A. Pekurovsky, Jonathan W. Kemling, Jeremy K. Larsen, Jessica Chiu, Kayla C. Niccum
  • Patent number: 10362685
    Abstract: A method for making an electronic assembly includes applying a protective layer including an organosulfur compound to at least a portion of a patterned conductive interconnect circuit, wherein the conductive interconnect circuit overlies at least a portion of a conductive layer on a substrate, and wherein the conductive layer includes nanowires; and engaging an electrical contact of an electronic component with the protective layer to electrically connect the electronic component and the patterned conductive layer.
    Type: Grant
    Filed: September 22, 2014
    Date of Patent: July 23, 2019
    Assignee: 3M INNOVATIVE PROPERTIES COMPANY
    Inventors: Ann M. Gilman, Mikhail L. Pekurovsky, Matthew S. Stay, Shawn C. Dodds, Daniel J. Theis