Patents by Inventor Daniel JACKLINSKI

Daniel JACKLINSKI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Board level shield including an integrated heat sink
    Patent number: 10172265
    Abstract: A shielding assembly is disclosed, the assembly including at least a board level shield and a heat sink. The assembly may include a board level shield that includes both a lid and a fence, and may also include a thermal interface material, where the assembly may be mounted on a printed circuit board to provide both EMI shielding and thermal management of heat-generating electronic components or heat sources on the circuit board. The heat sink includes at least one pin, and the shield includes at least one complementary perforation relative to the pin, such that an assembled device of the disclosure provides both EMI shielding and thermal management while permitting the transfer of thermal energy via the heat sink pin through the board level shield perforation.
    Type: Grant
    Filed: April 6, 2018
    Date of Patent: January 1, 2019
    Assignee: LAIRD TECHNOLOGIES, INC.
    Inventors: Timothy M. Wrona, Gerald R. English, Daniel Jacklinski
  • Board Level Shield Including An Integrated Heat Sink
    Publication number: 20180228065
    Abstract: A shielding assembly is disclosed, the assembly including at least a board level shield and a heat sink. The assembly may include a board level shield that includes both a lid and a fence, and may also include a thermal interface material, where the assembly may be mounted on a printed circuit board to provide both EMI shielding and thermal management of heat-generating electronic components or heat sources on the circuit board. The heat sink includes at least one pin, and the shield includes at least one complementary perforation relative to the pin, such that an assembled device of the disclosure provides both EMI shielding and thermal management while permitting the transfer of thermal energy via the heat sink pin through the board level shield perforation.
    Type: Application
    Filed: April 6, 2018
    Publication date: August 9, 2018
    Inventors: Timothy M. WRONA, Gerald R. ENGLISH, Daniel JACKLINSKI