Patents by Inventor Daniel James Buschel

Daniel James Buschel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Device for thermal management of surface mount devices during reflow soldering
    Patent number: 9296056
    Abstract: An apparatus includes a top plate sized to cover components for a PCB in a solder operation to attach the components to a top surface of the PCB. The apparatus may include heat shielding devices and/or heat attracting devices. Each heat shielding device reduces heat transfer to a component to be soldered to the PCB and is positioned in the top plate to decrease heat to the component corresponding to the heat shielding device. Each heat attracting device increases heat transfer to a component to be soldered to the PCB and each heat attracting device is positioned in the top plate to increase heat to the component under the heat attracting device. The top plate is coupled to the heat shielding and/or heat attracting devices and includes a recess for each component configured with a heat shielding device or a heat attracting device.
    Type: Grant
    Filed: July 8, 2014
    Date of Patent: March 29, 2016
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Daniel James Buschel, Michael J Fisher, James Edward Tersigni
  • DEVICE FOR THERMAL MANAGEMENT OF SURFACE MOUNT DEVICES DURING REFLOW SOLDERING
    Publication number: 20160008904
    Abstract: An apparatus includes a top plate sized to cover components for a PCB in a solder operation to attach the components to a top surface of the PCB. The apparatus may include heat shielding devices and/or heat attracting devices. Each heat shielding device reduces heat transfer to a component to be soldered to the PCB and is positioned in the top plate to decrease heat to the component corresponding to the heat shielding device. Each heat attracting device increases heat transfer to a component to be soldered to the PCB and each heat attracting device is positioned in the top plate to increase heat to the component under the heat attracting device. The top plate is coupled to the heat shielding and/or heat attracting devices and includes a recess for each component configured with a heat shielding device or a heat attracting device.
    Type: Application
    Filed: July 8, 2014
    Publication date: January 14, 2016
    Inventors: Daniel James Buschel, Michael J. Fisher, James Edward Tersigni