Patents by Inventor Daniel James Namishia

Daniel James Namishia has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Devices with crack stops
    Patent number: 8877611
    Abstract: An apparatus that comprises a device on a substrate and a crack stop in the substrate. Methods of forming a device are also disclosed. The methods may include providing a device, such as a semiconductor device, on a substrate having a first thickness, reducing the thickness of the substrate to a second thickness, and providing a crack stop in the substrate. Reducing the thickness of the substrate may include mounting the substrate to a carrier substrate for support and then removing the carrier substrate. The crack stop may prevent a crack from reaching the device.
    Type: Grant
    Filed: December 14, 2012
    Date of Patent: November 4, 2014
    Assignee: Cree, Inc.
    Inventors: Van Allen Mieczkowski, Daniel James Namishia
  • Devices with crack stops
    Patent number: 8357996
    Abstract: An apparatus that comprises a device on a substrate and a crack stop in the substrate. Methods of forming a device are also disclosed. The methods may include providing a device, such as a semiconductor device, on a substrate having a first thickness, reducing the thickness of the substrate to a second thickness, and providing a crack stop in the substrate. Reducing the thickness of the substrate may include mounting the substrate to a carrier substrate for support and then removing the carrier substrate. The crack stop may prevent a crack from reaching the device.
    Type: Grant
    Filed: November 17, 2009
    Date of Patent: January 22, 2013
    Assignee: Cree, Inc.
    Inventors: Van Allen Mieczkowski, Daniel James Namishia
  • DEVICES WITH CRACK STOPS
    Publication number: 20110115058
    Abstract: An apparatus that comprises a device on a substrate and a crack stop in the substrate. Methods of forming a device are also disclosed. The methods may include providing a device, such as a semiconductor device, on a substrate having a first thickness, reducing the thickness of the substrate to a second thickness, and providing a crack stop in the substrate. Reducing the thickness of the substrate may include mounting the substrate to a carrier substrate for support and then removing the carrier substrate. The crack stop may prevent a crack from reaching the device.
    Type: Application
    Filed: November 17, 2009
    Publication date: May 19, 2011
    Inventors: Van Allen Mieczkowski, Daniel James Namishia