Patents by Inventor Daniel John Dravis

Daniel John Dravis has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Cooling approach for high power integrated circuits mounted on printed circuit boards
    Patent number: 5768104
    Abstract: A method and apparatus for cooling high power integrated circuits mounted on a printed circuit board. The invention includes producing a cold plate adapted to receive the printed circuit board thereon. A series of thermal shims are produced in incremental varying thicknesses from a thermally conductive material. A gap between each integrated circuit and the cold plate is determined that would result when the plate and board are assembled. One of the thermal shims is selected for each gap, the thickness of each selected shim being dependent upon the gap for which it is selected. The shim is placed between the cold plate and the integrated circuit so that when the module is assembled, the gap is eliminated and a thermal conductive path between the cold plate and each circuit is created.
    Type: Grant
    Filed: February 22, 1996
    Date of Patent: June 16, 1998
    Assignee: Cray Research, Inc.
    Inventors: Richard B. Salmonson, Daniel John Dravis