Patents by Inventor Daniel John Keeble

Daniel John Keeble has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7160036
    Abstract: An optical package that includes a component for supporting a printed circuit board. The optical package comprises a housing containing a printed circuit board having a connecting edge for connecting to external components; an optical component supported by the printed circuit board; an optical connector for coupling the optical component to an optical fiber; and a support supporting the connecting edge.
    Type: Grant
    Filed: June 2, 2004
    Date of Patent: January 9, 2007
    Assignee: Avago Technologies Fiber IP (Singapore) Pte. Ltd.
    Inventors: Daniel John Keeble, Goncalo Agra Amorim, David John Kenneth Meadowcroft
  • Patent number: 6811326
    Abstract: A fibre optic transceiver in which the optical components, interface, management functionality and management interface are all integrated on a single module, capable of being plugged into and removed from the telecommunication's parent system includes a housing having disposed therein a transmitter and a receiver. The housing further includes a pair of rails disposed on opposite sides of the housing to enable the module to be plugged into a suitably configured board. The module is designed primarily for use in 10Gbit serial optical systems, but is equally applicable for use in WDM applications, as well as at other speeds and wavelength.
    Type: Grant
    Filed: January 18, 2002
    Date of Patent: November 2, 2004
    Assignee: Agilent Technologies, Inc.
    Inventors: Daniel John Keeble, Kim Leeson, Stuart Wilkinson
  • Publication number: 20030168226
    Abstract: A package for an optical assembly of a type that uses bulk optics in an optical path will require environmental protection from contaminants. It is common to construct a substantially hermetically sealed package to provide environmental protection for the optical assembly but such hermetically sealed packages are expensive to construct and are not completely reliable. Consequently, the present invention provides a package (48) for an optical assembly with the bulk optics encapsulated by a silicone encapsulant (54) and encased within an epoxy layer (50) and supported by a substrate base (52). The package (48) for the optical assembly thus provides the bulk optics with the required environmental protection from contaminants.
    Type: Application
    Filed: March 11, 2002
    Publication date: September 11, 2003
    Applicant: Agilent Technologies, Inc.
    Inventors: Andrew McGhee, Daniel John Keeble, Fabio Pozzi, Brian Lemoff
  • Patent number: 6613980
    Abstract: A package for an optical assembly of a type that uses bulk optics in an optical path will require environmental protection from contaminants. It is common to construct a substantially hermetically sealed package to provide environmental protection for the optical assembly but such hermetically sealed packages are expensive to construct and are not completely reliable. Consequently, a package is provided for an optical assembly with the bulk optics encapsulated by a silicone encapsulant and encased within an epoxy layer and supported by a substrate base. The package for the optical assembly thus provides the bulk optics with the required environmental protection from contaminants.
    Type: Grant
    Filed: March 11, 2002
    Date of Patent: September 2, 2003
    Assignee: Agilent Technologies, Inc.
    Inventors: Andrew McGhee, Daniel John Keeble, Fabio Pozzi, Brian Lemoff
  • Publication number: 20020131730
    Abstract: The present invention concerns a fibre optic transceiver in which the optical components, interface, management functionality and management interface are all integrated on a single module capable of being plugged into and removed from the telecommunication's parent system. The optical transceiver module comprises a housing having disposed therein a transmitter and a receiver. The housing further comprises a pair of rails disposed on opposite sides of the housing to enable the module to be plugged into a suitably configured board. The module is designed primarily for use in 10Gbit serial optical systems, but is equally applicable for use in WDM applications, as well as at other speeds and wavelength.
    Type: Application
    Filed: January 18, 2002
    Publication date: September 19, 2002
    Applicant: Agilent Technologies, Inc.
    Inventors: Daniel John Keeble, Kim Leeson, Stuart Wilkinson