Abstract: A terahertz module includes: a terahertz chip which includes an active device which emits a terahertz wave; and a dielectric substrate coupled to the terahertz chip. The terahertz chip includes a semiconductor substrate. The active device is disposed on an upper surface of the semiconductor substrate. A cutout is formed in a portion of a first side surface, among a plurality of side surfaces of the dielectric substrate, the cutout extending from an upper side of the first side surface to a lower side of the first side surface. The terahertz chip is fit into the cutout in such a direction that the upper surface of the semiconductor substrate is parallel to the first side surface and the semiconductor substrate is arranged in a bottom side of the cutout.

Abstract: A terahertz module includes: a terahertz chip which includes an active device which emits a terahertz wave; and a dielectric substrate coupled to the terahertz chip. The terahertz chip includes a semiconductor substrate. The active device is disposed on an upper surface of the semiconductor substrate. A cutout is formed in a portion of a first side surface, among a plurality of side surfaces of the dielectric substrate, the cutout extending from an upper side of the first side surface to a lower side of the first side surface. The terahertz chip is fit into the cutout in such a direction that the upper surface of the semiconductor substrate is parallel to the first side surface and the semiconductor substrate is arranged in a bottom side of the cutout.

Abstract: An UC dielectric waveguide of the embodiments includes: a dielectric substance wiring propagating a terahertz wave; and a medium disposed around the dielectric substance wiring and having a large refractive index difference with respect to the dielectric substance wiring. A THz circuit of the embodiments includes a dielectric substance THz circuit connected between a first and second UC dielectric waveguides. The dielectric substance THz circuit includes a circuit including a linear-shaped UC dielectric waveguide, a bent-shaped UC dielectric waveguide, and a Y-coupled branch circuit. There are included a first holding unit holding the first UC dielectric waveguide and a second holding unit holding the second UC dielectric waveguide. The THz circuit of the embodiments may include a 2×2 evanescent coupler. Provided is a THz circuit having mechanical strength obtained by applying the UC dielectric waveguide having high confinement and transmission efficiencies of THz waves with a simple structure.

Abstract: The transmission device of the present embodiment includes a waveguide unit which transmits a terahertz-wave signal, and a plurality of ports provided around the waveguide unit and each composed of a waveguide and a planar lens, the waveguide unit and the ports being integrated on a planar substrate with dielectric properties. The planar lens diffuses, in an arcuate shape, a terahertz-wave signal by a reflective index set by a staggering arrangement of first through-holes, transmits the diffused terahertz-wave signal to the waveguide unit in parallel, or focuses a terahertz-wave signal which is transmitted in parallel through the waveguide unit. A beam splitter transmits a terahertz-wave signal, which is transmitted in parallel from a first planar lens, to a second planar lens, by reflection or transmission by a refractive index set by a grid arrangement of second through-holes.