Patents by Inventor Daniel Josell

Daniel Josell has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10889908
    Abstract: Superconformally filling a recessed feature includes: contacting the recessed feature with superconformal filling composition that includes: Au(SO3)23? anions; SO32? anions; and Bi3+ cations; convectively transporting Au(SO3)23? and Bi3+ to the bottom member of the recessed feature; subjecting the recessed feature to an electrical current to superconformally deposit gold from the Au(SO3)23? on the bottom member relative to the sidewall and the field, the electrical current providing a cathodic voltage; and increasing the electrical current subjected to the field and the recessed feature to maintain the cathodic voltage between ?0.85 V and ?1.00 V relative to the SSE during superconformally depositing gold on the substrate to superconformally fill the recessed feature of the article with gold as a superconformal filling of gold, the superconformal filling being void-free and seam-free.
    Type: Grant
    Filed: July 24, 2018
    Date of Patent: January 12, 2021
    Assignee: GOVERNMENT OF THE UNITED STATES OF AMERICA, AS REPRESENTED BY THE SECRETARY OF COMMERCE
    Inventors: Daniel Josell, Thomas P. Moffat
  • Publication number: 20200301051
    Abstract: A metallic grating includes a substrate; a plurality of high aspect ratio trenches disposed in the substrate such that the high aspect ratio trenches are spaced apart from one another by a field surface of the substrate; a metallic superconformal filling formed and disposed in the high aspect ratio trenches; and a grating including a spatial arrangement of the high aspect ratio trenches that are filled with the metallic superconformal filling such that the metallic superconformal filling is void-free, and the high aspect ratio trenches are bottom-up filled with the metallic superconformal filling, wherein a height of the metallic superconformal filling is less than or equal to the height of the high aspect ratio trenches.
    Type: Application
    Filed: June 10, 2020
    Publication date: September 24, 2020
    Inventors: Daniel Josell, Thomas Polk Moffat
  • Patent number: 10508358
    Abstract: Forming a transition zone terminated superconformal filling in a recess includes: providing an electrodeposition composition including: a metal electrolyte including a plurality of metal ions, solvent, and suppressor; providing the article including: a field surface and the recess that includes a distal position and a proximate position; exposing the recess to the electrodeposition composition; potentiodynamically controlling an electric potential of the recess with a potential wave form; bifurcating the recess into an active metal deposition region and a passive region; forming a transition zone; decreasing the electric potential of the recess by the potential wave form; progressively moving the transition zone closer to the field surface and away from the distal position; and reducing the metal ions and depositing the metal in the active metal deposition region and not in the passive region to form the transition zone terminated superconformal filling in the recess of the substrate.
    Type: Grant
    Filed: April 17, 2017
    Date of Patent: December 17, 2019
    Assignee: GOVERNMENT OF THE UNITED STATES OF AMERICA, AS REPRESENTED BY THE SECRETARY OF COMMERCE
    Inventors: Daniel Josell, Thomas P. Moffat
  • Publication number: 20190284714
    Abstract: Forming a transition zone terminated superconformal filling in a recess includes: providing an electrodeposition composition including: a metal electrolyte including a plurality of metal ions, solvent, and suppressor; providing the article including: a field surface and the recess that includes a distal position and a proximate position; exposing the recess to the electrodeposition composition; potentiodynamically controlling an electric potential of the recess with a potential wave form; bifurcating the recess into an active metal deposition region and a passive region; forming a transition zone; decreasing the electric potential of the recess by the potential wave form; progressively moving the transition zone closer to the field surface and away from the distal position; and reducing the metal ions and depositing the metal in the active metal deposition region and not in the passive region to form the transition zone terminated superconformal filling in the recess of the substrate.
    Type: Application
    Filed: April 17, 2017
    Publication date: September 19, 2019
    Inventors: DANIEL JOSELL, THOMAS P. MOFFAT
  • Publication number: 20190093248
    Abstract: Superconformally filling a recessed feature includes: contacting the recessed feature with superconformal filling composition that includes: Au(SO3)23? anions; SO32? anions; and Bi3+ cations; convectively transporting Au(SO3)23? and Bi3+ to the bottom member of the recessed feature; subjecting the recessed feature to an electrical current to superconformally deposit gold from the Au(SO3)23? on the bottom member relative to the sidewall and the field, the electrical current providing a cathodic voltage; and increasing the electrical current subjected to the field and the recessed feature to maintain the cathodic voltage between ?0.85 V and ?1.00 V relative to the SSE during superconformally depositing gold on the substrate to superconformally fill the recessed feature of the article with gold as a superconformal filling of gold, the superconformal filling being void-free and seam-free.
    Type: Application
    Filed: July 24, 2018
    Publication date: March 28, 2019
    Inventors: DANIEL JOSELL, THOMAS P. MOFFAT
  • Publication number: 20180298514
    Abstract: Forming a transition zone terminated superconformal filling in a recess includes: providing an electrodeposition composition including: a metal electrolyte including a plurality of metal ions, solvent, and suppressor; providing the article including: a field surface and the recess that includes a distal position and a proximate position; exposing the recess to the electrodeposition composition; potentiodynamically controlling an electric potential of the recess with a potential wave form; bifurcating the recess into an active metal deposition region and a passive region; forming a transition zone; decreasing the electric potential of the recess by the potential wave form; progressively moving the transition zone closer to the field surface and away from the distal position; and reducing the metal ions and depositing the metal in the active metal deposition region and not in the passive region to form the transition zone terminated superconformal filling in the recess of the substrate.
    Type: Application
    Filed: April 17, 2017
    Publication date: October 18, 2018
    Inventors: DANIEL JOSELL, THOMAS P. MOFFAT
  • Publication number: 20110041899
    Abstract: A process for producing three dimensionally structured thin film photovoltaic devices with self-aligned back contacts. The photovoltaic device is constructed using electrodeposition on micrometer-scale interdigitated electrodes on an insulating substrate. During fabrication, these interdigitated electrodes serve as the active electrodes for deposition of materials including semiconductors. After fabrication, these interdigitated electrodes serve as back contacts for carrier collection when the device is in use. The process can be used to fabricate homojunction, heterojunction and multijunction photovoltaic devices.
    Type: Application
    Filed: October 30, 2009
    Publication date: February 24, 2011
    Applicant: National Institute of Standards and Technology
    Inventors: Daniel Josell, Carlos R. Beauchamp, Thomas P. Moffat
  • Patent number: 7429401
    Abstract: The process of this invention involves first adsorbing a catalyst on the surface of a specimen by immersion in a catalyst-containing solution, followed by electrolytic deposition in a second solution that need not contain catalyst. This two-step superconformal process produces a seam-free and void-free metal microelectronic conductor.
    Type: Grant
    Filed: May 23, 2003
    Date of Patent: September 30, 2008
    Assignee: The United States of America as represented by the Secretary of Commerce, the National Insitiute of Standards & Technology
    Inventors: Daniel Josell, Thomas P. Moffat, Daniel Wheeler
  • Publication number: 20040231998
    Abstract: The process of this invention involves first adsorbing a catalyst on the surface of a specimen by immersion in a catalyst-containing solution, followed by electrolytic deposition in a second solution that need not contain catalyst. This two-step superconformal process produces a seam-free and void-free metal microelectronic conductor.
    Type: Application
    Filed: May 23, 2003
    Publication date: November 25, 2004
    Inventors: Daniel Josell, Thomas P. Moffat, Daniel Wheeler