Patents by Inventor Daniel Justin Hebel

Daniel Justin Hebel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Providing access to and enabling functionality of first device based on communication with second device
    Patent number: 10306443
    Abstract: In one aspect, a device includes a processor and a memory accessible to the processor. The memory bears instructions executable by the processor to receive at least a first Bluetooth low energy (BLE) signal from a BLE beacon and enable a first function of the first device at least in part in based on receipt of the first BLE signal.
    Type: Grant
    Filed: September 1, 2015
    Date of Patent: May 28, 2019
    Assignee: Lenovo (Singapore) Pte. Ltd.
    Inventors: David Rivera, Peter Hamilton Wetsel, Philip John Jakes, Daniel Justin Hebel, Joseph Nicholas Laltrello
  • Providing access to and enabling functionality of first device based on communication with second device
    Patent number: 9351098
    Abstract: In one aspect, a device includes a processor and a memory accessible to the processor. The memory bears instructions executable by the processor to receive at least a first Bluetooth low energy (BLE) signal from a BLE beacon and enable a first function of the first device at least in part in based on receipt of the first BLE signal.
    Type: Grant
    Filed: May 19, 2014
    Date of Patent: May 24, 2016
    Assignee: Lenovo (Singapore) Pte. Ltd.
    Inventors: David Rivera, Peter Hamilton Wetsel, Philip John Jakes, Daniel Justin Hebel, Joseph Nicholas Laltrello
  • PROVIDING ACCESS TO AND ENABLING FUNCTIONALITY OF FIRST DEVICE BASED ON COMMUNICATION WITH SECOND DEVICE
    Publication number: 20150371030
    Abstract: In one aspect, a device includes a processor and a memory accessible to the processor. The memory bears instructions executable by the processor to receive at least a first Bluetooth low energy (BLE) signal from a BLE beacon and enable a first function of the first device at least in part in based on receipt of the firs BLE signal.
    Type: Application
    Filed: September 1, 2015
    Publication date: December 24, 2015
    Inventors: David Rivera, Peter Hamilton Wetsel, Philip John Jakes, Daniel Justin Hebel, Joseph Nicholas Laltrello
  • PROVIDING ACCESS TO AND ENABLING FUNCTIONALITY OF FIRST DEVICE BASED ON COMMUNICATION WITH SECOND DEVICE
    Publication number: 20150373543
    Abstract: In one aspect, a device includes a processor and a memory accessible to the processor. The memory bears instructions executable by the processor to receive at least a first Bluetooth low energy (BLE) signal from a BLE beacon and enable a first function of the first device at least in part in based on receipt of the first BLE signal.
    Type: Application
    Filed: September 1, 2015
    Publication date: December 24, 2015
    Inventors: David Rivera, Peter Hamilton Wetsel, Philip John Jakes, Daniel Justin Hebel, Joseph Nicholas Laltrello
  • PROVIDING ACCESS TO AND ENABLING FUNCTIONALITY OF FIRST DEVICE BASED ON COMMUNICATION WITH SECOND DEVICE
    Publication number: 20150334511
    Abstract: In one aspect, a device includes a processor and a memory accessible to the processor. The memory bears instructions executable by the processor to receive at least a first Bluetooth low energy (BLE) signal from a BLE beacon and enable a first function of the first device at least in part in based on receipt of the first BLE signal.
    Type: Application
    Filed: May 19, 2014
    Publication date: November 19, 2015
    Applicant: LENOVO (SINGAPORE) PTE. LTD.
    Inventors: DAVID RIVERA, PETER HAMILTON WETSEL, PHILIP JOHN JAKES, DANIEL JUSTIN HEBEL, JOSEPH NICHOLAS LALTRELLO
  • Integrated circuit chip thermal solution
    Patent number: 7903425
    Abstract: Heat from the core of a semiconductor chip package mounted on a printed circuit board assembled into a computer system is dissipated to both sides of the printed circuit board. A pair of integrated heat spreaders are disposed at opposite sides of the core, and two heat sinks are positioned at opposite sides of the package. Each of the heat sinks is positioned in thermal communication with one of the heat spreaders to dissipated heat from the core.
    Type: Grant
    Filed: June 27, 2006
    Date of Patent: March 8, 2011
    Assignee: Lenovo (Singapore) Pte. Ltd.
    Inventors: Daniel Justin Hebel, Clifford Allen Gaw, Brinda Kumar Ramaiya, James Stephen Rutledge
  • Integrated circuit chip thermal solution
    Publication number: 20070297155
    Abstract: Heat from the core of a semiconductor chip package mounted on a printed circuit board assembled into0 a computer system is dissipated to both sides of the printed circuit board.
    Type: Application
    Filed: June 27, 2006
    Publication date: December 27, 2007
    Applicant: Lenovo (Singapore) Pte. Ltd.
    Inventors: Daniel Justin Hebel, Clifford Allen Gaw, Brinda Kumar Ramaiya, James Stephen Rutledge