Patents by Inventor Daniel K. Casey

Daniel K. Casey has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • System and method for scrubbing CMP slurry systems
    Patent number: 8012266
    Abstract: A system and apparatus for cleaning particle deposits from slurry distribution system components by injecting gas bubbles into the slurry solution having a geometry and interval such that an optimal cleaning power and cleaning rate is obtained. The method provides efficient cleaning of the buildup of abrasive particles deposited from the slurry solution without requiring the operator to disassemble or flush the slurry distribution system. The system cleaning potential is optimal when the diameter of the bubbles and the fluid slug length is approximately equal to the pipe diameter.
    Type: Grant
    Filed: December 15, 2006
    Date of Patent: September 6, 2011
    Assignee: Honeywell International Inc.
    Inventors: John W. Janzen, Daniel K. Casey
  • System and method for scrubbing CMP slurry systems
    Publication number: 20080142040
    Abstract: A system and apparatus for cleaning particle deposits from slurry distribution system components by injecting gas bubbles into the slurry solution having a geometry and interval such that an optimal cleaning power and cleaning rate is obtained. The method provides efficient cleaning of the buildup of abrasive particles deposited from the slurry solution without requiring the operator to disassemble or flush the slurry distribution system. The system cleaning potential is optimal when the diameter of the bubbles and the fluid slug length is approximately equal to the pipe diameter.
    Type: Application
    Filed: December 15, 2006
    Publication date: June 19, 2008
    Applicant: Honeywell International Inc.
    Inventors: John W. Janzen, Daniel K. Casey
  • High efficiency metal lift-off process
    Patent number: 4662989
    Abstract: An improved high efficiency metal lift-off process for removing a layer of metal at least partially covering a layer of photoresist. The method comprises forming microcracks located above the layer of photoresist in the layer of metal to be removed and providing solvent to the layer of photoresist through the microcracks.
    Type: Grant
    Filed: October 4, 1985
    Date of Patent: May 5, 1987
    Assignee: Honeywell Inc.
    Inventors: Daniel K. Casey, Eddie C. Lee