Abstract: An adhesive composition is provided that includes a block copolymer present at greater than or equal to 30 total weight percent of the adhesive system comprising a high glass transition temperature in subunits Y and Y?, each of the subunits Y and Y? having a high glass transition temperature of from 70° C. to 130° C. with a low glass transition temperature subunit Z having a low glass transition temperature of from ?100° C. to 10° C. intermediate between said high glass transition temperature acrylate subunits to define a structure Y-Z-Y?. The triblock copolymer is dissolved in a monomer curable under free radical. A free radical initiator of a peroxide or a hydroperoxide are present in combination with a sulfonyl chloride, dihydropyridine and copper or vanadium salt. By heating the cured adhesive at or above 70° C., the adhesive is amenable to being removed, repaired, or reworked.

Abstract: A two-part adhesive formulation is provided that has an adhesive part A and an activator part B. The part A includes a monomer amount of a methacrylate ester monomer, a crosslinker amount of a polyfunctional monomer, an anti-oxidant, a free-radical polymerization inhibitor, and an adhesion promoter system to improve cured adhesive strength to a substrate, an impact modifier and a toughening agent and a free-radical polymerization initiator. The part B includes an impact modifier, butyl rubber, methacrylate ester monomer, and a free-radical polymerization accelerator yet varies in the weight ratio used relative to part A. Each of the part A and the part B have separate storage stability of at least 300 days at 23° C. A process of applying an adhesive to a substrate is provided that includes combining together parts A and B to form an adhesive mixture and applying the mixture to the substrate and allowed to cure.

Abstract: An adhesive composition is provided that includes a block copolymer present at greater than or equal to 30 total weight percent of the adhesive system comprising a high glass transition temperature in subunits Y and Y?, each of the subunits Y and Y? having a high glass transition temperature of from 70° C. to 130° C. with a low glass transition temperature subunit Z having a low glass transition temperature of from ?100° C. to 10° C. intermediate between said high glass transition temperature acrylate subunits to define a structure Y-Z-Y?. The triblock copolymer is dissolved in a monomer curable under free radical. A free radical initiator of a peroxide or a hydroperoxide are present in combination with a sulfonyl chloride, dihydropyridine and copper or vanadium salt. By heating the cured adhesive at or above 70° C., the adhesive is amenable to being removed, repaired, or reworked.

Abstract: A two-part adhesive formulation is provided that has an adhesive part A and an activator part B. The part A includes a monomer amount of a methacrylate ester monomer, a crosslinker amount of a polyfunctional monomer, an anti-oxidant, a free-radical polymerization inhibitor, and an adhesion promoter system to improve cured adhesive strength to a substrate, an impact modifier and a toughening agent and a free-radical polymerization initiator. The part B includes an impact modifier, butyl rubber, methacrylate ester monomer, and a free-radical polymerization accelerator yet varies in the weight ratio used relative to part A. Each of the part A and the part B have separate storage stability of at least 300 days at 23° C. A process of applying an adhesive to a substrate is provided that includes combining together parts A and B to form an adhesive mixture and applying the mixture to the substrate and allowed to cure.

Abstract: Adhesive formulations having acrylate monomer or methacrylate monomer, or mixtures thereof, and having a reducing agent and an initiator (e.g., peroxide). The formulations may include a chelating agent solution to improve storage stability and other properties. Further, the mole ratio of the initiator to the reducing agent may be adjusted to control weight loss of the adhesives during cure. Polyvinyl acetate or its derivatives may also be employed in the adhesive formulations to reduce weight loss during cure. Moreover, certain embodiments of the formulations include a toughening-agent copolymer having a glass transition temperature (of at least one domain) that is lower than ?50° C. (?58° F.). These toughening-agent copolymers may be added to the adhesive formulations to improve impact strength and other properties of the cured adhesives at lower temperatures, e.g., ?40° C. (?40° F.), while maintaining performance of the cured adhesives at higher temperatures, e.g., 82° C. (180° F.).

Abstract: An adhesive formulation including an acrylate monomer and/or a methacrylate monomer, a chlorosulfonated polymer resin, and a reducing agent. The adhesive also includes a cycloheteroatom zirconate or a cycloheteroatom titannate, which is utilized as a cure profile regulator. Further, the adhesive includes toughening-agent copolymers having a very low Tg to increase impact strength of the cured adhesives at low temperatures.

Abstract: An adhesive formulation including an acrylate monomer and/or a methacrylate monomer, a chlorosulfonated polymer resin, and a reducing agent. The adhesive also includes a cycloheteroatom zirconate or a cycloheteroatom titannate, which is utilized as a cure profile regulator. Further, the adhesive includes toughening-agent copolymers having a very low Tg to increase impact strength of the cured adhesives at low temperatures.

Abstract: An adhesive formulation including an acrylate monomer and/or a methacrylate monomer, a chlorosulfonated polymer resin, and a reducing agent. The adhesive also includes a cycloheteroatom zirconate or a cycloheteroatom titannate, which is utilized as a cure profile regulator. Further, the adhesive includes toughening-agent copolymers having a very low Tg to increase impact strength of the cured adhesives at low temperatures.