Abstract: Described herein are compounds, such as compounds represented by Formula I-R: and pharmaceutically acceptable salts, enantiomers, stereoisomers, and tautomers thereof, that are inhibitors of GCN2 kinase or PERK kinase, and methods of treating diseases, including diseases associated with GCN2 kinase or PERK kinase, with said compounds.

Abstract: A brooder system includes a stock tank having opposed sides, a pair of attachment members each having a first portion secured to one of to the opposed sides of the stock tank and a second portion having a vertically-extending passage, a cross member having first and second end portions downwardly extending into the vertically-extending passages of the attachment members so that the cross member extends over the stock tank, and a heat lamp secured to the cross member over the stock tank. The cross member can be slidable within the vertically-extending passages to adjust a height of the heat lamp over the stock tank. The cross member can be flexible and elongate to bend to form an arch over the stock tank.

Abstract: An electronics package includes an electrically conducting support layer; at least one electrically conducting outer layer; at least two power electronics components arranged on different sides of the support layer and electrically interconnected with the support layer and with the at least one outer layer; and isolation material, in which the support layer and the at least two power electronics components are embedded, the support layer and the at least one outer layer are laminated together with the isolation material; and a cooling channel for conducting a cooling fluid through the electronics package, the cooling channel runs between the at least two power electronics components through the support layer.

Abstract: A pressure plate for a friction coupling such as a clutch or brake system includes one or more pockets with a phase change material disposed therein. The phase change material operates to absorb and release heat when the friction coupling cycles between activation and deactivation so as to minimize a maximum temperature of the pressure plate.

Abstract: A power electronics module comprises a first liquid cooler comprising a cooling channel for receiving a cooling liquid, wherein the first liquid cooler comprises a metal body providing a first terminal of the power electronics module; a second liquid cooler comprising a cooling channel for receiving a cooling liquid, wherein the second liquid cooler comprises a metal body providing a second terminal of the power electronics module; a plurality of semiconductor chips arranged between the first liquid cooler and the second liquid cooler, such that a first electrode of each semiconductor chip is bonded to the first liquid cooler, such that the first electrode is in electrical contact with the first liquid cooler, and an opposite second electrode of each semiconductor chip is in electrical contact with the second liquid cooler; and an insulating encapsulation, formed by molding the first liquid cooler, the second liquid cooler and the plurality of semiconductor chips into an insulation material, such that the fir

Abstract: The present invention relates to a power semiconductor module, comprising at least two power semiconductor devices, wherein the at least two power semiconductor devices comprise at least one power semiconductor transistor and at least one power semiconductor diode, wherein at least a first substrate is provided for carrying the power semiconductor transistor in a first plane, the first plane lying parallel to the plane of the substrate, wherein the power semiconductor diode is provided in a second plane, wherein the first plane is positioned between the substrate and the second plane in a direction normal to the first plane and wherein the first plane is spaced apart from the second plane in a direction normal to the first plane.

Abstract: An electronics package includes an electrically conducting support layer; at least one electrically conducting outer layer; at least two power electronics components arranged on different sides of the support layer and electrically interconnected with the support layer and with the at least one outer layer; and isolation material, in which the support layer and the at least two power electronics components are embedded, the support layer and the at least one outer layer are laminated together with the isolation material; and a cooling channel for conducting a cooling fluid through the electronics package, the cooling channel runs between the at least two power electronics components through the support layer.

Abstract: The present invention relates to a power semiconductor module, comprising at least two power semiconductor devices, wherein the at least two power semiconductor devices comprise at least one power semiconductor transistor and at least one power semiconductor diode, wherein at least a first substrate is provided for carrying the power semiconductor transistor in a first plane, the first plane lying parallel to the plane of the substrate, wherein the power semiconductor diode is provided in a second plane, wherein the first plane is positioned between the substrate and the second plane in a direction normal to the first plane and wherein the first plane is spaced apart from the second plane in a direction normal to the first plane.

Abstract: A power electronics module comprises a first liquid cooler comprising a cooling channel for receiving a cooling liquid, wherein the first liquid cooler comprises a metal body providing a first terminal of the power electronics module; a second liquid cooler comprising a cooling channel for receiving a cooling liquid, wherein the second liquid cooler comprises a metal body providing a second terminal of the power electronics module; a plurality of semiconductor chips arranged between the first liquid cooler and the second liquid cooler, such that a first electrode of each semiconductor chip is bonded to the first liquid cooler, such that the first electrode is in electrical contact with the first liquid cooler, and an opposite second electrode of each semiconductor chip is in electrical contact with the second liquid cooler; and an insulating encapsulation, formed by molding the first liquid cooler, the second liquid cooler and the plurality of semiconductor chips into an insulation material, such that the fir

Abstract: A pressure plate for a friction coupling such as a clutch or brake system is disclosed in the present application. The pressure plate includes one or more pockets with a phase change material disposed therein. The phase change material operates to absorb and release heat when the friction coupling cycles between activation and deactivation so as to minimize a maximum temperature of the pressure plate.

Abstract: The present disclosure relates to a power semiconductor module comprising a printed circuit board (PCB), and to method of cooling such a power semiconductor module. The module comprises a power semiconductor device and an island of thermally conducting foam embedded into the printed circuit board. The power semiconductor device and the island of thermally conducting foam are positioned on top of each other, and the island is arranged to form a path for a flowing coolant cooling the power semiconductor device.

Abstract: An electronic device including a sealed enclosure, the electronic components arranged inside the sealed enclosure and including high-loss high-temperature components, a main heat sink including ribs, wherein the high-loss high-temperature components are attached to the main heat sink and the ribs of the main heat sink are arranged outside the enclosure, a cavity formed inside the enclosure and divided into a plurality of channel-like sections, the channel-like sections configured for providing air flow guidance inside the enclosure and being interconnected at their ends, wherein at least one channel-like section contains the electronic components and at least one other channel-like section contains an air-to-air heat exchanger extending from inside the sealed enclosure to outside of the sealed enclosure, wherein the electronic components inside the at least one channel like section are adapted to be cooled by air flow inside the sealed enclosure.

Abstract: The present disclosure relates to a power semiconductor module comprising a printed circuit board (PCB), and to method of cooling such a power semiconductor module. The module comprises a power semiconductor device and an island of thermally conducting foam embedded into the printed circuit board. The power semiconductor device and the island of thermally conducting foam are positioned on top of each other, and the island is arranged to form a path for a flowing coolant cooling the power semiconductor device.

Abstract: An electronic device including a sealed enclosure, the electronic components arranged inside the sealed enclosure and including high-loss high-temperature components, a main heat sink including ribs, wherein the high-loss high-temperature components are attached to the main heat sink and the ribs of the main heat sink are arranged outside the enclosure, a cavity formed inside the enclosure and divided into a plurality of channel-like sections, the channel-like sections configured for providing air flow guidance inside the enclosure and being interconnected at their ends, wherein at least one channel-like section contains the electronic components and at least one other channel-like section contains an air-to-air heat exchanger extending from inside the sealed enclosure to outside of the sealed enclosure, wherein the electronic components inside the at least one channel like section are adapted to be cooled by air flow inside the sealed enclosure.

Abstract: The object of the present invention is to provide an extended playing surface for paddle/racquet-based games, in particular table tennis. A playing surface is provided comprising four curved rebounding surfaces each with a vertical rebounding side wall configured so that two curved surfaces attach or extend on each side of a substantially horizontal playing surface thereby forming a continuous rebounding playing surface. A net is positioned perpendicular to the length of the horizontal playing surface at its mid point, allowing two or more opposing players to use the curved, vertical sidewall and horizontal surfaces as rebounding surfaces to serve, return and rally a spherical target object over the net.

Abstract: The object of the present invention is to provide an extended playing surface for paddle/racquet-based games, in particular table tennis. A playing surface is provided comprising four curved rebounding surfaces each with a vertical rebounding side wall configured so that two curved surfaces attach or extend on each side of a substantially horizontal playing surface thereby forming a continuous rebounding playing surface. A net is positioned perpendicular to the length of the horizontal playing surface at its mid point, allowing two or more opposing players to use the curved, vertical sidewall and horizontal surfaces as rebounding surfaces to serve, return and rally a spherical target object over the net.

Abstract: Systems and Methods of cooling heat generating electronics components are provided employing vapor compression refrigeration. In one embodiment, the vapor compression refrigeration system includes a condenser, at least one expansion structure, at least one evaporator, and a compressor coupled in fluid communication to define a refrigerant flow path, and allow the flow of refrigerant therethrough. The at least one evaporator is coupled to the at least one heat generating electronics component to facilitate removal of heat produced by the electronics component. At least a portion of the at least one expansion structure is coated with a polytetrafluorethylene in the refrigerant flow path for inhibiting accumulation of material thereon. The polytetrafluorethylene coating has a thickness sufficient to inhibit accumulation of material in a pressure drop area of the expansion structure without significantly changing a pressure drop characteristic of the pressure drop area.

Abstract: A liquid level sensor comprising a thermistor probe and a power source connected to the thermistor probe to heat the thermistor probe. A cover encases the thermistor probe and includes openings allowing liquid to enter and exit an interior of the cover and contact the thermistor probe. A detector detects a liquid level in response to a voltage at the thermistor probe.

Abstract: A method of controlling a system is provided in which a control-data table is employed for facilitating operation of the system, and an inject-fault-data table is selectively used during testing of the system. Pursuant to the method, a security mechanism is provided to restrict the system's utilization of the inject-fault-data table. A security check by the security mechanism is to be satisfied for the system to access the inject-fault-data table. In an enhanced embodiment, the system is tested by substituting an inject-fault-data entry of the inject-fault-data table for a control-data entry of the control-data table as an input to the system. The testing verifies the response of the system to an emulated fault, which results from employing at least one inject-fault-data entry during testing of the system.

Abstract: A method and system of cooling hardware, sensing hardware, and supporting code streams that enables a non-redundant liquid cooling system to be used seemlessly in conjunction with an air cooling backup solution. The result offers system speed and reliability benefits of liquid cooling except for the brief occasions when the primary cooling system has failed and air cooling takes over. Until the liquid cooling is repaired, system clocks are automatically slowed to be compatible with the circuit speeds possible at the higher temperatures associated with air cooling. When the liquid cooling is repaired, the system clocks are automatically returned to their normal fast state. Depending on the circuit technology used, a supplied voltage may be varied while being air cooled.