Abstract: Various aspects relate to three-dimensional integrated circuits including a plurality of conformal integrated circuit slices stacked one upon the other. The plurality of conformal integrated circuit slices includes various components. A communication face defines a communication surface configured to conform to a portion of a topography of a non-planar host substrate. A plurality of input-output devices is configured to communicate to a corresponding plurality of host-side input-output devices associated with the non-planar host substrate.

Abstract: Systems, methods, and apparatuses for direct memory access instruction set architecture support for flexible dense compute using a reconfigurable spatial array are described.

Abstract: An IC package may include a stack of microelectronic units capable of horizontal and vertical optical communications. A microelectronic unit includes one or more power delivery pillars, two light source layers, an optical interconnect layer between the light source layers, and one or more IC devices arranged on the optical interconnect layer. A light source layer includes micro-LEDs that emit light used for generating optical signals. The optical interconnect layer includes one or more optical interconnects that enable horizontal optical communication, e.g., transmission of optical signals between the IC devices. A light source layer in the microelectronic unit can facilitate optical communications with another microelectronic unit that is below or above the microelectronic unit. A channel may exist above or below the light source layer to promote dissipation of heat generated by the IC devices. Light from the light source layer may pass through the channel for vertical optical communication.

Abstract: Embodiments herein relate to systems, apparatuses, or processes for improving off-package edge bandwidth by overlapping electrical and optical serialization/deserialization (SERDES) interfaces on an edge of the package. In other implementations, off-package bandwidth for a particular edge of a package may use both an optical fanout and an electrical fanout on the same edge of the package. In embodiments, the optical fanout may use a top surface or side edge of a die and the electrical fanout may use the bottom side edge of the die. Other embodiments may be described and/or claimed.

Abstract: Systems, methods, and apparatuses for direct memory access instruction set architecture support for flexible dense compute using a reconfigurable spatial array are described.

Abstract: Embodiments herein relate to systems, apparatuses, or processes for improving off-package edge bandwidth by overlapping electrical and optical serialization/deserialization (SERDES) interfaces on an edge of the package. In other implementations, off-package bandwidth for a particular edge of a package may use both an optical fanout and an electrical fanout on the same edge of the package. In embodiments, the optical fanout may use a top surface or side edge of a die and the electrical fanout may use the bottom side edge of the die. Other embodiments may be described and/or claimed.

Abstract: Some embodiments of the invention provide a training sequence that may be used in a deskewing process or a protocol to be implemented in a training sequence deskew. Embodiments may also comprise a training pattern that allows for header or frame alignment.

Abstract: In some embodiments an apparatus and method may comprise a plurality of lanes between two clock domains, each lane comprising circuitry to generate a first signal when the lane may lose cycle coherency with other of the plurality of lanes, generate a second signal to signify a lane has been delayed, and a control circuit coupled with the plurality of lanes to add latency only to lanes that did not generate a second signal if the control circuit detects a first signal from any of the plurality of lanes.

Abstract: In some embodiments an apparatus may comprise a data circuit, a clock circuit to synchronize the data circuit; and a sampling circuit to sample a clock signal from a separate clock domain, the sampling circuit may control the clock circuit in response to the sampled clock signal and to delay the data circuit from providing data if it would result in data corruption due to clock misalignment.

Abstract: Some embodiments of the invention provide a training sequence that may be used in a deskewing process or a protocol to be implemented in a training sequence deskew. Embodiments may also comprise a training pattern that allows for header or frame alignment.

Abstract: An apparatus for and method of modifying an IC design layout of an integrated circuit, comprising: accessing an initial IC design layout, with the initial layout including a plurality of MOSFET devices having a common substrate; and removing a plurality of body contacts of the MOSFET devices to create a first modified IC design layout.