Patents by Inventor Daniel Kosecki

Daniel Kosecki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11980963
    Abstract: An ultrasonic welding device includes a sonotrode, an anvil, a touching element, a lateral slide, a stop element and a receiving chamber in which joining partners are received and which is defined by bordering components of the ultrasonic welding device. The receiving chamber is defined on a first side by the sonotrode and on a second side by the anvil. The receiving chamber is further defined on a third side by the touching element and on a fourth side by the lateral slide. The receiving chamber is further defined on a fifth side, extending transverse to the first to fourth sides, by the stop element. The first stop element is electrically conductive on its surface directed toward the receiving chamber in order to form a first electrode.
    Type: Grant
    Filed: November 5, 2019
    Date of Patent: May 14, 2024
    Assignee: SCHUNK SONOSYSTEMS GMBH
    Inventors: Frank Gassert, Stefan Müller, Rainer Wagenbach, Waldemar Werner, Daniel Günther, Dariusz Kosecki, Stephan Becker, Eugen Koch
  • Publication number: 20240100621
    Abstract: An ultrasonic welding device includes a sonotrode with a sonotrode surface, a lateral slide with a lateral slide surface, a touching element with a touching surface and an insertion chamber for inserting joining parts. The insertion chamber is defined in a first axial direction (y) on a first side by the sonotrode surface and in a second axial direction (x) on a second side by the lateral slide surface and on a third side opposing the second side by the touching surface. Furthermore, the ultrasonic welding device includes a first receiving element with a first stop edge and a second receiving element with a second stop edge. The first receiving element and the second receiving element are arranged to be movable in relation to each other between a starting position and an end position.
    Type: Application
    Filed: November 5, 2019
    Publication date: March 28, 2024
    Applicant: SCHUNK SONOSYSTEMS GMBH
    Inventors: Manuel FEY, Stefan MÜLLER, Rainer WAGENBACH, Waldemar WERNER, Daniel GÜNTHER, Dariusz KOSECKI, Stephan BECKER, Eugen KOCH
  • Publication number: 20240091874
    Abstract: An ultrasonic welding device includes a sonotrode, an anvil, a touching element, a lateral slide, a stop element and a receiving chamber in which joining partners are received and which is defined by bordering components of the ultrasonic welding device. The receiving chamber is defined on a first side by the sonotrode and on a second side by the anvil. The receiving chamber is further defined on a third side by the touching element and on a fourth side by the lateral slide. The receiving chamber is further defined on a fifth side, extending transverse to the first to fourth sides, by the stop element. The first stop element is electrically conductive on its surface directed toward the receiving chamber in order to form a first electrode.
    Type: Application
    Filed: November 5, 2019
    Publication date: March 21, 2024
    Applicant: SCHUNK SONOSYSTEMS GMBH
    Inventors: Frank GASSERT, Stefan MÜLLER, Rainer WAGENBACH, Waldemar WERNER, Daniel GÜNTHER, Dariusz KOSECKI, Stephan BECKER, Eugen KOCH
  • Patent number: 10768206
    Abstract: A method is provided for using a loop-back test device to verify continuity between loop-back probes electrically connected to each other on a probe card, the loop-back test device including a first conductive region electrically connected to a substrate, a second conductive region electrically isolated from the substrate, the second conductive region spaced apart from the first conductive region such that when a first loop-back probe contacts the first conductive region a second loop-back probe contacts the second conductive region, The method includes placing the first loop-back probe in electrical contact with the first conductive region, and placing the second loop-back probe in electrical contact with the second conductive region. Continuity between the substrate and the second conductive region is then measured.
    Type: Grant
    Filed: June 21, 2016
    Date of Patent: September 8, 2020
    Assignee: Integrated Technology Corporation
    Inventors: Rodney E. Schwartz, John K. Geist, Daniel Kosecki