Abstract: A system comprising a first layer comprising one or more metal sub-layers and a protective overcoat (PO) layer adjacent to the first layer. The PO layer is adapted to protect the first layer, and a circuit logic is at least partially embedded within the PO layer. The circuit logic couples to one of the metal sub-layers.

Abstract: The present invention relates to a method and apparatus that prevents/minimizes cracking in the ceramic body of processors. The ability to prevent/minimize cracking can ensure successful operation and substantially increase processor lifetime. The present invention discloses a device for maintaining a microprocessor in a desired relationship with a printed wiring board while limiting the transmission of shock and vibrational motion to and from the processor includes a printed wiring board, a processor, and a dynamic isolating mount compressed between the printed wiring board and the processor, wherein the processor maintains the dynamic isolating mount in a compressed state such that the dynamic isolating mount bears on the printed wiring board.

Abstract: A self-locking interposer restraint mechanism is disclosed. Rather than using screws to compress springs, clips are pushed down over the posts to compress the springs. Once the clips are pushed down to a level at which the springs are sufficiently compressed, the clips engage stops fabricated into the posts thereby locking the restraint mechanism.

Abstract: The present invention relates to a method and apparatus that prevents/minimizes cracking in the ceramic body of processors. The ability to prevent/minimize cracking can ensure successful operation and substantially increase processor lifetime. The present invention discloses a device for maintaining a microprocessor in a desired relationship with a printed wiring board while limiting the transmission of shock and vibrational motion to and from the processor includes a printed wiring board, a processor, and a dynamic isolating mount compressed between the printed wiring board and the processor, wherein the processor maintains the dynamic isolating mount in a compressed state such that the dynamic isolating mount bears on the printed wiring board.

Abstract: The present invention relates to a method and apparatus that prevents/minimizes cracking in the ceramic body of processors. The ability to prevent/minimize cracking can ensure successful operation and substantially increase processor lifetime. The present invention discloses a device for maintaining a microprocessor in a desired relationship with a printed wiring board while limiting the transmission of shock and vibrational motion to and from the processor includes a printed wiring board, a processor, and a dynamic isolating mount compressed between the printed wiring board and the processor, wherein the processor maintains the dynamic isolating mount in a compressed state such that the dynamic isolating mount bears on the printed wiring board.

Abstract: A self-locking interposer restraint mechanism is disclosed. Rather than using screws to compress springs, clips are pushed down over the posts to compress the springs. Once the clips are pushed down to a level at which the springs are sufficiently compressed, the clips engage stops fabricated into the posts thereby locking the restraint mechanism.

Abstract: The present invention relates to a method and apparatus that prevents/minimizes cracking in the ceramic body of processors. The ability to prevent/minimize cracking can ensure successful operation and substantially increase processor lifetime. The present invention discloses a device for maintaining a microprocessor in a desired relationship with a printed wiring board while limiting the transmission of shock and vibrational motion to and from the processor includes a printed wiring board, a processor, and a dynamic isolating mount compressed between the printed wiring board and the processor, wherein the processor maintains the dynamic isolating mount in a compressed state such that the dynamic isolating mount bears on the printed wiring board.

Abstract: A electrostatic adhesion tester for thin film conductors. In one embodiment, a device is provided for testing the adhesion strength of a thin film conductor that has been formed upon a substrate. The device includes an adhesion tester that is primarily comprised of a conducting portion. The conducting portion is applied to the thin film conductor so that it does not physically contact the thin film conductor, but leaves a small space there between. A power supply may further be provided for coupling to either the adhesion tester, the thin film conductor, or both in order to create a potential difference between the conducting portion and the thin film conductor. The potential difference creates an electric field between the conducting portion and the thin film conductor that induces stress in the thin film conductor.

Abstract: A removal tool for removing strip electrical connectors held in place by friction contact with electrical interconnection ends associated therewith is described. A pair of spaced apart wall members have inclined plane members associated therewith for engaging the undersurface of the connector to be removed for forcing the connector away from the support surface for sequentially disengaging the electrical interconnecting pins as the removal tool is moved axially along the longitudinal length of the connector.