Patents by Inventor Daniel L. Gerlach

Daniel L. Gerlach has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8981864
    Abstract: Multi-layer in integrated transmission line circuits are provided having improved signal loss characteristics. A multi-layer integrated transmission line circuit, such as a stripline circuit or a microstrip circuit, comprises at least one reference layer; at least one conducting layer having one or more conducting strips, wherein the at least one conducting layer is separated from the at least one reference layer by a substrate; and at least one additional layer positioned between the at least one conducting layer and the at least one reference layer. The multi-layer integrated transmission line circuit may also comprise a dielectric insulating material, such as an organic material or a ceramic material. The additional layers increase a dielectric thickness of the multi-layer integrated transmission line circuit to reduce dielectric losses.
    Type: Grant
    Filed: April 30, 2012
    Date of Patent: March 17, 2015
    Assignee: LSI Corporation
    Inventors: Daniel L. Gerlach, Ashley Rebelo
  • Publication number: 20130285769
    Abstract: Multi-layer in integrated transmission line circuits are provided having improved signal loss characteristics. A multi-layer integrated transmission line circuit, such as a stripline circuit or a microstrip circuit, comprises at least one reference layer; at least one conducting layer having one or more conducting strips, wherein the at least one conducting layer is separated from the at least one reference layer by a substrate; and at least one additional layer positioned between the at least one conducting layer and the at least one reference layer. The multi-layer integrated transmission line circuit may also comprise a dielectric insulating material, such as an organic material or a ceramic material. The additional layers increase a dielectric thickness of the multi-layer integrated transmission line circuit to reduce dielectric losses.
    Type: Application
    Filed: April 30, 2012
    Publication date: October 31, 2013
    Applicant: LSI CORPORATION
    Inventors: Daniel L. Gerlach, Ashley Rebelo
  • Patent number: 5768699
    Abstract: A feed forward amplifier circuit which includes a main amplifier, an error correction circuit producing a message error signal, an error amplifier for producing an amplified message error signal that is then subtracted from the amplified and distorted message signal output of the main amplifier prior to a final output circuit, a negative feedback circuit coupled to the final output circuit responsive to a test signal for compensating and minimizing drift in the operation of the error amplifier, and circuitry associated with the negative feedback circuit for detuning performance of the error correction circuit at the test frequency so as to improve the overall circuit performance across a desired operating frequency band while diminishing its performance at the test signal frequency.
    Type: Grant
    Filed: October 20, 1995
    Date of Patent: June 16, 1998
    Assignee: AML Communications, Inc.
    Inventors: Scott T. Behan, Daniel L. Gerlach, Benoni Achiriloaie