Abstract: A process and apparatus is provided whereby metal is deposited onto articles such as plastics, ceramics and the like for producing printed circuit boards, metal plated ceramics, shielded articles and other plated articles, as part of a generally or substantially continuous process. Prior to plating, also as part of a continuous process while the boards are being generally continuously and horizontally conveyed in horizontal orientation, they are prepared to accept copper on their non-metallic portions, by application of a chemical reducing solution thereto, preferably after previously having been provided with a chemical activation solution thereto. Then the boards are transferred to a vertical orientation and conveyed in vertical orientation through an electroless copper deposition bath, at a reduced rate of travel, during with a copper solution adheres to the thus treated non-metallic portions of the boards, and to the metallic portions of the boards as well.

Abstract: An electroplating apparatus and method is provided, whereby generally flat workpieces, such as metal plates and the like may be electroplated, on a continuous basis, automatically and without manual intervention. The workpieces are delivered horizontally through a bath of electrolyte. They are conveyed through the bath by being engaged by driven contact wheels that also serve as one of the electrodes. The other electrode is in the bath electrolyte solution. As the workpieces are delivered through the bath, they are engaged and disengaged by the contact wheels, but are always in engagement with contact wheels for not only continuous conveyance, but for continuous electrical connection therewith. A particular slide mount is provided for holding an opposite side of the plate as the plate is carried along its flow path, and this mount is adjustably positionable to accommodate different width workpieces.

Abstract: Printed circuit boards are carried generally vertically, along a path, with the tabs at the lower end being immersed in an electrolyte. The boards are automatically conveyed through opposed serially arranged pairs of rollers, which drive them along their path. Brushes wipe the boards to prevent contact with electrolyte above the desired contact level, as they are conveyed along the path. The solution is constantly replenished and turbulence provided by delivering electrolyte solution, with insoluble metallic ions in it, by pumping the solution from a sump, through an array of nozzles along each side of the path, thus providing fresh electrolyte along with providing turbulence to the electrolyte. The nozzles are charged at a sufficiently low level to avoid their destruction.

Abstract: Printed circuit boards are carried generally vertically, along a path, with the tabs at the lower end being immersed in an electrolyte. The boards are automatically conveyed through opposed serially arranged pairs of rollers, which drive them along their path. Brushes wipe the boards to prevent contact with electrolyte above the desired contact level, as they are conveyed along the path. The solution is constantly replenished and turbulence provided by delivering electrolyte solution, with insoluble metallic ions in it, by pumping the solution from a sump, through an array of nozzles along each side of the path, thus providing fresh electrolyte along with providing turbulence to the electrolyte. The nozzles are charged at a sufficiently low level to avoid their destruction.

Abstract: An electroplating apparatus and method is provided, whereby generally flat workpieces, such as metal plates and the like may be electroplated, on a continuous basis, automatically and without manual intervention. The workpieces are delivered horizontally through a bath of electrolyte. They are conveyed through the bath by being engaged by driven contact wheels that also serve as one of the electrodes. The other electrode is in the bath electrolyte solution. As the workpieces are delivered through the bath, they are engaged and disengaged by the contact wheels, but are always in engagement with contact wheels for not only continuous conveyance, but for continuous electrical connection therewith. A particular slide mount is provided for holding an opposite side of the plate as the plate is carried along its flow path, and this mount is adjustably positionable to accommodate different width workpieces.

Abstract: A system is provided for control of ion concentration (as for example in pH or redox control), for use for example in etching articles, wherein other features such as specific gravity control are also provided. The ion concentration control is provided with cleaning and recalibration features. In a specific embodiment, provision is made for adding ammonia to an etching solution and for continuously monitoring the pH of the system. Visual indicators are provided for operator observation of fluid flow through various lines, generally by windows being provided in the cabinet apparatus. A particular electrode cell is disclosed as a prominent feature of ion concentration control.

Abstract: A system is provided for control of ion concentration (as for example in pH or redox control), for use for example in etching articles, wherein other features such as specific gravity control are also provided. The ion concentration control is provided with cleaning and recalibration features. In a specific embodiment, provision is made for adding ammonia to an etching solution and for continuously monitoring the pH of the system. Visual indicators are provided for operator observation of fluid flow through various lines, generally by windows being provided in the cabinet apparatus. A particular electrode cell is disclosed as a prominent feature of ion concentration control.

Abstract: Modular chemical treatment apparatus with improved sidewall connecting and alignment means consisting of a connecting member secured to abutting sidewalls, the connecting member overlying and held in intimate contact with a longitudinal, vertical planar surfce. A variety of such connecting and alignment means are disclosed.

Abstract: Apparatus is provided for drying articles that have been treated, for example, with an etchant or other treatment fluid and then washed, in order to remove the liquid, generally water, therefrom, the apparatus employing a conveyor for conveying the articles through a chamber, with a plurality of gas knives for preferably engaging the wet articles with a stream or curtain of cool air for physically impelling most of the liquid, generally water, from the articles, followed by delivering the articles past one or more other gas knife stations whereby air that has been heated is impelled onto the articles, for removing generally water film from the surface thereof. The apparatus is adjustable for using a single blower to provide originally unheated air to a single duct that is bifurcated into two channels, with a heater being provided in one of the channels.

Abstract: An etching system is disclosed, whereby individual and discrete modules are provided, each for performing its own function, with the modules being longitudinally connected in serial arrangement, and being aligned by suitable pin-in-hole arrangement, and with a common drive for all of the modules, by the use of drive rods carried by each of the modules that are coupled together with the connecton of adjacent modules. Individual features of the various drive means are also disclosed.

Abstract: Treated articles such as printed circuit boards that have been etched with an etchant or treated with a solvent, are delivered into a zone of sufficiently high humidity to prevent drying of a liquid treatment fluid on the articles, and wherein the treatment fluid is "blown off" the articles by pressurized air, in the high humidity environment, with the treatment fluid then being delivered for re-use at a prior station. Alternately, the treatment fluid is atomized, entrained in the pressurized air stream and "blown on" the articles, whereby the treatment fluid is efficiently and uniformly applied thereto.