Abstract: A forceps includes shaft members each having a jaw member disposed at a distal end thereof and configured move the jaw members between open and closed position. A knife deployment mechanism includes a trigger moveable along a longitudinal axis to deploy a knife between retracted and extended positions between the jaw members, the knife deployment mechanism including links that cooperate to actuate the knife. A knife kickout mechanism is pivotably coupled to one link and is configured to engage a ramp disposed in a shaft member upon approximation of the shaft members, the knife kickout is configured to cooperate with the links to urge the knife back to an at rest position upon the opening of the shaft members.

Abstract: A system and method for plating a workpiece are described. In one aspect, an apparatus includes a deposition chamber, a workpiece holder adapted for insertion into and removal from the deposition chamber, a shield with patterns of apertures corresponding to features on the workpiece, a shield holder also adapted for insertion into and removal from the deposition chamber and a positioning mechanism to position the workpiece in the workpiece holder such that the pattern of apertures on the shield will align with the corresponding features on the workpiece when the workpiece holder and shield holder are inserted into the deposition chamber.

Abstract: A system and method for plating a workpiece are described. In one aspect, an apparatus includes a deposition chamber, a workpiece holder adapted for insertion into and removal from the deposition chamber, a shield with patterns of apertures corresponding to features on the workpiece, a shield holder also adapted for insertion into and removal from the deposition chamber and a positioning mechanism to position the workpiece in the workpiece holder such that the pattern of apertures on the shield will align with the corresponding features on the workpiece when the workpiece holder and shield holder are inserted into the deposition chamber.

Abstract: A system and method for plating a workpiece are described. In one aspect, an apparatus includes a deposition chamber, a workpiece holder adapted for insertion into and removal from the deposition chamber, a shield with patterns of apertures corresponding to features on the workpiece, a shield holder also adapted for insertion into and removal from the deposition chamber and a positioning mechanism to position the workpiece in the workpiece holder such that the pattern of apertures on the shield will align with the corresponding features on the workpiece when the workpiece holder and shield holder are inserted into the deposition chamber.

Abstract: A system and method for plating a workpiece are described. In one aspect, an apparatus includes a deposition chamber, a workpiece holder adapted for insertion into and removal from the deposition chamber, a shield with patterns of apertures corresponding to features on the workpiece, a shield holder also adapted for insertion into and removal from the deposition chamber and a positioning mechanism to position the workpiece in the workpiece holder such that the pattern of apertures on the shield will align with the corresponding features on the workpiece when the workpiece holder and shield holder are inserted into the deposition chamber.

Abstract: A vapor deposition system comprises a vacuum chamber and two or more process modules each configured for processing a semiconductor substrate. Each process module is removably connected to a respective port of the vacuum chamber such that each process module is in vacuum communication with the vacuum chamber when connected to the respective port. A port sealing mechanism is configured to create a vacuum seal at each port such that when a first port is sealed and a first process module is disconnected from the first port, a vacuum condition is maintained within the vacuum chamber while the first process module is open to atmospheric pressure.

Abstract: A vapor deposition system comprises a vacuum chamber and two or more process modules each configured for processing a semiconductor substrate. Each process module is removably connected to a respective port of the vacuum chamber such that each process module is in vacuum communication with the vacuum chamber when connected to the respective port. A port sealing mechanism is configured to create a vacuum seal at each port such that when a first port is sealed and a first process module is disconnected from the first port, a vacuum condition is maintained within the vacuum chamber while the first process module is open to atmospheric pressure.

Abstract: An electrochemical deposition system is described. The electrochemical deposition system includes one or more electrochemical deposition modules arranged on a common platform for depositing one or more metals on a substrate, and a chemical management system coupled to the one or more electrochemical deposition modules. The chemical management system is configured to supply at least one of the one or more electrochemical deposition modules with one or more metal constituents for depositing the one or more metals. The chemical management system can include at least one metal enrichment cell and at least one metal-concentrate generator cell.

Abstract: An electrochemical deposition system is described. The electrochemical deposition system includes one or more electrochemical deposition modules arranged on a common platform for depositing one or more metals on a substrate, and a chemical management system coupled to the one or more electrochemical deposition modules. The chemical management system is configured to supply at least one of the one or more electrochemical deposition modules with one or more metal constituents for depositing the one or more metals. The chemical management system can include at least one metal enrichment cell and at least one metal-concentrate generator cell.

Abstract: A method and apparatus for EMI shielding of an electronic package is described. The method includes applying a patterned package support to a transport tray, and placing one or more electronic packages in aligned contact with one or more open features of the patterned package support such that a peripheral region of the electronic package contacts an upper surface of the patterned package support and a central region overhangs the open feature. The method further includes depositing one or more metal layers onto the one or more electronic packages and patterned package support, wherein the open features in the patterned package support allow metal layer deposition on the sidewalls of the one or more electronic packages and protect at least a portion of the underside of the one or more electronic packages.

Abstract: A substrate drying apparatus for drying a width of a surface of a substrate in a liquid. The substrate drying apparatus has a liquid tank containing the liquid. An injection nozzle is coupled to the liquid tank, the injection nozzle having a continuous knife edge injection surface across the width of the surface of the substrate. A drain is coupled to the injection nozzle, the drain having a continuous drain surface substantially parallel to the continuous knife edge injection surface and across the width of the surface of the substrate. The liquid forms a meniscus between the continuous drain surface and the width of the surface of the substrate. The injection nozzle directs a vapor at the meniscus.

Abstract: A system for processing surfaces of substrates having a process module having a process module frame and a plurality of process elements to process the substrate surfaces without contacting the substrate surfaces. A plurality of substrate holder assemblies, each having a number of substrate holders, each of which is removably coupled to the process module frame, each substrate holder configured to hold a substrate. The process module frame has alignment features aligning the substrate holders in the substrate holder assembly in repeatable alignment with respect to each of the process elements with each of the process elements located between the substrates. A loader module is configured to unload processed substrates from each of the substrate holder assemblies and load unprocessed substrates to each of the substrate holder assemblies. A transporter is configured to transport the substrate holder assemblies to and from the process module and the loader module.

Abstract: A system for fluid processing substrate surfaces arrayed in a fluid having a process section with a frame having a plurality of process elements to process the substrate surfaces without contacting the substrate surfaces. A substrate holder assembly having a holder frame and a number of substrate holders, each of which is coupled to the holder frame and is configured for holding a substrate so that each substrate holder holds a different substrate for transport as a unit with the substrate holder assembly to and from the process section. The substrate holder assembly and each substrate holder are removably coupled to the process section frame, and the substrate holders of the substrate holder assembly are movable relative to the holder frame and positionable in repeatable alignment with respect to a predetermined feature of the process section and independent of positioning of the holder frame with respect to the process section.

Abstract: Techniques disclosed herein include a method and apparatus for stripping resist from a substrate without using high concentrations of toxic chemicals and without needing frequent bath replacement. Techniques include using a chemistry that lifts-off the resist, without substantially dissolving the resist, coupled with mechanically breaking removed resist into small particles using mechanical agitation and high fluid flow. Resist particles can then be removed from the vicinity of the wafer by a high-flow circulation out of a processing tank. Circulating flow can then be filtered to remove the resist particles from the circulating fluid and reintroduced into the processing tank. A filtering system can also remove particles from filters either during circulation or with circulation stopped.

Abstract: An electrochemical deposition system is described. The electrochemical deposition system includes one or more electrochemical deposition modules arranged on a common platform for depositing one or more metals on a substrate, and a chemical management system coupled to the one or more electrochemical deposition modules. The chemical management system is configured to supply at least one of the one or more electrochemical deposition modules with one or more metal constituents for depositing the one or more metals. The chemical management system can include at least one metal enrichment cell and at least one metal-concentrate generator cell.

Abstract: An electrochemical deposition system is described. The electrochemical deposition system includes one or more electrochemical deposition modules arranged on a common platform for depositing one or more metals on a substrate, and a chemical management system coupled to the one or more electrochemical deposition modules. The chemical management system is configured to supply at least one of the one or more electrochemical deposition modules with one or more metal constituents for depositing the one or more metals. The chemical management system can include at least one metal enrichment cell and at least one metal-concentrate generator cell.

Abstract: An electrochemical deposition system is described. The electrochemical deposition system includes one or more electrochemical deposition modules arranged on a common platform for depositing one or more metals on a substrate, and a chemical management system coupled to the one or more electrochemical deposition modules. The chemical management system is configured to supply at least one of the one or more electrochemical deposition modules with one or more metal constituents for depositing the one or more metals. The chemical management system can include at least one metal enrichment cell and at least one metal-concentrate generator cell.

Abstract: A system for fluid processing one or more substrate surfaces arrayed in a fluid. The system has a process module with a frame and a plurality of agitation members to fluid process the substrate surfaces without contacting the substrate surfaces. A substrate holder assembly has a holder frame and a number of substrate holders, each of which is coupled to the holder frame and configured to hold a substrate so that a different substrate is held by each substrate holder of the substrate holder assembly for transport therewith as a unit to and from the process module. The substrate holder assembly and each substrate holder of the substrate holder assembly are removably coupled to the process module frame and, when coupled to the process module frame, each substrate holder is independently moveable and positionable relative to the other substrate holders of the substrate holder assembly.

Abstract: A system for fluid processing one or more substrate surfaces arrayed in a fluid. The system has a process module with a frame and a plurality of fluid jet elements to inject a fluid at the substrate surfaces without contacting the substrate surfaces. A substrate holder assembly has a holder frame and a number of substrate holders, each of which is coupled to the holder frame and configured to hold a substrate so that a different substrate is held by each substrate holder of the substrate holder assembly for transport therewith as a unit to and from the process module. The substrate holder assembly and each substrate holder of the substrate holder assembly are removably coupled to the process module frame and, when coupled to the process module frame, each substrate holder is independently moveable and positionable relative to the other substrate holders of the substrate holder assembly.

Abstract: A system for fluid processing substrate surfaces arrayed in a fluid having a process section with a frame having a plurality of process elements to process the substrate surfaces without contacting the substrate surfaces. A substrate holder assembly having a holder frame and a number of substrate holders, each of which is coupled to the holder frame and is configured for holding a substrate so that each substrate holder holds a different substrate for transport as a unit with the substrate holder assembly to and from the process section. The substrate holder assembly and each substrate holder are removably coupled to the process section frame, and the substrate holders of the substrate holder assembly are movable relative to the holder frame and positionable in repeatable alignment with respect to a predetermined feature of the process section and independent of positioning of the holder frame with respect to the process section.