Patents by Inventor Daniel Larcomb

Daniel Larcomb has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus for and method of manufacturing a semiconductor die carrier
    Patent number: 6857173
    Abstract: A lead insertion machine includes a substrate supply, a conductive lead supply, and an lead insertion mechanism. The conductive leads are inserted into lead passages formed in side walls of the substrate. Also disclosed is a method of manufacturing a semiconductor die carrier including the steps of forming a plurality of conductive leads, forming a substrate for holding a semiconductor die, the substrate having a plurality of insulative side walls defining an exterior surface of the substrate, each of the side walls having a plurality of lead passages formed therethrough, and simultaneously inserting at least one of the conductive leads into the lead passage of one of the side walls for retention therein and at least one other of the conductive leads into the lead passage of another of the side walls for retention therein.
    Type: Grant
    Filed: November 6, 2000
    Date of Patent: February 22, 2005
    Assignee: Silicon Bandwidth, Inc.
    Inventors: Stanford W. Crane, Jr., Daniel Larcomb, Lakshminarasimha Krishnapura
  • Apparatus for and method of manufacturing a semiconductor die carrier
    Patent number: 6141869
    Abstract: A lead insertion machine includes a substrate supply, a conductive lead supply, and an lead insertion mechanism. The conductive leads are inserted into lead passages formed in side walls of the substrate. Also disclosed is a method of manufacturing a semiconductor die carrier including the steps of forming a plurality of conductive leads, forming a substrate for holding a semiconductor die, the substrate having a plurality of insulative side walls defining an exterior surface of said substrate, each of the side walls having a plurality of lead passages formed therethrough, and simultaneously inserting at least one of the conductive leads into the lead passage of one of the side walls for retention therein and at least one other of the conductive leads into the lead passage of another of the side walls for retention therein.
    Type: Grant
    Filed: October 26, 1998
    Date of Patent: November 7, 2000
    Assignee: Silicon Bandwidth, Inc.
    Inventors: Stanford W. Crane, Jr., Daniel Larcomb, Lakshminarasimha Krishnapura