Abstract: The invention relates to a bridge for a ball game racket as well as to a frame for a ball game racket comprising a bridge.

Abstract: A class may be determined of a term from a database. The term may be blocked from being presented to a user, if the determined class does not include a permission for the user to view the term. The term may suggest a remainder of an incomplete query input by the user.

Abstract: The invention relates to a frame for a ball game racket comprising a handle region and a head region with a bridge, wherein a part of the head region and/or the handle region comprise(s) a carbon fiber composite material and wherein the bridge comprises magnesium and is formed as one part.

Abstract: The present invention relates to a ball game racket with strings that comprise at least one string comprising a superelastic material.

Abstract: Different prices may be charged for an In-App Purchase (IAP) for a same item based on a market associated with the user. For example, a user in one market may be charged a different price for an item than what is charged for the item to a user in a different market. A different product identifier is associated with the item for each of the different markets for the item. The item is submitted to the application store as different items that have the different product identifiers for each of the different markets. When an IAP request for an item is received from a user, a market that is associated with the user is determined based on a location associated with the user. After determining the market for the user, the product identifier that identifies the product is used to obtain the item from the application store.

Abstract: The present invention relates to a frame for a ball-game racket comprising a head portion and a handle portion, wherein the frame is configured as a hollow profile and comprises magnesium and wherein the wall thickness of the hollow profile varies along a cross-section through the hollow frame profile, as well as to a process for producing such a racket.

Abstract: An antenna may be formed from a peripheral conductive housing structure in an electronic device that is separated from an antenna ground by a gap. An antenna feed may be formed from a metal trace on a flexible printed circuit that spans the gap. The metal trace may have a line segment that joins a wider pad portion of the trace at a junction. A stiffener on the flexible printed circuit may have a protrusion that overlaps the junction. A metal bracket attached to the peripheral housing structure may be soldered to the pad. A metal member with meandering paths may form a return path in the antenna. The meandering path may have parallel segments that extend along an inner surface of the peripheral conductive housing structure to prevent the metal member from rotating when a screw is used to screw the metal member to the peripheral conductive housing structure.

Abstract: The present invention relates to a grommet strip for a racket for ball games, wherein the grommet strip comprises a longitudinal direction and a plurality of grommets 1 comprising grommet through-holes 2, wherein each of the grommets 1 defines a grommet axis A and each of the grommet through-holes 2 defines a hole axis B, wherein the grommet axes A and the hole axes B extend substantially parallel to each other and wherein the hole axes B of some grommets are offset with respect to the grommet axes A thereof in the longitudinal direction of the grommet strip.

Abstract: Different prices may be charged for an In-App Purchase (IAP) for a same item based on a market associated with the user. For example, a user in one market may be charged a different price for an item than what is charged for the item to a user in a different market. A different product identifier is associated with the item for each of the different markets for the item. The item is submitted to the application store as different items that have the different product identifiers for each of the different markets. When an IAP request for an item is received from a user, a market that is associated with the user is determined based on a location associated with the user. After determining the market for the user, the product identifier that identifies the product is used to obtain the item from the application store.

Abstract: The present invention relates to an elastic grip sleeve for the grip of a ball game racket, the sleeve having an inner surface and an outer surface, wherein the inner surface is provided at least in parts with an adhesive strip. The present invention moreover relates to a retrofit kit for a ball game racket, comprising a grip sleeve and at least an adhesive strip. Moreover, according to the invention there is provided a method for attaching a grip sleeve to the grip portion of a ball game racket.

Abstract: The present invention relates to an elastic grip sleeve for the grip of a ball game racket, the sleeve having an inner surface and an outer surface, wherein the inner surface is provided at least in parts with an adhesive strip. The present invention moreover relates to a retrofit kit for a ball game racket, comprising a grip sleeve and at least an adhesive strip. Moreover, according to the invention there is provided a method for attaching a grip sleeve to the grip portion of a ball game racket.

Abstract: A lead frame (52, 100, 112) for a semiconductor device (die) package (50, 102, 110) is described. Each of the leads (60) in the lead frame (52, 100, 112) includes an interposer (64) having one end (66) disposed proximate the outer face (58) of the package (50, 102, 110) and another end (68) disposed proximate the die (14). Extending from opposite ends of the interposer (64) are a board connecting post (70) and a support post (74). A bond site (78) is formed on a surface of the interposer (64) opposite the support post (74). Each of the leads (60) is electrically connected to an associated input/output (I/O) pad (80) on the die (14) via wirebonding, tape bonding, or flip-chip attachment to the bond site (78). Where wirebonding is used, a wire electrically connecting the I/O pad (80) to the bond site (78) may be wedge bonded to both the I/O pad (80) and the bond site (78). The support post (74) provides support to the end (68) of the interposer (64) during the bonding and coating processes.

Abstract: A heat spreader (20) is added to a package to enhance thermal and advantageously electrical performance. In manufacture, a heat spreader precursor (24) is advantageously placed over a group of dies and secured after bonding (e.g., wire or tape bonding or flip-chip bonding) and before matrix/block mold. For example, a package strip (10) may consist of a row (linear array) of groups of die attach areas (e.g. in a rectangular array of four). The heat spreader precursor (20) may accommodate one such group or multiple groups along the package strip (10). The package strip (10) may then be singulated to form the individual packages. Each singulated package includes a die (14), its associated substrate 16 (e.g., either a lead frame or interposer type substrate) and a portion of the heat spreader precursor (24) as a heat spreader (20).

Abstract: A system and method for determining the track of a projectile use a thermal signature of the projectile. Sequential infrared image frames are acquired from a sensor at a given position. A set of frames containing spots with characteristics consistent with a projectile in flight are identified. A possible projectile track solution for said spots is identified. A thermal signature value for each pixel of each spot of the possible solution is determined. The determined thermal signature is then compared to an actual thermal signature for a substantially similar projectile track to ascertain whether the determined thermal signature substantially matches the actual thermal signature, which indicates that the possible projectile track solution is the correct solution.

Abstract: A method and apparatus for forming a multiple semiconductor die assembly (200, 300, 400) having a thin profile are presented. The semiconductor die assembly (200, 300, 400) comprises a plurality of die packages (100), with each die package (100) including a lead frame (10) having a plurality of leads (11) each having a down set portion (101) extending from a first surface (14). A semiconductor die (30) is disposed in a central region (12) of the lead frame (10) and is electrically connected to the leads (11). An encapsulant (50) is disposed in the central region (12) and covers to the semiconductor die (30) and a portion of the leads (11). The first surface (14) of the leads (11) and a first surface (34) of the semiconductor die (30) are substantially coplanar and are exposed from the encapsulant (50). The first surface (34) of the semiconductor die (30) and the down set portions (101) of the leads form a cavity (102).

Abstract: A heat spreader (20) is added to a package to enhance thermal and advantageously electrical performance. In manufacture a heat spreader precursor (24) is advantageously placed over a group of dies and secured after bonding (e.g., wire or tape bonding or flip-chip bonding) and before matrix/block mold. For example, a package strip (10) may consist of a row (linear array) of groups of die attach areas (e.g. in a rectangular array of four). The heat spreader precursor (20) may accommodate one such group or multiple groups along the package strip (10). The package strip (10) may then be singulated to form the individual packages. Each singulated package includes a die (14), its associated substrate 16 (e.g., either a lead frame or interposer type substrate) and a portion of the heat spreader precursor (24) as a heat spreader (20).

Abstract: Described is a system and method that enables project management across application programs, including an email program, calendar program, spreadsheet program, word processing program, note taking program and others. A central project-related view provides access to project-related data items and may display a schedule, a task list of tasks filtered as being relevant to a project, a note page related to a project, and emails relevant to the project. In addition, other application objects (file, documents, presentations and spreadsheets) are also captured in the view and presented for easy access. Metadata including a project identifier is maintained in a database for the various data items, allowing rapid location of the data items related to a project via query techniques. A project palette allows access to the items from within another application program, and a project gallery allows a user alternative access to the files related to a project.

Abstract: A key-in-ignition warning switch (10) is integrally mounted within an ignition switch (11). The warning switch (10), positioned along the rotational axis (17) of the ignition switch (10), comprises an inner plunger (15), an outer plunger (16), a plunger spring (28), and a housing spring (31). As the ignition key (26) is inserted into the key cylinder (12), a linkage (14) between the key cylinder (12) and the warning switch (10) pushes against the inner plunger (15), which in turn pushes against the outer plunger (16). As the key (26) is inserted completely into the key cylinder (12), contacts (24,25) attached to the plungers (15,16) make contact with terminals (34,36) located within a terminal block (35) attached to the ignition switch (11). When both plunger contacts (24,25) and mating terminals (34,36) are in contact, the key-in-ignition warning circuit is completed, thereby enabling the associated warning devices.