Abstract: A circuit assembly 10 is provided, including a main assembly board 18, a main assembly housing 20, and at least one partitioned circuit assembly 14. The partitioned circuit assembly 14 includes the partitioned circuit element 22, a partitioned circuit housing 24 and a plurality of connectors 26.

Abstract: A pressure sensor connector (10) for use with a pressure sensor element (12) that includes a plurality of pressure sensor terminals (13). The pressure sensor connector (10) includes a cap (18), a plurality of connector terminals (20) and a frame element (22). A plurality of contacts (24), included in the frame element (22), connect each of the plurality of connector terminals (20) to a corresponding pressure sensor terminal (13).

Abstract: An air/fuel intake manifold module having fuel injectors and having an electronic engine control module (ECM) cooled by the passage of air through the manifold. The ECM is protected from contamination and damage by a coating. The ECM may be mounted in the air flow path immediately ahead of the main engine throttle body, or in a well formed in a wall of the manifold. The ECM in the well may be further cooled by placement of a heat-sink between the ECM and the manifold or by fins extended through the manifold wall into the air stream within the manifold. Alternatively, the ECM circuit board itself may be extended through a slot in the manifold wall into the air stream, or the circuits may be applied to, or formed directly on, an interior or exterior surface of the manifold.

Abstract: A high density wirebond connector assembly (10),is provided including an enclosure (12), a circuit board (14), a high density connector (16), a connector housing (18), and a plurality of pin contacts (20). Every two rows of pin contacts (20) merge onto a single shelf (22) to provide a high density contact surface (31). The circuit board (14) is comprised of a plurality of laminate layers (32) and rows of wirebond pads (34) positioned on the laminate layers (32). A plurality of wirebonds (36) run between individual pin contacts (20) and individual wirebond pads (34). By creating a high density contact surface (31) in combination with decreasing the distance between the wirebond pads (34) and the pin contacts (20), a smaller, lighter, cheaper, and vibrationally resistant high density connector assembly (10) is provided.

Abstract: The present invention relates to a method of making a header or housing for connection to a semi-conductor device including the step of trimming a single terminal frame molded into the header while the header or housing is in the molding cavity. To accomplish this, the present invention utilizes a single terminal frame including a plurality of substantially parallel electrical connection fingers held together at one end by a tie-bar. The terminal frame has a "V-notch" in each of the electrical connection fingers at a location adjacent the tie-bar. The terminal frame is placed in a mold having an upper and lower mold shell each having cavities formed therein which together define the header or housing to be molded. The upper and lower mold shells come together and grasp the terminal frame at a position adjacent the notch and so that the tie-bar extends outwardly from the upper and lower mold shells.

Abstract: The invention includes a flat, planar, single piece copper footprint including a first portion for mounting an aluminum bond pad, and a third portion for mounting a semi-conductor device, and a second portion, interposed between the first and third portions, which is recessed and includes arcuate-shaped sides. The recessed arcuate-shaped sides of the second portion of the copper footprint act as a solder stop preventing solder from flowing from the first portion to the third portion or vice versa.