Patents by Inventor Daniel Lee Dawiedczyk

Daniel Lee Dawiedczyk has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of manufacturing a flexible printed circuit assembly
    Patent number: 8015701
    Abstract: A flexible printed circuit assembly with a fluorocarbon dielectric layer and an adhesive layer with reduced thickness. The flexible printed circuit assembly includes a first dielectric layer and a signal trace disposed on the first dielectric layer. An adhesive layer with a thickness smaller than a height of the signal trace is disposed on the first dielectric layer, so that only a portion of a side surface of the signal trace is covered. A second dielectric layer made of fluorocarbon is disposed on the adhesive layer, covering a remaining portion of the side surface of the signal trace and a top surface of the signal trace.
    Type: Grant
    Filed: February 22, 2008
    Date of Patent: September 13, 2011
    Assignee: International Business Machines Corporation
    Inventors: Paul V. Abrahamson, John Richard Dangler, Daniel Lee Dawiedczyk, Matthew Stephen Doyle