Patents by Inventor Daniel Lee Revier

Daniel Lee Revier has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210200094
    Abstract: A microelectronic device is formed by dispensing discrete amounts of a mixture of photoresist resin and solvents from droplet-on-demand sites onto a wafer to form a first photoresist sublayer, while the wafer is at a first temperature which allows the photoresist resin to attain less than 10 percent thickness non-uniformity. The wafer moves under the droplet-on-demand sites in a first direction to form the first photoresist sublayer. A portion of the solvents in the first photoresist sublayer is removed. A second photoresist sublayer is formed on the first photoresist sublayer using the droplet-on-demand sites while the wafer is at a second temperature to attain less than 10 percent thickness non-uniformity in the combined first and second photoresist sublayers. The wafer moves under the droplet-on-demand sites in a second direction for the second photoresist sublayer, opposite from the first direction.
    Type: Application
    Filed: December 30, 2019
    Publication date: July 1, 2021
    Applicant: Texas Instruments Incorporated
    Inventors: Daniel Lee Revier, Sean Ping Chang, Benjamin Stassen Cook, Scott Robert Summerfelt
  • Patent number: 11031364
    Abstract: In described examples, a microelectronic device includes a microelectronic die with a die attach surface. The microelectronic device further includes a nanoparticle layer coupled to the die attach surface. The nanoparticle layer may be in direct contact with the die attach surface, or may be coupled to the die attach surface through an intermediate layer, such as an adhesion layer or a contact metal layer. The nanoparticle layer includes nanoparticles having adjacent nanoparticles adhered to each other. The microelectronic die is attached to a package substrate by a die attach material. The die attach material extends into the nanoparticle layer and contacts at least a portion of the nanoparticles.
    Type: Grant
    Filed: March 7, 2018
    Date of Patent: June 8, 2021
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Benjamin Stassen Cook, Daniel Lee Revier, Sadia Naseem, Mahmud Halim Chowdhury
  • Publication number: 20210157130
    Abstract: An apparatus includes a mass detection circuit coupled to a surface covered with a plurality of electrodes. The mass detection circuit is configured to detect a mass of a first droplet present on the surface. The apparatus further includes a transducer circuit coupled to a transducer, which is coupled to the surface and form a lens unit. The transducer circuit configured to excite a first vibration of the surface at a resonant frequency to form a high displacement region on the surface. The apparatus also includes a voltage excitation circuit coupled to the plurality of electrodes. In response to the detection of the mass of the first droplet, the voltage excitation circuit is configured to apply a sequence of differential voltages on one or more consecutive electrodes which moves the first droplet to the high displacement region.
    Type: Application
    Filed: February 2, 2021
    Publication date: May 27, 2021
    Inventors: Daniel Lee Revier, Benjamin Stassen Cook, David Patrick Magee, Stephen John Fedigan
  • Publication number: 20210151551
    Abstract: In described examples, a method for fabricating a semiconductor device and a three dimensional structure, and packaging them together, includes: fabricating the integrated circuit on a substrate, immersing the substrate in a liquid encapsulation material, and illuminating the liquid encapsulation material to polymerize the liquid encapsulation material. Immersing the semiconductor device is performed to cover a layer of a platform in the liquid encapsulation material. The platform is a lead frame, a packaging substrate, or the substrate. The illuminating step targets locations of the liquid encapsulation material covering the layer. Illuminated encapsulation material forms solid encapsulation material that is fixedly coupled to contiguous portions of the semiconductor device and of the solid encapsulation material. The immersing and illuminating steps are repeated until a three dimensional structure is formed. The integrated circuit and the three dimensional structure are encapsulated in a single package.
    Type: Application
    Filed: February 1, 2021
    Publication date: May 20, 2021
    Inventors: Benjamin Stassen Cook, Daniel Lee Revier
  • Publication number: 20210151357
    Abstract: An encapsulated integrated circuit includes an integrated circuit (IC) die. An encapsulation material encapsulates the IC die. Within the encapsulation material, a phononic bandgap structure is configured to have a phononic bandgap with a frequency range approximately equal to a range of frequencies of thermal phonons produced by the IC die when the IC die is operating.
    Type: Application
    Filed: January 4, 2021
    Publication date: May 20, 2021
    Inventors: Benjamin Stassen Cook, Daniel Lee Revier
  • Publication number: 20210138727
    Abstract: A layer of additive material is formed in a circular printing area on a substrate using additive sources distributed across a printing zone. The additive sources form predetermined discrete amounts of the additive material. The substrate and the additive sources are rotated with respect to each other around a center of rotation, so that a pattern of the additive material is formed in a circular printing area on the substrate. Each additive source receives actuation waveforms at an actuation frequency that is proportional to a distance of the additive source from the center of rotation. The actuation waveforms include formation signals, with a maximum of one formation signal in each cycle of the actuation frequency. The formation signals result in the additive sources forming the predetermined discrete amounts of the additive material on the substrate.
    Type: Application
    Filed: November 11, 2019
    Publication date: May 13, 2021
    Applicant: Texas Instruments Incorporated
    Inventors: Daniel Lee Revier, Sean Ping Chang, Benjamin Stassen Cook
  • Publication number: 20210098331
    Abstract: In described examples, a circuit (e.g., an integrated circuit) includes a semiconductor substrate that includes a frontside surface and a backside surface. A circuit element is included at the frontside surface. An optional electrical insulator layer can be included adjacent to the backside surface. A distributor layer is included adjacent to the backside surface. In some examples, the distributor layer includes a distributor material that includes a matrix of cohered nanoparticles and metallic particles embedded by the cohered nanoparticles.
    Type: Application
    Filed: September 27, 2019
    Publication date: April 1, 2021
    Inventors: Benjamin Stassen Cook, Nazila Dadvand, Daniel Lee Revier, Archana Venugopal
  • Publication number: 20210090904
    Abstract: In described examples, a method for encapsulating a semiconductor device includes the steps of immersing a layer of the semiconductor device in a liquid encapsulation material, irradiating portions of the liquid encapsulation material to polymerize the liquid encapsulation material, and moving the semiconductor device further from a surface of the liquid encapsulation material proximate to the layer. Immersing the semiconductor device is performed to cover a layer of the device in the liquid encapsulation material. Targeted locations of the liquid encapsulation material covering the layer are irradiated to form solid encapsulation material. The semiconductor device is moved from a surface of the liquid encapsulation material so that a new layer of the semiconductor device and/or of the solid encapsulation material can be covered by the liquid encapsulation material.
    Type: Application
    Filed: December 7, 2020
    Publication date: March 25, 2021
    Inventors: Benjamin Stassen Cook, Daniel Lee Revier
  • Patent number: 10908414
    Abstract: An apparatus includes a mass detection circuit coupled to a surface covered with a plurality of electrodes. The mass detection circuit is configured to detect a mass of a first droplet present on the surface. The apparatus further includes a transducer circuit coupled to a transducer, which is coupled to the surface and form a lens unit. The transducer circuit configured to excite a first vibration of the surface at a resonant frequency to form a high displacement region on the surface. The apparatus also includes a voltage excitation circuit coupled to the plurality of electrodes. In response to the detection of the mass of the first droplet, the voltage excitation circuit is configured to apply a sequence of differential voltages on one or more consecutive electrodes which moves the first droplet to the high displacement region.
    Type: Grant
    Filed: May 10, 2017
    Date of Patent: February 2, 2021
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Daniel Lee Revier, Benjamin Stassen Cook, David Patrick Magee, Stephen John Fedigan
  • Patent number: 10910465
    Abstract: In described examples, a method for fabricating a semiconductor device and a three dimensional structure, and packaging them together, includes: fabricating the integrated circuit on a substrate, immersing the substrate in a liquid encapsulation material, and illuminating the liquid encapsulation material to polymerize the liquid encapsulation material. Immersing the semiconductor device is performed to cover a layer of a platform in the liquid encapsulation material. The platform is a lead frame, a packaging substrate, or the substrate. The illuminating step targets locations of the liquid encapsulation material covering the layer. Illuminated encapsulation material forms solid encapsulation material that is fixedly coupled to contiguous portions of the semiconductor device and of the solid encapsulation material. The immersing and illuminating steps are repeated until a three dimensional structure is formed. The integrated circuit and the three dimensional structure are encapsulated in a single package.
    Type: Grant
    Filed: December 28, 2018
    Date of Patent: February 2, 2021
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Benjamin Stassen Cook, Daniel Lee Revier
  • Patent number: 10886187
    Abstract: An encapsulated integrated circuit is provided that includes an integrated circuit (IC) die. An encapsulation material encapsulates the IC die. A phononic bandgap structure is included within the encapsulation material that is configured to have a phononic bandgap with a frequency range approximately equal to a range of frequencies of thermal phonons produced by the IC die when the IC die is operating.
    Type: Grant
    Filed: October 24, 2017
    Date of Patent: January 5, 2021
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Benjamin Stassen Cook, Daniel Lee Revier
  • Publication number: 20200406316
    Abstract: For surface wetting control, an apparatus can expel fluid from a droplet on a surface using a transducer mechanically coupled to the surface. A first area of the surface can have a first wettability for the fluid, and a second area of the surface can have a second wettability for the fluid. The first wettability of the first area of the surface can be greater than the second wettability of the second area of the surface. The first area and the second area can have a patterned arrangement.
    Type: Application
    Filed: September 14, 2020
    Publication date: December 31, 2020
    Inventors: Daniel Lee Revier, Benjamin Stassen Cook, David Patrick Magee, Stephen John Fedigan
  • Patent number: 10879151
    Abstract: A semiconductor package includes a lead frame, a semiconductor device, a liquid metal conductor, and an encapsulation material. The semiconductor device is affixed to the lead frame. The liquid metal conductor couples the semiconductor device to the lead frame. The encapsulation material encases the semiconductor device, the liquid metal conductor, and at least a portion of the lead frame.
    Type: Grant
    Filed: December 28, 2018
    Date of Patent: December 29, 2020
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Dishit Paresh Parekh, Benjamin Stassen Cook, Daniel Lee Revier, Jo Bito
  • Patent number: 10861715
    Abstract: In described examples, a method for encapsulating a semiconductor device includes the steps of immersing a layer of the semiconductor device in a liquid encapsulation material, irradiating portions of the liquid encapsulation material to polymerize the liquid encapsulation material, and moving the semiconductor device further from a surface of the liquid encapsulation material proximate to the layer. Immersing the semiconductor device is performed to cover a layer of the device in the liquid encapsulation material. Targeted locations of the liquid encapsulation material covering the layer are irradiated to form solid encapsulation material. The semiconductor device is moved from a surface of the liquid encapsulation material so that a new layer of the semiconductor device and/or of the solid encapsulation material can be covered by the liquid encapsulation material.
    Type: Grant
    Filed: December 28, 2018
    Date of Patent: December 8, 2020
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Benjamin Stassen Cook, Daniel Lee Revier
  • Patent number: 10833648
    Abstract: An encapsulated integrated circuit is provided that includes an integrated circuit (IC) die. A phonon device is fabricated on the IC die that is configured to emit or to receive phonons that have a range of ultrasonic frequencies. An encapsulation material encapsulates the IC die. A phononic bandgap structure is included within the encapsulation material that is configured to have a phononic bandgap with a frequency range that includes at least a portion of the range of ultrasonic frequencies. A phononic channel is located in the phononic bandgap structure between the phonon device and a surface of the encapsulated IC.
    Type: Grant
    Filed: October 24, 2017
    Date of Patent: November 10, 2020
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Daniel Lee Revier, Benjamin Stassen Cook
  • Patent number: 10788367
    Abstract: On an integrated circuit (IC) die, sensors are configured to receive electromagnetic energy and to generate signals in response to the electromagnetic energy. An encapsulation material encapsulates the IC die and the sensors. A filter structure includes a diffusion of particles within the encapsulation material. The filter structure includes: a first region configured to pass a first band of the electromagnetic energy to the sensors or to block the first band of the electromagnetic energy from passing to the sensors; and a second region configured to pass a second band of the electromagnetic energy to the sensors or to block the second band of the electromagnetic energy from passing to the sensors. The encapsulation material has a first intrinsic property, and the particles have a second intrinsic property that is different from the first intrinsic property.
    Type: Grant
    Filed: December 16, 2019
    Date of Patent: September 29, 2020
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Benjamin Stassen Cook, Daniel Lee Revier
  • Patent number: 10780467
    Abstract: Methods and apparatus for surface wetting control are disclosed. In certain described examples, an apparatus can expel fluid from a droplet on a surface using a transducer mechanically coupled to the surface. A first area of the surface can have a first wettability for the fluid, and a second area of the surface can have a second wettability for the fluid. The first wettability of the first area of the surface can be greater than the second wettability of the second area of the surface. The first area and the second area can be arranged in a patterned arrangement.
    Type: Grant
    Filed: April 20, 2017
    Date of Patent: September 22, 2020
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Daniel Lee Revier, Benjamin Stassen Cook, David Patrick Magee, Stephen John Fedigan
  • Publication number: 20200212166
    Abstract: In described examples, a method for fabricating a semiconductor device and a three dimensional structure, and packaging them together, includes: fabricating the integrated circuit on a substrate, immersing the substrate in a liquid encapsulation material, and illuminating the liquid encapsulation material to polymerize the liquid encapsulation material. Immersing the semiconductor device is performed to cover a layer of a platform in the liquid encapsulation material. The platform is a lead frame, a packaging substrate, or the substrate. The illuminating step targets locations of the liquid encapsulation material covering the layer. Illuminated encapsulation material forms solid encapsulation material that is fixedly coupled to contiguous portions of the semiconductor device and of the solid encapsulation material. The immersing and illuminating steps are repeated until a three dimensional structure is formed. The integrated circuit and the three dimensional structure are encapsulated in a single package.
    Type: Application
    Filed: December 28, 2018
    Publication date: July 2, 2020
    Inventors: Benjamin Stassen Cook, Daniel Lee Revier
  • Publication number: 20200211798
    Abstract: A switch that includes a droplet capable of spreading between two conductors to allow them to be coupled when a voltage is applied. The droplet can be enclosed by a cap that is bonded to a wafer that the droplet is placed upon, and include metallic properties. The cap can create a cavity that may be filled by a fluid, gas, or vapor. The cavity can have multiple conductors that extend partially or fully through it. The droplet can couple the conductors when specific voltages, or frequencies are applied to them. At the specific voltage and frequency the droplet can spread allowing at least two conductors to be coupled.
    Type: Application
    Filed: December 27, 2018
    Publication date: July 2, 2020
    Inventors: Adam Joseph Fruehling, Dishit Paresh Parekh, Daniel Lee Revier, Benjamin Stassen Cook
  • Publication number: 20200211928
    Abstract: A semiconductor package includes a lead frame, a semiconductor device, a liquid metal conductor, and an encapsulation material. The semiconductor device is affixed to the lead frame. The liquid metal conductor couples the semiconductor device to the lead frame. The encapsulation material encases the semiconductor device, the liquid metal conductor, and at least a portion of the lead frame.
    Type: Application
    Filed: December 28, 2018
    Publication date: July 2, 2020
    Inventors: Dishit Paresh PAREKH, Benjamin Stassen COOK, Daniel Lee REVIER, Jo BITO