Patents by Inventor Daniel Lugauer

Daniel Lugauer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • System and method for a transducer in an EWLB package
    Patent number: 11211298
    Abstract: According to an embodiment, a sensor package includes an electrically insulating substrate including a cavity in the electrically insulating substrate, an ambient sensor, an integrated circuit die embedded in the electrically insulating substrate, and a plurality of conductive interconnect structures coupling the ambient sensor to the integrated circuit die. The ambient sensor is supported by the electrically insulating substrate and arranged adjacent the cavity.
    Type: Grant
    Filed: October 16, 2019
    Date of Patent: December 28, 2021
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Stephan Pindl, Daniel Lugauer, Dominic Maier, Alfons Dehe
  • SYSTEM AND METHOD FOR A TRANSDUCER IN AN EWLB PACKAGE
    Publication number: 20200051824
    Abstract: According to an embodiment, a sensor package includes an electrically insulating substrate including a cavity in the electrically insulating substrate, an ambient sensor, an integrated circuit die embedded in the electrically insulating substrate, and a plurality of conductive interconnect structures coupling the ambient sensor to the integrated circuit die. The ambient sensor is supported by the electrically insulating substrate and arranged adjacent the cavity.
    Type: Application
    Filed: October 16, 2019
    Publication date: February 13, 2020
    Inventors: Stephan Pindl, Daniel Lugauer, Dominic Maier, Alfons Dehe
  • System and method for a transducer in an eWLB package
    Patent number: 10546752
    Abstract: According to an embodiment, a sensor package includes an electrically insulating substrate including a cavity in the electrically insulating substrate, an ambient sensor, an integrated circuit die embedded in the electrically insulating substrate, and a plurality of conductive interconnect structures coupling the ambient sensor to the integrated circuit die. The ambient sensor is supported by the electrically insulating substrate and arranged adjacent the cavity.
    Type: Grant
    Filed: December 20, 2018
    Date of Patent: January 28, 2020
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Stephan Pindl, Daniel Lugauer, Dominic Maier, Alfons Dehe
  • System and Method for a Transducer in an eWLB Package
    Publication number: 20190148253
    Abstract: According to an embodiment, a sensor package includes an electrically insulating substrate including a cavity in the electrically insulating substrate, an ambient sensor, an integrated circuit die embedded in the electrically insulating substrate, and a plurality of conductive interconnect structures coupling the ambient sensor to the integrated circuit die. The ambient sensor is supported by the electrically insulating substrate and arranged adjacent the cavity.
    Type: Application
    Filed: December 20, 2018
    Publication date: May 16, 2019
    Inventors: Stephan Pindl, Daniel Lugauer, Dominic Maier, Alfons Dehe
  • System and method for a transducer in an eWLB package
    Patent number: 10186468
    Abstract: According to an embodiment, a sensor package includes an electrically insulating substrate including a cavity in the electrically insulating substrate, an ambient sensor, an integrated circuit die embedded in the electrically insulating substrate, and a plurality of conductive interconnect structures coupling the ambient sensor to the integrated circuit die. The ambient sensor is supported by the electrically insulating substrate and arranged adjacent the cavity.
    Type: Grant
    Filed: March 31, 2016
    Date of Patent: January 22, 2019
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Stephan Pindl, Daniel Lugauer, Dominic Maier, Alfons Dehe
  • System and Method for a Transducer in an eWLB Package
    Publication number: 20170284951
    Abstract: According to an embodiment, a sensor package includes an electrically insulating substrate including a cavity in the electrically insulating substrate, an ambient sensor, an integrated circuit die embedded in the electrically insulating substrate, and a plurality of conductive interconnect structures coupling the ambient sensor to the integrated circuit die. The ambient sensor is supported by the electrically insulating substrate and arranged adjacent the cavity.
    Type: Application
    Filed: March 31, 2016
    Publication date: October 5, 2017
    Inventors: Stephan Pindl, Daniel Lugauer, Dominic Maier, Alfons Dehe