Patents by Inventor Daniel Lyle Callahan

Daniel Lyle Callahan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Force distributing spring element
    Patent number: 7539027
    Abstract: A force distributor is configured for disposition between a printed circuit board and a stiffening plate, which is spaced from the printed circuit board. The force distributor is configured to distribute a compressive force between the printed circuit board, an interposer and a land grid array module carried on a side of the printed circuit board opposite the stiffening plate. The force distributor comprises a spring element comprising a first portion and a second portion with the first portion extending radially outward from the second portion. The spring element is configured for placement so that the first portion is secured to the stiffening plate and the second portion is biased in unsecured, pressing contact against the printed circuit board.
    Type: Grant
    Filed: October 29, 2007
    Date of Patent: May 26, 2009
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Daniel Lyle Callahan, Raymond Joseph Iannuzzelli, S. Daniel Cromwell, James D. Hensley, Zoila Vega-Marchena
  • Force distributing spring element
    Patent number: 7289335
    Abstract: A force distributor is configured for disposition between a printed circuit board and a stiffening plate, which is spaced from the printed circuit board. The force distributor is configured to distribute a compressive force between the printed circuit board, an interposer and a land grid array module carried on a side of the printed circuit board opposite the stiffening plate. The force distributor comprises a spring element comprising a first portion and a second portion with the first portion extending radially outward from the second portion. The spring element is configured for placement so that the first portion is secured to the stiffening plate and the second portion is biased in unsecured, pressing contact against the printed circuit board.
    Type: Grant
    Filed: July 8, 2003
    Date of Patent: October 30, 2007
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Daniel Lyle Callahan, Raymond Joseph Iannuzzelli, S. Daniel Cromwell, James D. Hensley, Zoila Vega-Marchena