Abstract: Techniques are provided for anonymizing data in a data stream.

Abstract: Techniques are provided for anonymizing data in a data stream.

Abstract: In one example embodiment, a group server includes a processor configured to receive a data quota usage report corresponding to data quota usage by at least one of a plurality of lines, the plurality of lines forming a group subject to a pre-paid data usage agreement with a data service provider and determine a data quota for the at least one of the plurality of lines based on at least the received data quota usage report and an accuracy threshold.

Abstract: In one example embodiment, a group server includes a processor configured to receive a data quota usage report corresponding to data quota usage by at least one of a plurality of lines, the plurality of lines forming a group subject to a pre-paid data usage agreement with a data service provider and determine a data quota for the at least one of the plurality of lines based on at least the received data quota usage report and an accuracy threshold.

Abstract: Methods are provided for metering the usage, on a group of lines subject to a group user agreement, of the data processing capacity of a network. Implementations include steps of receiving usage reports from respective lines of the group at least when usage quotas granted to the lines are exhausted; maintaining a total, over the group, of usage that has been reported by the lines and of outstanding usage quotas that have been granted to the lines; and maintaining a comparison between the total outstanding group quota and a limit that depends on the total reported group usage, so as to detect violation events when said quota violates the limit. Upon occurrence of violation events, instructions for the processors serving respective lines to reallocate quota are sent selectively.

Abstract: A method and apparatus are disclosed for scheduling arriving data packets for input to a switch having a plurality of input channels, and a plurality of output channels, the scheduling method is performed in successive scheduling phases where each scheduling phase further comprises at least log N scheduling iterations. The method is a parallelized weight-driven input queued switch scheduling algorithm which possesses good bandwidth and delay properties, is stable, and can be configured to offer various delay and quality of service (QoS) guarantees. The scheduling method utilizes envelope scheduling techniques and considers partially filled envelopes for scheduling.

Abstract: A method and apparatus are disclosed for scheduling arriving data packets for input to a switch having a plurality of input channels, and a plurality of output channels, the scheduling method is performed in successive scheduling phases where each scheduling phase further comprises at least log N scheduling iterations. The method is a parallelized weight-driven input queued switch scheduling algorithm which possesses good bandwidth and delay properties, is stable, and can be configured to offer various delay and quality of service (QoS) guarantees. The scheduling method utilizes envelope scheduling techniques and considers partially filled envelopes for scheduling.

Abstract: A testing and burn in socket compatible with the high density test pads located at small pitches devices on a TAB tape. A TAB tape carrier for supporting the TAB tape and a test circuit board having contact pads for electrical communication with the test pads. An alignment fixture positioned between the tape carrier and circuit board and including an opening in alignment between the test pads and the contact pads. A metal in elastomer matrix is positioned in the opening for providing electrical communication between the test pads and the contact pads. A block may be positoned in the openings and contain a plurality of straight parallel electrically conductive pins aligned with the matrix for high frequency tests.

Abstract: A desoldering material with an opening or window shaped so that the base of an electronic component can fit inside the opening while the desoldering material simultaneously contacts all solder joints which bond the component's outer leads to pads on a surface. A first adhesive secures the base to the surface, a second adhesive secures a retraction device to the base, the first adhesive is heated and softened without softening the second adhesive, and the retraction device removes the desoldered component from the surface. The invention is well suited to removing tape-automated-bonded integrated circuits adhesively attached to high density multichip module substrates.

Abstract: A method of replacing a defective electronic component having a plurality of electrical leads bonded to electrical contacts on a support by cutting leads adjacent the bond site, rebonding the stubs to the contacts, replacing the defective component and bonding the leads of the replacement component to the electrical contacts. Preferably, the leads are cut simultaneously with the rebonding of the stubs. The leads may be bonded to the top of the stub or to the side of the stub. A bonding tool is provided for simultaneously cutting a lead and rebonding the resultant stub.

Abstract: A method of replacing a defective electronic component having a plurality of electrical leads bonded to electrical contacts on a support by cutting leads adjacent the bond site, rebonding the stubs to the contacts, replacing the defective component and bonding the leads of the replacement component to the electrical contacts. Preferably, the leads are cut simultaneously with the rebonding of the stubs. The leads may be bonded to the top of the stub or to the side of the stub. A bonding tool is provided for simultaneously cutting a lead and rebonding the resultant stub.

Abstract: A method and apparatus are described for the removal of solder mounted surface mount electronic components which includes the removal of old solder, broken leads, and the electronic component without damaging other devices on the substrate. A desoldering braid is shaped to cover each of the electronic component's outer lead bonds without contacting the component's base. The desoldering braid is heated and brought in contact with the bonds until the solder flows into the desoldering braid and any broken outer leads attach to the desoldering braid. Upon removal of the desoldering braid the electronic component can be lifted off the surface. The desoldered solder joints will contain a thin uniform coating of solder less than approximately 50 micro inches thick. This allows for removal and replacement of solder mounted electronic components with leads on center lines spaced less than 0.020 inches.

Abstract: Forming a body of insulating material with a shelf and an opening therethrough with a plurality of electrical conductors extending from the shelf to the exterior of the body. A plurality of tape automated bounding leads are placed in the opening in which the inner ends of the leads are connected together. The outer ends of the leads are aligned with the electrical conductors and bonded thereto and the inner ends of the leads are disconnected from each other. An electronic component is bonded to a bottom cover, aligned in the opening, and the inner ends of the leads are bonded to the electrical component. The bottom and a top cover are sealably connected to the body enclosing the opening and the electronic component.

Abstract: A method and apparatus of bonding two electrical members together uses a pulsed YAG laser. Various apparatus and methods may be used to hold the electrical members in contact under pressure to insure uniform bonding. Automation production equipment provides for the automatic bonding of the flat electrical leads of a TAB tape to the flat electrical bumps on a plurality of integrated circuit dies.

Abstract: A single point bonding apparatus and method for bonding one electrical conductor to a second electrical conductor by a thermosonic process using force, time, temperature and ultrasonic energy as the key parameters in forming the bonds. A bonding tool has a tip with a multiple of nonparallel surfaces extending from the end of the tip for maximizing the amount of ultrasonic energy coupled to the electrical conductors. The surfaces may be recessed into the end of the tip or protrude outwardly from the end of the tip for coupling ultrasonic energy in directions both parallel and perpendicular to the conductors.

Abstract: Disclosed is an IC package for connecting one set of nodes on an IC chip to another corresponding set of nodes on a circuit board. Each interconnection is made with a single C-shaped lead which is bonded at one end to a node on the chip. These leads extend outward from the periphery of the chip's surface, then perpendicular to and away from the chip's surface, and then inwards towards each other. A heat sink attaches to the back of the chip. The chip, an adjacent portion of the heat sink, and the outward extending portion of the leads are then encapsulated with a solid mass to hold them rigidly in place.

Abstract: An improved chip carrier of thin dieletric deformed into a dish configuration provided with flexible mounting flanges on which are plated or bonded solderable conductive traces and paths together with plated or bonded heat sinks which may be referenced to ground potential, and which provides structural integrity.