Abstract: A cooling system for cooling an interface card is provided. The cooling system comprises a thermal conductive housing wrapping around a carrier of the interface card and the electronic devices thereon. A pair of fans are set up on the housing to provide a flow of air inside the space between the housing and the carrier so that the heat generated by the operating devices are rapidly carried away. In addition, a fin type heat sink can be incorporated into the space between the housing and the electronic devices to increase the amount of heat transferred away from the operating devices.

Abstract: A cooling system for cooling an interface card is provided. The cooling system comprises a thermal conductive housing wrapping around a carrier of the interface card and the electronic devices thereon. A pair of fans are set up on the housing to provide a flow of air inside the space between the housing and the carrier so that the heat generated by the operating devices are rapidly carried away. In addition, a fin type heat sink can be incorporated into the space between the housing and the electronic devices to increase the amount of heat transferred away from the operating devices.

Abstract: An integrated apparatus for thermal dissipation suitable for the thermal dissipation of the display chip and the memory chip on a display card. It comprises a baseboard, which contains the first side and the second side. The sets of first and second fins are located on the first side in which the first set is perpendicular to the first side and the second set forms an angle other than 90 degrees with the first side. The second side is in contact with both the display chip and the memory chip. A board hook is located on one side of baseboard that clamps on the edge of the display card. As well as, a fan is located on the first side between the sets of first and second fins.