Patents by Inventor Daniel M. Seiler

Daniel M. Seiler has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200290010
    Abstract: A structured packing arrangement for reducing vapor bypass in the gaps between the edges of structured packing elements or bricks and the packed distillation column wall is provided. The structured packing arrangement includes a high pressure drop shroud attached to portions of the perimeter of the structured packing elements and in the gap between the edge of the structured packing elements and the interior surface of the distillation column wall. The high pressure drop shroud urges the ascending vapor flowing at or near the edges of the structured packing elements to stay within the structured packing elements instead of escaping through the side of the structured packing toward the distillation column wall.
    Type: Application
    Filed: March 14, 2019
    Publication date: September 17, 2020
    Inventors: Arya Ayaskanta, Paul William Belanger, Daniel M. Seiler, Kirk F. Larson, Di Song