Abstract: A connector holder can comprise a main portion for attaching a first electrical connector of the electrical connection assembly thereto or having the first electrical connector attached thereto, a second electrical connector being connectable to the first electrical connector along an assembly axis, the assembly axis extending along the attachment of the first electrical connector to the main portion. The connector holder can comprise at least two attachment portions for attaching the connector holder to a base assembly part of the electrical connection assembly, and at least two spring portions, each of the spring portions being connected to a respective one of the attachment portions and having a spring characteristic to allow movement of the main portion in a movement plane oblique to the assembly axis when the connector holder is attached to the base assembly part via the attachment portions.

Abstract: A method is described for coating a substrate to provide a controlled in-plane compositional modulation, in which first and second targets are activated, with one of the targets being activated by a series of activation pulses to release particles by pulsed evaporation, sublimation, or sputtering that impinge onto the substrate for coating thereof, while the other one of the targets is substantially passive.

Abstract: The present disclosure provides a method of coating a substrate so as to provide a controlled in-plane compositional modulation. The method comprises providing a first target of a first material or material composition, providing a second target (104, 204, 304) of a second material or material composition, different from the first material or material composition; activating the first and second targets (103, 104; 203 204; 303, 304) to release particles by evaporation, sublimation or sputtering; and causing the released particles to impinge onto the substrate (102, 202, 302) such that the substrate is coated. Activation of one of the targets (103, 104; 203 204; 303, 304) includes providing a series of activation pulses, such that pulsed evaporation, sublimation or sputtering of particles is provided, while the other one of the targets (103, 104; 203 204; 303, 304) is substantially passive.