Abstract: A sensor device is provided for detecting electrical defects in a device under test (DUT). The sensor device includes a signal line configured to conduct a stimulus signal through a first conductor in the DUT; an inductor connected in series with the signal line for providing an inductance; and a ground line arranged adjacent to the signal line and configured to provide a ground path through a second conductor in the DUT for the stimulus signal conducted through the signal line and the first conductor. A resonance frequency for the signal line is determined based on the inductance and an effective capacitance of the signal line generated in response to the stimulus signal. An increase in the resonance frequency indicates an open defect in the first conductor and/or the second conductor, and a decrease in the resonance frequency indicates a short defect between the first conductor and the second conductor.

Abstract: Illustrative embodiments disclosed herein pertain to a testing apparatus for performing in-circuit tests upon a printed circuit board assembly. Each of these tests may require the use of a set of probes arranged in a customized layout. This is traditionally accomplished by using a set of predefined probe plates, some or all of which may include probes that are either redundant or duplicated amongst the various probe plates, thereby introducing an undesirable cost penalty. A testing apparatus in accordance with the disclosure incorporates a configurable probe fixture that includes a docking plate configured to support a first set of probe modules for carrying out a first test upon a printed circuit board assembly. Some or all of the probe modules can then be selectively removed or replaced by other probe modules for reconfiguring the testing apparatus to carry out other tests upon the printed circuit board assembly.

Abstract: Illustrative embodiments disclosed herein pertain to a testing apparatus for performing in-circuit tests upon a printed circuit board assembly. Each of these tests may require the use of a set of probes arranged in a customized layout. This is traditionally accomplished by using a set of predefined probe plates, some or all of which may include probes that are either redundant or duplicated amongst the various probe plates, thereby introducing an undesirable cost penalty. A testing apparatus in accordance with the disclosure incorporates a configurable probe fixture that includes a docking plate configured to support a first set of probe modules for carrying out a first test upon a printed circuit board assembly. Some or all of the probe modules can then be selectively removed or replaced by other probe modules for reconfiguring the testing apparatus to carry out other tests upon the printed circuit board assembly.