Abstract: A sensor assembly for determining rotational angular displacement of a first moving component in a machine relative to a second component in the machine includes a base, a magnet housing, and a flexible member. The base is configured to be rigidly secured to the first moving component for movement therewith. The base defines a first axis of rotation. The magnet housing supports a sensor magnet and is rotatably received in the second component. The magnet housing defines a second axis of rotation. The flexible member has a first end rigidly secured to the magnet housing coaxially with the first axis of rotation. A second end of the flexible member is rigidly secured to the magnet housing coaxially with the second axis of rotation. A flexible body portion of the flexible member is capable of accommodating misalignment between the first and second axes of rotation.

Abstract: A roller bearing assembly (10) comprising radially inner and outer bearing races (20, 30) with a plurality of roller bearings (40) positioned therebetween. A first plurality of gear teeth (52) are provided in the outer bearing race (20). A second plurality of gear teeth (52) are provided in the inner bearing race (30) in alignment with the first plurality of gear teeth (52).

Abstract: A chain tensioner comprising a support member configured to support a stop bar for axial movement. A ratchet engages the support bar and is configured to permit axial movement of the stop bar in a first direction and prevent axial movement of the stop bar in a second, opposite direction. A shuttle assembly including a tensioning wheel is interconnected to the stop bar such that the shuttle assembly is axially moveable relative to the stop bar over a limited range of motion. A biasing member is configured to bias the shuttle assembly in the second direction.

Abstract: A variable stiffness bearing utilizing piezoelectric means for applying a variable preload force to the bearing. The preferred embodiment employs piezoelectric wafers having alternating power and ground connections to the wafers to allow the wafers to distort in direct proportion to the potentials applied. Increased potentials result in greater distortion, more preload force, and a stiffer bearing.