Abstract: A MEMS microphone includes a substrate, a lower membrane supported on the substrate, an upper membrane suspended above the lower membrane, a first electrode supported on the lower membrane, and a second electrode supported on the upper membrane. The lower membrane and the upper membrane enclose a cavity in which the first electrode and the second electrode are located. The lower membrane and the upper membrane are each formed of silicon carbonitride (SiCN). The first electrode and the second electrode are each formed of polysilicon.

Abstract: A MEMS microphone system comprises a transducer die having a pierce-less diaphragm and a motion sensor suspended from the diaphragm. The system further comprises a housing and the diaphragm divided a volume inside the housing into a front volume and a back volume. The motion sensor suspended from the diaphragm is located in the back volume having a gas pressure that is substantially equal or lower than an ambient pressure.

Abstract: A MEMS microphone system comprises a transducer die having a pierce-less diaphragm and a motion sensor suspended from the diaphragm. The system further comprises a housing and the diaphragm divided a volume inside the housing into a front volume and a back volume. The motion sensor suspended from the diaphragm is located in the back volume having a gas pressure that is substantially equal or lower than an ambient pressure.

Abstract: A microphone system includes first diaphragm element, second diaphragm element spaced apart from the first diaphragm element and connected to the first diaphragm element via a spacer. Disposed between the diaphragm elements is a plate capacitor element.

Abstract: A MEMS microphone system with encapsulated movable electrode is provided. The MEMS microphone system comprises a MEMS sensor having an access channel, a plug, and first and second members. The access channel configured to receive the plug is formed on at least one of the first and second member. A vacuum having a pressure different from a pressure outside the MEMS sensor is formed between the first and second members.

Abstract: A MEMS microphone system comprises a transducer die having a pierce-less diaphragm and a motion sensor suspended from the diaphragm. The system further comprises a housing and the diaphragm divided a volume inside the housing into a front volume and a back volume. The motion sensor suspended from the diaphragm is located in the back volume having a gas pressure that is substantially equal or lower than an ambient pressure.

Abstract: A MEMS microphone includes a substrate, a lower membrane supported on the substrate, an upper membrane suspended above the lower membrane, a first electrode supported on the lower membrane, and a second electrode supported on the upper membrane. The lower membrane and the upper membrane enclose a cavity in which the first electrode and the second electrode are located. The lower membrane and the upper membrane are each formed of silicon carbonitride (SiCN). The first electrode and the second electrode are each formed of polysilicon.

Abstract: A MEMS microphone system comprises a transducer die having a pierce-less diaphragm and a motion sensor suspended from the diaphragm. The system further comprises a housing and the diaphragm divided a volume inside the housing into a front volume and a back volume. The motion sensor suspended from the diaphragm is located in the back volume having a gas pressure that is substantially equal or lower than an ambient pressure.

Abstract: A MEMS microphone system with encapsulated movable electrode is provided. The MEMS microphone system comprises a MEMS sensor having an access channel, a plug, and first and second members. The access channel configured to receive the plug is formed on at least one of the first and second member. A vacuum having a pressure different from a pressure outside the MEMS sensor is formed between the first and second members.

Abstract: A microphone system includes first diaphragm element, second diaphragm element spaced apart from the first diaphragm element and connected to the first diaphragm element via a spacer. Disposed between the diaphragm elements is a plate capacitor element.

Abstract: The invention relates to a method for producing a large variety of photoresist structures, wherein a volume of photosensitive material (5) is exposed at least once by means of at least two light beams (1, 2), which are superposed inside the photosensitive material (5), and is subsequently subjected to a developing process, wherein the light beams (1, 2) penetrate at least one transparent optical element (3). The optical element (3) is a polyhedron with planar or curved surfaces which largely prevents refraction of the light beams on the surface of the volume of photosensitive material (5) when the beams are fed-in and/or fed-out of the volume of photosensitive material (5), so that the angle of refraction for the light beams (1, 2) can be greater in the volume of photosensitive material (5) than the critical angle of the total reflection, which has a limiting effect without optical element (3).

Abstract: The invention relates to a method for producing a large variety of photoresist structures, wherein a volume of photosensitive material (5) is exposed at least once by means of at least two light beams (1, 2), which are superposed inside the photosensitive material (5), and is subsequently subjected to a developing process, wherein the light beams (1, 2) penetrate at least one transparent optical element (3). The optical element (3) is a polyhedron with planar or curved surfaces which largely prevents refraction of the light beams on the surface of the volume of photosensitive material (5) when the beams are fed-in and/or fed-out of the volume of photosensitive material (5), so that the angle of refraction for the light beams (1, 2) can be greater in the volume of photosensitive material (5) than the critical angle of the total reflection, which has a limiting effect without optical element (3).