Patents by Inventor Daniel Minas Manoukian

Daniel Minas Manoukian has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8941457
    Abstract: Magnetic components such as power inductors for circuit board applications include pressure laminate constructions involving flexible dielectric sheets that may integrally include magnetic powder materials. The dielectric sheets may be pressure laminated around a coil winding in an economical and reliable manner, with performance advantages over known magnetic component constructions.
    Type: Grant
    Filed: April 23, 2010
    Date of Patent: January 27, 2015
    Assignee: Cooper Technologies Company
    Inventors: Yipeng Yan, Robert James Bogert, Daniel Minas Manoukian
  • Patent number: 8484829
    Abstract: Methods of manufacturing low profile magnetic components configured as a power management devices for an electrical system of an electronic device involve prefabricated coil windings assembled with a plurality of flexible dielectric sheet layers, and laminating the plurality of flexible dielectric sheets around the prefabricated coil windings to form a dielectric body having a low profile chip configuration attachable to the electronic device.
    Type: Grant
    Filed: March 16, 2010
    Date of Patent: July 16, 2013
    Assignee: Cooper Technologies Company
    Inventors: Daniel Minas Manoukian, Robert James Bogert
  • Patent number: 8310799
    Abstract: A transient voltage suppression device includes a dielectric layer defining a receptacle for a variable impedance material proximate a gapped electrode. Methods for manufacturing the device and for formulating a variable voltage material at lower cost and with higher manufacturing yields is also provided.
    Type: Grant
    Filed: June 22, 2009
    Date of Patent: November 13, 2012
    Assignee: Cooper Technologies Company
    Inventors: Kyle Yun-Su Kim, Hundi Panduranga Kamath, Daniel Minas Manoukian
  • Publication number: 20100259352
    Abstract: Magnetic components such as power inductors for circuit board applications include pressure laminate constructions involving flexible dielectric sheets that may integrally include magnetic powder materials. The dielectric sheets may be pressure laminated around a coil winding in an economical and reliable manner, with performance advantages over known magnetic component constructions.
    Type: Application
    Filed: April 23, 2010
    Publication date: October 14, 2010
    Inventors: Yipeng Yan, Robert James Bogert, Daniel Minas Manoukian
  • Patent number: 7791445
    Abstract: A low profile magnetic component with planar coil portion, polymer-based supporting structure and methods of fabrication.
    Type: Grant
    Filed: September 12, 2006
    Date of Patent: September 7, 2010
    Assignee: Cooper Technologies Company
    Inventors: Daniel Minas Manoukian, Robert James Bogert
  • Publication number: 20100171581
    Abstract: A low profile magnetic component with planar coil portion, polymer-based supporting structure and methods of fabrication.
    Type: Application
    Filed: March 16, 2010
    Publication date: July 8, 2010
    Applicant: COOPER TECHNOLOGIES COMPANY
    Inventors: Daniel Minas Manoukian, Robert James Bogert
  • Publication number: 20090257166
    Abstract: A transient voltage suppression device includes a dielectric layer defining a receptacle for a variable impedance material proximate a gapped electrode. Methods for manufacturing the device and for formulating a variable voltage material at lower cost and with higher manufacturing yields is also provided.
    Type: Application
    Filed: June 22, 2009
    Publication date: October 15, 2009
    Applicant: COOPER TECHNOLOGIES COMPANY
    Inventors: Kyle Yun-Su Kim, Hundi Panduranga Kamath, Daniel Minas Manoukian
  • Patent number: 7567416
    Abstract: A transient voltage suppression device includes a dielectric layer defining a receptacle for a variable impedance material proximate a gapped electrode. Methods for manufacturing the device and for formulating a variable voltage material at lower cost and with higher manufacturing yields is also provided.
    Type: Grant
    Filed: July 21, 2005
    Date of Patent: July 28, 2009
    Assignee: Cooper Technologies Company
    Inventors: Kyle Yun-Su Kim, Hundi Panduranga Kamath, Daniel Minas Manoukian
  • Patent number: 7436284
    Abstract: A low resistance fuse includes a polymer membrane, a fuse element layer formed on the polymer membrane, and first and second intermediate insulation layers extending on opposite sides of the fuse element layer and coupled thereto. At least one of the first and second intermediate insulation layers comprises an opening therethrough, and the polymer membrane supports the fuse element layer in the opening. A heat sink, heater elements, and arc quenching media may be used in combination with the fuse, and the fuse may be fabricated with an adhesive lamination process.
    Type: Grant
    Filed: January 29, 2004
    Date of Patent: October 14, 2008
    Assignee: Cooper Technologies Company
    Inventors: Joan Leslie Winnett Bender, Daniel Minas Manoukian
  • Publication number: 20080218305
    Abstract: A low resistance fuse apparatus and methods of manufacture includes a first intermediate insulation layer, a second intermediate insulation layer, and a free standing fuse element layer independently formed and fabricated from each of the first and second intermediate insulation layers, The fuse element layer includes first and second contact pads and a fusible link extending therebetween. The first and second intermediate insulation layers extend on opposite sides of the free standing fuse element layer and are laminated together with the fuse element layer therebetween.
    Type: Application
    Filed: May 19, 2008
    Publication date: September 11, 2008
    Applicant: COOPER TECHNOLOGIES COMPANY
    Inventors: Joan Leslie Bender, Hundi Panduranga Kamath, Varinder Kumar Kalra, Daniel Minas Manoukian, Peter York So
  • Patent number: 7385475
    Abstract: A low resistance fuse apparatus and methods of manufacture includes a first intermediate insulation layer, a second intermediate insulation layer, and a free standing fuse element layer independently formed and fabricated from each of the first and second intermediate insulation layers, The fuse element layer includes first and second contact pads and a fusible link extending therebetween. The first and second intermediate insulation layers extend on opposite sides of the free standing fuse element layer and are laminated together with the fuse element layer therebetween.
    Type: Grant
    Filed: February 24, 2005
    Date of Patent: June 10, 2008
    Assignee: Cooper Technologies Company
    Inventors: Joan Leslie Bender, Hundi Panduranga Kamath, Varinder Kumar Kalra, Daniel Minas Manoukian, Peter York So
  • Publication number: 20080061917
    Abstract: A low profile magnetic component with planar coil portion, polymer-based supporting structure and methods of fabrication.
    Type: Application
    Filed: September 12, 2006
    Publication date: March 13, 2008
    Inventors: Daniel Minas Manoukian, Robert James Bogert
  • Publication number: 20040184211
    Abstract: A low resistance fuse includes a polymer membrane, a fuse element layer formed on the polymer membrane, and first and second intermediate insulation layers extending on opposite sides of the fuse element layer and coupled thereto. At least one of the first and second intermediate insulation layers comprises an opening therethrough, and the polymer membrane supports the fuse element layer in the opening. A heat sink, heater elements, and arc quenching media may be used in combination with the fuse, and the fuse may be fabricated with an adhesive lamination process.
    Type: Application
    Filed: January 29, 2004
    Publication date: September 23, 2004
    Inventors: Joan Leslie Winnett Bender, Daniel Minas Manoukian