Patents by Inventor Daniel Minwoo Rhee

Daniel Minwoo Rhee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR PACKAGES AND METHODS FOR FABRICATING SEMICONDUCTOR PACKAGES
    Publication number: 20180290882
    Abstract: According to various embodiments, there is provided a method for fabricating a semiconductor package, the method including forming a cap structure and a pillar from a first wafer; bonding the first wafer to a second wafer; and filling a gap between the pillar and the cap structure with a mold compound.
    Type: Application
    Filed: June 10, 2016
    Publication date: October 11, 2018
    Inventors: Daniel Minwoo Rhee, Peter Hyun Kee Chang