Abstract: Apparatus is provided for a heat transfer assembly for direct attachment to a high heat generating chip, which assembly includes a pump, air side heat exchanger mounted adjacent to a fan and a heat transfer plate which is attached to the high heat generating component for dissipating heat from such component under operating conditions. In another embodiment, apparatus is provided for dissipating heat from a hard disk drive including a U-shaped heat exchange clip resiliently mounted on opposite surfaces of a hard disk drive. In another embodiment, apparatus for dissipating heat from a hard disk drive includes a generally rectangular plate for mounting on the top or bottom of the hard disk drive. And, in another embodiment, apparatus is provided transferring heat from a vertical array of hard disk drives, which apparatus includes one or more panels interposed between adjacent vertically disposed hard disk drives.

Abstract: Apparatus is provided for a heat transfer assembly for direct attachment to a high heat generating chip, which assembly includes a pump, air side heat exchanger mounted adjacent to a fan and a heat transfer plate which is attached to the high heat generating component for dissipating heat from such component under operating conditions. In another embodiment, apparatus is provided for dissipating heat from a hard disk drive including a U-shaped heat exchange clip resiliently mounted on opposite surfaces of a hard disk drive. In another embodiment, apparatus for dissipating heat from a hard disk drive includes a generally rectangular plate for mounting on the top or bottom of the hard disk drive. And, in another embodiment, apparatus is provided transferring heat from a vertical array of hard disk drives, which apparatus includes one or more panels interposed between adjacent vertically disposed hard disk drives.

Abstract: Apparatus is provided for a heat transfer assembly for direct attachment to a high heat generating chip, which assembly includes a pump, air side heat exchanger mounted adjacent to a fan and a heat transfer plate which is attached to the high heat generating component for dissipating heat from such component under operating conditions. In another embodiment, apparatus is provided for dissipating heat from a hard disk drive including a U-shaped heat exchange clip resiliently mounted on opposite surfaces of a hard disk drive. In another embodiment, apparatus for dissipating heat from a hard disk drive includes a generally rectangular plate for mounting on the top or bottom of the hard disk drive. And, in another embodiment, apparatus is provided transferring heat from a vertical array of hard disk drives, which apparatus includes one or more panels interposed between adjacent vertically disposed hard disk drives.

Abstract: An apparatus, such as a computer, comprises a housing having an interior portion into which a printed circuit board may be inserted. The printed circuit board, when inserted, is supported by a support structure. A spring mechanism resiliently supports a heat sink structure in contact with a major side portion of the inserted printed circuit board. During operation, fluid flows in thermal transfer relationship with the heat sink structure. In this manner, heat is transferred from the heat sink structure to the fluid.

Abstract: Operating heat generated by a PCMCIA card inserted into the base housing portion of a computer, representatively a notebook computer, is dissipated by a heat sink system disposed within the base housing. In response to insertion of the card into its associated support structure within the base housing, a metal heat sink plate member is resiliently pressed into firm engagement with a side of the inserted card by a spring member interconnected between the plate member and the card support structure. Card operating heat is efficiently transferred to the metal plate member by conduction. To dissipate the heat received by the plate member, a heat removing fluid is flowed against the plate member and caused to receive heat therefrom. Heat received by the fluid is then transferred to ambient air external to the computer to substantially lower the operating temperature of the inserted PCMCIA card.

Abstract: A notebook computer is provided and has a base housing in which a heat-generating component is located, and a lid housing pivotally secured to the base housing for pivotal movement relative thereto between open and closed positions. A relatively thin, hollow, flexible heat exchanger has a first section positioned in the base housing in heat exchange contact with the heat-generating component, a second section disposed in the lid housing in heat exchange contact therewith, and a flexible third section through which the interiors of the first and second sections are communicated. During operation of the computer, a small motor-driven pump recirculates a cooling liquid through the heat exchanger in a manner causing heat from the heat-generating component to be transferred to liquid in the first heat exchanger section, be carried therewith through the third section into the second section, and be transferred via the second section to the lid housing portion for dissipation therefrom to ambient.

Abstract: Operating heat generated by a PCMCIA card inserted into the base housing portion of a computer, representatively a notebook computer, is dissipated by a heat sink system disposed within the base housing. In response to insertion of the card into its associated support structure within the base housing, a metal heat sink plate member is resiliently pressed into firm engagement with a side of the inserted card by a spring member interconnected between the plate member and the card support structure. Card operating heat is efficiently transferred to the metal plate member by conduction. To dissipate the heat received by the plate member, a heat removing fluid is flowed against the plate member and caused to receive heat therefrom. Heat received by the fluid is then transferred to ambient air external to the computer to substantially lower the operating temperature of the inserted PCMCIA card.