Abstract: A MEMS device includes a substrate; a movable mass suspended in proximity to the substrate; and at least one suspension structure coupled to the movable mass for performing a mechanical spring function. The at least one suspension structure has portions that move in tandem when the MEMS device is subject to at least one stimulus in a sensing direction, and further includes at least one link between the portions that move in tandem.

Abstract: A microelectromechanical systems (MEMS) sensor (52) includes a substrate (62) a movable element (58) spaced apart from the substrate (62), suspension anchors (66, 68, 70, 72) formed on the substrate (62), and compliant members (74) interconnecting the movable element (58) with the suspension anchors. The MEMS sensor (52) further includes fixed fingers (76) and fixed finger anchors (78) attaching the fixed fingers (76) to the substrate (62). The movable element (58) includes openings (64). At least one of the suspension anchors resides in at least one of the multiple openings (64) and pairs (94) of the fixed fingers (76) reside in other multiple openings (64). The MEMS sensor (52) is symmetrically formed, and a location of the fixed finger anchors (78) defines an anchor region (103) within which the suspension anchors (66, 68, 70, 72) are positioned.

Abstract: A microelectromechanical systems (MEMS) component 20 includes a portion 32 of a MEMS structure 30 formed on a semiconductor substrate 34 and a portion 36 of the structure 30 formed in a non-semiconductor substrate 22. The non-semiconductor substrate 22 is in fixed communication with the semiconductor substrate 34 with the portion 32 of the MEMS structure 30 being interposed between the substrates 34 and 22. A fabrication method 96 entails utilizing semiconductor thin-film processing techniques to form the portion 32 on the semiconductor substrate 34, and utilizing a lower cost processing technique to fabricate the portion 36 in the non-semiconductor substrate 22. The portions 32 and 36 are coupled to yield the MEMS structure 30, and the MEMS structure 30 can be attached to another substrate as needed for additional functionality.

Abstract: A stress-isolated MEMS device (14) includes a platform (26) suspended over a substrate wafer (24). In one embodiment, the platform (26) is suspended by springs (38), but other suspension techniques may also be used. A transducer (28) is formed over the platform (26). The transducer (28) includes immovable portions (50) and movable portions (52). The transducer (28) and platform (26) are sealed within a cavity (62) formed within a cap support (30) between a cap wafer (32) and the substrate wafer (24). A leadframe (22) is affixed to the substrate wafer (24). The cap wafer (32) and other portions of the device (14) become embedded in a package material (20) so that a substantially solid boundary forms between the cap wafer (32) and the package material (20).

Abstract: MEMS devices (100) and methods for forming the devices have now been provided. In one exemplary embodiment, the MEMS device (100) comprises a substrate (106) having a surface, an electrode (128) having a first portion coupled to the substrate surface, and a second portion movably suspended above the substrate surface, and a stress-release mechanism (204) disposed on the electrode second portion, the stress-release mechanism (204) including a first slot (208) integrally formed in the electrode. In another exemplary embodiment, the substrate (106) includes an anchor (134, 136) and the stress-release mechanism 222 is formed adjacent the anchor (134, 136).

Abstract: A transducer is provided herein which comprises an unbalanced proof mass (51), and which is adapted to sense acceleration in at least two mutually orthogonal directions. The proof mass (51) has first (65) and second (67) opposing sides that are of unequal mass.

Abstract: A transducer is provided herein which comprises an unbalanced proof mass (51), and which is adapted to sense acceleration in at least two mutually orthogonal directions. The proof mass (51) has first (65) and second (67) opposing sides that are of unequal mass.

Abstract: A sensor has a support substrate (200), an electrode (110, 510, 710) movable relative to a surface (201) of the support substrate (200) and comprised of a first material, a structure (160, 460, 560, 760) over a portion of the electrode (110, 510, 710) to limit mobility of the electrode (110, 510, 710) and comprised of a second material different from the first material, and bonding pads (170, 470) outside a perimeter of the electrode (110, 510, 710) and comprised of the second material.

Abstract: A differential capacitor structure (10) formed overlying a substrate (12) having a middle layer (24) disposed between a lower layer (18) and an upper layer (28). The lower layer (18) is a static layer that is formed on the substrate (12), the middle layer (24) has a moveable component and is a dynamic layer attached to the substrate (12) using semi-circular tether supports (42), and the upper layer is a static layer that is anchored to the substrate (12). The semi-circular tether supports (42) are formed from a homogeneous material and provide structural stiffness to support the middle layer (24) in space and also provide stress relief.

Abstract: An electronic component includes a support substrate (101), a fixed electrode (113) overlying the support substrate (101), a movable electrode (123, 423) overlying the support substrate and the first electrode (113) wherein the first and second electrodes (113, 123, and 423) form a capacitor with a sensing area, an anchor (122, 422) coupled to the support substrate (101), and beams (125, 425) coupling different attachment points (129) of the second electrode (123, 423) to the anchor (122, 422) wherein the different attachment points (129) form a simply connected polygon and wherein a portion of the sensing area is located within the simply connected polygon.

Abstract: A sensor (10) is capable of detecting linear acceleration in the three Cartesian directions and the angular acceleration about three Cartesian axes. The sensor (10) has a conductive layer (32) that is free to move or rotate in any direction. A first, second, and third set of conductors are used to sense and quantify the acceleration of the conductive layer (32). The sensor (10) can also be operated as a closed loop system with the addition of a fourth set of conductors.

Abstract: A sensor (10) is capable of detecting linear acceleration in the three Cartesian directions and the angular acceleration about three Cartesian axes. The sensor (10) has a conductive layer (32) that is free to move or rotate in any direction. A first, second, and third set of conductors are used to sense and quantify the acceleration of the conductive layer (32). The sensor (10) can also be operated as a closed loop system with the addition of a fourth set of conductors.

Abstract: A micromachined structure having at least one anchor that includes a supporting substrate with a first and a second foot fixedly positioned on the surface of the substrate and each foot has a supporting edge, which edges are positioned in parallel spaced apart relationship, an elongated tether positioned in spaced relation from the surface of the substrate and extending from the micromachined structure parallel to the parallel supporting edges of the first and the second foot, and first and second risers extending along the supporting edges of the first foot and the second foot, respectively, and rising upwardly to the edges of the tether. The first and the second foot, the first and second risers and the tether being formed integrally by surface micromachining.

Abstract: A micromachined capacitor structure having a first anchor (12) attached to the substrate (24), a tether (13) coupled to the anchor (12) and having a portion free to move in a lateral direction over the substrate (24) in response to acceleration. A tie-bar (14) is coupled to the movable portion of the tether (13), and at least one movable capacitor plate (16) is coupled to the tie bar (13). A first fixed capacitor plate (16) is attached to the substrate (24) laterally overlapping and vertically spaced from the at least one movable capacitor plate (16).

Abstract: A process for making an inverted silicon-on-insulator semiconductor device having a pedestal structure. After the processing of polysilicon layers, dielectric layers, an epitaxial region and a nitride layer, a second substrate is bonded to the nitride layer and the first substrate is removed. This allows for an epitaxial region which is isolated from the substrate.

Abstract: A method of making a vertical field effect transistor (FET) having a plurality of gates which are isolated from each other. Each gate has a contact thereby enabling a single gate which is turned "on" to cause the vertical FET to conduct a current. This configuration allows for a logical "or" function to be implemented in a vertical FET.

Abstract: A circuit is described that provides a quick charge and discharge of a row of memory cells. A first transistor has its collector-emitter path coupled between a first voltage and a row of memory cells, and a base coupled to an input terminal. A second transistor has its collector-emitter path coupled to the first voltage by a resistor and to a voltage level setting device, and a base coupled to the input terminal. A third transistor has its collector-emitter path coupled between the row of memory cells and a second voltage, and a base coupled to a voltage level shifting device. As the row of memory cells are selected, the third transistor becomes less conductive, thereby sinking less current from the row of memory cells and allowing the inherent capacitance of the row of memory cells to charge more quickly. As the row of memory cells are deselected, the third transistor becomes more conductive, thereby sinking more current from the row of memory cells and discharging the inherent capacitance more quickly.

Abstract: A transient driver circuit for use with a logic circuit having an emitter-follower output stage that sources current to a load connected to an output thereof in response to an applied logic signal being at a first logic level. The transient driver circuit includes a first NPN transistor the collector-emitter path of which is coupled between the output of the logic circuit and the negative power supply rail, a second NPN transistor having its collector-emitter path couple between a positive power supply rail and the collector of the first NPN transistor and its base adapted to receive the logic signal and feedback circuitry that is responsive to a rise in the collector voltage of the second NPN transistor occurring as the logic signal switches to a second logic level for supplying current drive to the base of the first NPN transistor thereby turning it on to sink a large transient current at the output of the logic circuit.

Abstract: An assembly method is described in which low level light is used to align an optical fiber to the emitting area of an LED. When alignment is achieved, the power dissipated by the LED is increased to gel or partially cure an adhesive, thereby securing the aligned fiber to the LED.