Patents by Inventor Daniel Nicholas Sobieski

Daniel Nicholas Sobieski has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10026691
    Abstract: Package substrates including conductive interconnects having noncircular cross-sections, and integrated circuit packages incorporating such package substrates, are described. In an example, a conductive pillar having a noncircular pillar cross-section is electrically connected to an escape line routing layer. The escape line routing layer may include several series of conductive pads having noncircular pad cross-sections. Accordingly, conductive traces, e.g., strip line escapes and microstrip escapes, may be routed between the series of conductive pads in a single escape line routing layer.
    Type: Grant
    Filed: June 13, 2016
    Date of Patent: July 17, 2018
    Assignee: Intel Corporation
    Inventors: Kristof Kuwawi Darmawikarta, Kyu Oh Lee, Daniel Nicholas Sobieski
  • Publication number: 20170358528
    Abstract: Package substrates including conductive interconnects having noncircular cross-sections, and integrated circuit packages incorporating such package substrates, are described. In an example, a conductive pillar having a noncircular pillar cross-section is electrically connected to an escape line routing layer. The escape line routing layer may include several series of conductive pads having noncircular pad cross-sections. Accordingly, conductive traces, e.g., strip line escapes and microstrip escapes, may be routed between the series of conductive pads in a single escape line routing layer.
    Type: Application
    Filed: June 13, 2016
    Publication date: December 14, 2017
    Inventors: Kristof Kuwawi Darmawikarta, Kyu Oh Lee, Daniel Nicholas Sobieski