Abstract: Method and apparatus for immersion plating using a vat separated by a baffle into a reservoir of plating liquid joined through a port in the baffle and weir to a plating section into which having closely spaced and parallel anode and cathode beneath which a continuously flowing sheet of fluid is upwardly directed to flow into and between the cathode and anode, around all their edges and back through the port and weir to the reservoir. Plating currents of 130 ASF and plating times of under ten minutes have been achieved.

Abstract: A printed circuit which may be highly flexible in configuration and design includes at least one uniformly thick, planar circuit layer including a conductive circuit pattern and an insulating circuit pattern of a cured, flowable insulating material. The printed circuit may include multiple circuit layers that are selectively electrically connected to other layers and may provide circuit patterns, mechanically supportive insulator patterns and windows in almost any desired configuration. The printed circuit may be bonded to a substrate in a high thermal transfer configuration, implemented as a film carrier having plated conductors extending from the surface to receive directly pads of integrated circuit chips or used as a high strength, low coefficient of thermal expansion flexible cable.

Abstract: The method of manufacturing printed circuitry with sufficiently high resolution to permit line densities of at least 1 mil lines on 3 mil centers includes the steps of placing a thickness of dry film photoresist on a smooth, polished substrate or carrier optionally, applying a thin lubricating layer of spray wax to the exposed surface of the photoresist, wringing a mask defining a desired conductive circuit pattern into high integrity, intimate contact with the surface of the resist, exposing and developing the resist to remove the resist from the smooth surface in regions where the conductive circuit pattern is to be formed, electroplating the conductors within the voids formed in the resist; removing all remaining resist, laminating a flowable dielectric material to the smooth surface of the substrate and the conductive circuit pattern, and removing the laminate material and conductive circuit pattern from the smooth surface.