Abstract: Methods and apparatus for recovery and reuse of reagents are provided herein. In some embodiments, a system for processing substrates may include a process chamber for processing a substrate; a reagent source coupled to the process chamber to provide a reagent to the process chamber; and a reagent recovery system to collect, and at least one of purify or concentrate the reagent recovered from an effluent exhausted from the process chamber. In some embodiments, a method for recovering unreacted reagent may include providing reagent from a reagent source to a process chamber; exposing a substrate disposed in the process chamber to the reagent, forming an effluent; exhausting the effluent from the process chamber; and recovering unreacted reagent from the effluent in a reagent recovery system.

Abstract: A flame sensor apparatus for use with a flame heated thermal abatement reactor is provided, including a flame sensor adapted to sense a flame within the thermal abatement reactor; and a shutter adapted to selectively block the transmission of radiation from the flame to the flame sensor.

Abstract: The present invention relates to systems and methods for controlled combustion and decomposition of gaseous pollutants while reducing deposition of unwanted reaction products from within the treatment systems. The systems include a novel thermal reaction chamber design having stacked reticulated ceramic rings through which fluid, e.g., gases, may be directed to form a boundary layer along the interior wall of the thermal reaction chamber, thereby reducing particulate matter buildup thereon. The systems further include the introduction of fluids from the center pilot jet to alter the aerodynamics of the interior of the thermal reaction chamber.

Abstract: Methods and apparatus for enhanced control, monitoring and recording of incoming chemical and power use, and emissions of electronic device manufacturing systems are provided. In some embodiments, integrated sub-fab system systems may monitor the energy usage of the sub-fab equipment. The tool can enter many different depths of energy savings modes such as idle (shallow energy savings where production equipment can recover to normal production with no quality or throughput impact in seconds), sleep (deeper energy savings where production equipment can recover in minutes), or hibernate (where production equipment may require hours to recover not to have impact on quality, or throughput) for the system. In some embodiments, the system may monitor and display all gas emissions in a sub-fab as well as the Semi S23 method reporting of CO2 equivalent emission. The system may monitor effluent process gases and energy use from the process tool and sub-fab equipment.

Abstract: Methods and apparatus for treating an exhaust gas in a foreline of a substrate processing system are provided herein. In some embodiments, an apparatus for treating an exhaust gas in a foreline of a substrate processing system includes a plasma source coupled to a foreline of a process chamber, a reagent source coupled to the foreline upstream of the plasma source, and a foreline gas injection kit coupled to the foreline to controllably deliver a gas to the foreline, wherein the foreline injection kit includes a pressure regulator to set a foreline gas delivery pressure setpoint, and a first pressure gauge coupled to monitor a delivery pressure of the gas upstream of the foreline.

Abstract: Methods and apparatus for enhanced control over electronic device manufacturing systems are provided herein. In some embodiments, an integrated sub-fab system in accordance with the present invention may be provided with fixed or real time power factor management, correction, reporting, and tabulation. Such a system could also be used by any industry consuming significant levels of power. The integrated sub-fab system power management could be extended to other parts of the factory where high levels of power are used.

Abstract: The present invention generally relates to apparatus and method for recycling both polishing slurry and rinse water from CMP processes. The present invention also relates to rheology measurements and agglomeration prevention using centrifugal pumps.

Abstract: Methods and apparatus for recovering hydrogen fluoride (HF) are provided herein. In some embodiments, an apparatus includes a system for processing substrates, including a process chamber for processing a substrate; a fluorine generator coupled to the process chamber to provide fluorine (F2) thereto; an abatement system coupled to the process chamber to abate fluorine-containing effluents exhausted from the process chamber and to convert at least a portion of the fluorine-containing effluents into hydrogen fluoride (HF); an HF recovery system configured to at least one of collect, purify, or concentrate the HF converted by the abatement system; and a conduit for providing the recovered hydrogen fluoride (HF) to the fluorine generator or another application in the manufacturing process.

Abstract: Methods and apparatus for treating effluents in process systems are provided In some embodiments, a system for treating effluent includes a process chamber having a processing volume; an exhaust conduit coupled to the process chamber to remove an effluent from the processing volume; and a reactive species generator coupled to the exhaust conduit to inject a reactive species into the exhaust conduit to treat the effluent, wherein the reactive species generator generates a reactive species comprising at least one of singlet hydrogen, hydrogen ions or hydrogen radicals. In some embodiments, a method for treating effluent includes flowing an effluent from a processing volume of a process system through an exhaust conduit fluidly coupled to the processing volume; treating the effluent in the exhaust conduit with a reactive species comprising at least one of singlet hydrogen, hydrogen ions, or hydrogen radicals; and flowing the treated effluent to an abatement system.

Abstract: Embodiments of an abatement apparatus are disclosed herein. In some embodiments, an abatement apparatus may include a scrubber configured to receive an effluent stream from a process chamber and further configured to remove first particles from the effluent stream; a scrubber conduit coupled to the scrubber to receive the effluent stream therefrom and configured to remove second particles from the effluent stream, the scrubber conduit having one or more inlets configured to provide a fluid to sufficiently wet an interior surface of the scrubber conduit to trap the second particles thereon and to wash the second particles therealong; and a central scrubber coupled to the scrubber via the scrubber conduit. In some embodiments, the scrubber conduit is downward sloping from the scrubber to the central scrubber. In some embodiments, a plurality of scrubbers may be coupled to the central scrubber via a plurality of scrubber conduits.

Abstract: A thermal reactor for use during the abatement of a semiconductor manufacturing process is provided, including a thermal reaction unit having: an interior porous wall that defines a central chamber, the interior porous wall formed from a plurality of stacked porous sections; at least one gas inlet in fluid communication with the central chamber and adapted to introduce gaseous waste stream to the central chamber; a thermal mechanism positioned within the central chamber and adapted to decompose the gaseous waste stream within the central chamber, thereby forming reaction products; and a fluid delivery system adapted to provide a fluid to the central chamber through the interior porous wall at a sufficient force to reduce deposition of reaction products on an inner surface of the interior porous wall of the central chamber; wherein at least one of the porous sections has one or more of: a property that varies within the porous section; and a property that differs from a property of at least one other porous se

Abstract: The present invention relates to systems and methods for controlled combustion and decomposition of gaseous pollutants while reducing deposition of unwanted reaction products from within the treatment systems. The systems include a novel thermal reaction chamber design having stacked reticulated ceramic rings through which fluid, e.g., gases, may be directed to form a boundary layer along the interior wall of the thermal reaction chamber, thereby reducing particulate matter buildup thereon. The systems further include the introduction of fluids from the center pilot jet to alter the aerodynamics of the interior of the thermal reaction chamber.

Abstract: Embodiments of the present invention generally include a sputtering target capable of substantially reducing the amount of wasted material associated with conventional sputtering targets. In one embodiment, the sputtering target includes a fluidized bed of sputtering material that constantly maintains a planar sputtering surface throughout the sputtering process. In one embodiment, the fluidized bed of sputtering material is either periodically or constantly supplied with sputtering material to both maintain a planar sputtering surface and reduce downtime of the sputtering equipment.

Abstract: Apparatus for improved treatment of effluents are provided herein. In some embodiments, an abatement system may include an exhaust conduit to flow an effluent stream therethrough; a plurality of packed beds disposed in the exhaust conduit to remove non-exhaustible effluents from the effluent stream; one or more spray jets to provide an effluent treating agent between adjacent packed beds, the effluent treating agent to remove non-exhaustible effluents from the effluent stream; and a dripper disposed in the exhaust conduit above an uppermost packed bed to provide the effluent treating agent in large droplets to wet and rinse particulate from an upper surface of the uppermost packed bed substantially without forming fine droplets.

Abstract: Methods and apparatus for recovering heat from disposed effluents are disclosed herein. In some embodiments, an apparatus may include a first process chamber configured for gaseous or liquid processes; a second process chamber configured for liquid processes; and a heat pump having a compressor and a first heat exchanger, wherein the compressor is configured to use a first effluent exhausted from the first process chamber and wherein the first heat exchanger having first and second sides configured to transfer heat therebetween, wherein the first side is configured to flow a liquid reagent therethrough and into the second process chamber, and wherein the second side is configured to flow the pressurized first effluent from the first process chamber therethrough. In some embodiments, a heater may be disposed between the heat pump and the second process chamber to further heat the liquid reagent prior to entering the second process chamber.

Abstract: In certain embodiments, an apparatus is provided for use in removing pollutants from a gas stream. The apparatus includes a thermal reaction unit formed from a plurality of stacked porous ceramic rings. At least one of the stacked ceramic sections may be adapted to allow sensing of a characteristic of contents of the central chamber. In some embodiments, waste gas inlets to the thermal reaction unit may be angled to create a helical vortex within the thermal reaction unit. Other aspects are provided.

Abstract: The present invention relates to a thermal reactor apparatus used to treat industrial effluent fluids, for example waste effluent produced in semiconductor and liquid crystal display manufacturing processes. Specifically, the present invention relates to improved monitoring and control features for the thermal reactor apparatus, including a flame sensing device, an intrinsically safe flammable gas sensing device, and a sequential mode of operation having built-in safety redundancy. The improved monitoring and control features ensure the safe and efficient abatement of waste effluent within the thermal reactor apparatus.

Abstract: A thermal abatement system is provided, including: a thermal abatement reactor; an inlet in fluid communication with the reactor; a process chamber in fluid communication with the inlet; a first sheathing fluid source in fluid communication with the inlet; a first flow control device, adapted to regulate a flow of a first sheathing fluid from the first sheathing fluid source; and a controller, in signal communication with the first flow control device, adapted to regulate the sheathing fluid by operating the first flow control device; wherein the inlet is adapted to receive an effluent stream from the process chamber and the first sheathing fluid from the first sheathing fluid source, to sheathe the effluent stream with the first sheathing fluid to form a sheathed effluent stream, and to introduce the sheathed effluent stream into the reactor.

Abstract: In some aspects, an apparatus for abating effluent from an electronic device manufacturing process tool is provided, including: a reaction chamber adapted to receive an effluent; and a reagent heating apparatus in fluid connection with the reaction chamber; wherein the reagent heating apparatus is adapted to heat a reagent and to introduce the heated reagent into a heated reagent reaction zone of the reaction chamber; and wherein the reaction chamber is further adapted to mix the effluent and the heated reagent in the heated reagent reaction zone. Other apparatus and methods are disclosed.

Abstract: A method for operating an electronic device manufacturing system is provided, including: introducing an inert gas into a process tool vacuum pump at a first flow rate while the process tool is operating in a process mode; and introducing the inert gas into the process tool vacuum pump at a second flow rate while the process tool is operating in a clean mode. Numerous other embodiments are provided.