Patents by Inventor Daniel Obermeier

Daniel Obermeier has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor package and method for fabricating a semiconductor package
    Patent number: 11410906
    Abstract: A semiconductor package for double sided cooling includes a first and a second carrier facing each other, at least one power semiconductor chip arranged between the first and second carriers, external contacts arranged at least partially between the first and second carriers, and spring elements arranged between the first and second carriers and configured to keep the first and second carriers at a predefined distance from each other.
    Type: Grant
    Filed: June 10, 2020
    Date of Patent: August 9, 2022
    Assignee: Infineon Technologies AG
    Inventors: Juergen Hoegerl, Bernd Betz, Stephan Bradl, Daniel Obermeier
  • Semiconductor Package and Method for Fabricating a Semiconductor Package
    Publication number: 20200395266
    Abstract: A semiconductor package for double sided cooling includes a first and a second carrier facing each other, at least one power semiconductor chip arranged between the first and second carriers, external contacts arranged at least partially between the first and second carriers, and spring elements arranged between the first and second carriers and configured to keep the first and second carriers at a predefined distance from each other.
    Type: Application
    Filed: June 10, 2020
    Publication date: December 17, 2020
    Inventors: Juergen Hoegerl, Bernd Betz, Stephan Bradl, Daniel Obermeier