Abstract: At least some embodiments are directed to a system that comprises storage comprising a data structure that cross-references an identifier of a semiconductor wafer, a location of a die in the wafer, an identifier of a lead frame strip, a location of a lead frame in the lead frame strip, and results of a first test on the die. The system also comprises mechanical equipment configured to test packaged die. The system further comprises a processor, coupled to the storage and to the mechanical equipment, configured to perform a second test on a package containing the die and the lead frame using the mechanical equipment and the results of the first test.

Abstract: At least some embodiments are directed to a system that comprises storage comprising a data structure that cross-references an identifier of a semiconductor wafer, a location of a die in the wafer, an identifier of a lead frame strip, a location of a lead frame in the lead frame strip, and results of a first test on the die. The system also comprises mechanical equipment configured to test packaged die. The system further comprises a processor, coupled to the storage and to the mechanical equipment, configured to perform a second test on a package containing the die and the lead frame using the mechanical equipment and the results of the first test.

Abstract: At least some embodiments are directed to a system that comprises storage comprising a data structure that cross-references an identifier of a semiconductor wafer, a location of a die in the wafer, an identifier of a lead frame strip, a location of a lead frame in the lead frame strip, and results of a first test on the die. The system also comprises mechanical equipment configured to test packaged die. The system further comprises a processor, coupled to the storage and to the mechanical equipment, configured to perform a second test on a package containing the die and the lead frame using the mechanical equipment and the results of the first test.

Abstract: A method and apparatus for cutting a puff extrudate utilizing a first bladed roll and a second bladed roll. The first and second bladed rolls rotate in opposite directions, and work together to cut the extrudate into similarly sized pieces. The blades are positioned on the rolls offset to each other so as to cut the extrudate with a shearing action.

Abstract: A method and apparatus for cutting a puff extrudate utilizing a first bladed roll and a second bladed roll. The first and second bladed rolls rotate in opposite directions, and work together to cut the extrudate into similarly sized pieces. The blades are positioned on the rolls offset to each other so as to cut the extrudate with a shearing action.

Abstract: A method and apparatus for cutting a puff extrudate utilizing a blade that passes through the extrudate while the extrudate is in a viscous melt stage. The present invention utilizes a tube to facilitate production of a curly puff extrudate. A gap is provided in between the tube and the extruder die to allow a blade to access the extrudate as it exits an orifice in the die. The blade accesses the extrudate at the viscous melt stage, before the extrudate has cooled and hardened. The blade nicks the extrudate, as opposed to completely cutting it, which allows the extrudate to remain connected throughout processing such as curling in the containment tube. The gap also allows steam to be vented form the extrudate as it exits the orifice in the die. The nicked extrudate separates when fried or baked.