Abstract: Embodiments of a connector for commercial playground equipment are disclosed. In one embodiment, a playground component is provided that includes a connector pre-loaded on a rope. The connector includes a connector nut, optionally a washer, and a connector base that are kept from sliding off the end of the rope by a stop. The stop in one embodiment is a ferrule attached to the end of the rope. A specially shaped opening is formed in another component that is also part of the playground component. The specially shaped opening is configured such that at least a portion of the connector base is insertable through the opening when the connector base is rotated to a first orientation, but the connector base is unable to be pulled back through the specially shaped opening when rotated to a second orientation after insertion into the other component.

Abstract: Embodiments of play systems incorporating a balanced crosspiece concept are disclosed. In one embodiment, a series of segments are joined together so as to create the appearance of two crosspieces intersecting with one another at a point where one of the crosspieces has an appearance of having been notched out. Play elements are illustratively connected to at least some of the segments.

Abstract: A device comprises an array of elevationally-extending transistors and a circuit structure adjacent and electrically coupled to the elevationally-extending transistors of the array. The circuit structure comprises a stair step structure comprising vertically-alternating tiers comprising conductive steps that are at least partially elevationally separated from one another by insulative material. Operative conductive vias individually extend elevationally through one of the conductive steps at least to a bottom of the vertically-alternating tiers and individually electrically couple to an electronic component below the vertically-alternating tiers. Dummy structures individually extend elevationally through one of the conductive steps at least to the bottom of the vertically-alternating tiers. Methods are also disclosed.

Abstract: A device comprises an array of elevationally-extending transistors and a circuit structure adjacent and electrically coupled to the elevationally-extending transistors of the array. The circuit structure comprises a stair step structure comprising vertically-alternating tiers comprising conductive steps that are at least partially elevationally separated from one another by insulative material. Operative conductive vias individually extend elevationally through one of the conductive steps at least to a bottom of the vertically-alternating tiers and individually electrically couple to an electronic component below the vertically-alternating tiers. Dummy structures individually extend elevationally through one of the conductive steps at least to the bottom of the vertically-alternating tiers. Methods are also disclosed.

Abstract: A device comprises an array of elevationally-extending transistors and a circuit structure adjacent and electrically coupled to the elevationally-extending transistors of the array. The circuit structure comprises a stair step structure comprising vertically-alternating tiers comprising conductive steps that are at least partially elevationally separated from one another by insulative material. Operative conductive vias individually extend elevationally through one of the conductive steps at least to a bottom of the vertically-alternating tiers and individually electrically couple to an electronic component below the vertically-alternating tiers. Dummy structures individually extend elevationally through one of the conductive steps at least to the bottom of the vertically-alternating tiers. Methods are also disclosed.

Abstract: A device for packaging and dispensing a chemical product is provided. The device may include a first portion connected to a second portion. Counterpoising locking features may secure the first portion and the second portion. A support member is disposed within the lower portion and adapted to support the product. The device may include a flexible enclosure contoured to and enclosing the rigid body and the product. The flexible enclosure may enclose a portion of the housing and the product, after which heat is applied to shrink the flexible enclosure. A handle may provide for ease of installation and/or removal of the device from a solid chemical dispensing system.

Abstract: A semiconductor device includes a semiconductor die comprising integrated circuitry over a substrate of a semiconductor material. A first die ring comprises one or more electrically conductive materials at least partially surrounding the integrated circuitry, the one or more electrically conductive materials comprising an electrically conductive path from proximate a surface of the substrate to an exposed surface of the semiconductor die. A second die ring comprises an electrically conductive material and is disposed around the first die ring. A first electrically conductive interconnect electrically connects the first die ring and to second die ring. Related semiconductor devices and semiconductor dice are disclosed.

Abstract: A device comprises an array of elevationally-extending transistors and a circuit structure adjacent and electrically coupled to the elevationally-extending transistors of the array. The circuit structure comprises a stair step structure comprising vertically-alternating tiers comprising conductive steps that are at least partially elevationally separated from one another by insulative material. Operative conductive vias individually extend elevationally through one of the conductive steps at least to a bottom of the vertically-alternating tiers and individually electrically couple to an electronic component below the vertically-alternating tiers. Dummy structures individually extend elevationally through one of the conductive steps at least to the bottom of the vertically-alternating tiers. Methods are also disclosed.

Abstract: A semiconductor device includes a semiconductor die comprising integrated circuitry over a substrate of a semiconductor material. A first die ring comprises one or more electrically conductive materials at least partially surrounding the integrated circuitry, the one or more electrically conductive materials comprising an electrically conductive path from proximate a surface of the substrate to an exposed surface of the semiconductor die. A second die ring comprises an electrically conductive material and is disposed around the first die ring. A first electrically conductive interconnect electrically connects the first die ring and to second die ring. Related semiconductor devices and semiconductor dice are disclosed.

Abstract: A device for packaging and dispensing a chemical product is provided. The device may include a first portion connected to a second portion. Counterpoising locking features may secure the first portion and the second portion. A support member is disposed within the lower portion and adapted to support the product. The device may include a flexible enclosure contoured to and enclosing the rigid body and the product. The flexible enclosure may enclose a portion of the housing and the product, after which heat is applied to shrink the flexible enclosure. A handle may provide for ease of installation and/or removal of the device from a solid chemical dispensing system.

Abstract: A device for packaging and dispensing a chemical product is provided. The device may include a first portion connected to a second portion. Counterpoising locking features may secure the first portion and the second portion. A support member is disposed within the lower portion and adapted to support the product. The device may include a flexible enclosure contoured to and enclosing the rigid body and the product. The flexible enclosure may enclose a portion of the housing and the product, after which heat is applied to shrink the flexible enclosure. A handle may provide for ease of installation and/or removal of the device from a solid chemical dispensing system.

Abstract: Methods of acidic warewashing are disclosed. The compositions can include other materials including surfactants and chelating agents, and are preferably phosphorous free. Methods of using the acidic compositions in combination with alkaline compositions are also disclosed. Exemplary methods include using the acidic compositions together with other compositions, including alkaline compositions and rinse aids employed in an alternating alkaline/acid/alkaline manner. The methods also include acidic compositions that serve multiple roles.

Abstract: Methods of acidic warewashing are disclosed. The compositions can include other materials including surfactants and chelating agents, and are preferably phosphorous free. Methods of using the acidic compositions in combination with alkaline compositions are also disclosed. Exemplary methods include using the acidic compositions together with other compositions, including alkaline compositions and rinse aids employed in an alternating alkaline/acid/alkaline manner. The methods also include acidic compositions that serve multiple roles.

Abstract: A device for packaging and dispensing a chemical product is provided. The device may include a first portion connected to a second portion. Counterpoising locking features may secure the first portion and the second portion. A support member is disposed within the lower portion and adapted to support the product. The device may include a flexible enclosure contoured to and enclosing the rigid body and the product. The flexible enclosure may enclose a portion of the housing and the product, after which heat is applied to shrink the flexible enclosure. A handle may provide for ease of installation and/or removal of the device from a solid chemical dispensing system.

Abstract: Methods of acidic warewashing are disclosed. The compositions can include other materials including surfactants and chelating agents, and are preferably phosphorous free. Methods of using the acidic compositions in combination with alkaline compositions are also disclosed. Exemplary methods include using the acidic compositions together with other compositions, including alkaline compositions and rinse aids employed in an alternating alkaline/acid/alkaline manner. The methods also include acidic compositions that serve multiple roles.

Abstract: Methods of acidic warewashing are disclosed. The compositions can include other materials including surfactants and chelating agents, and are preferably phosphorous free. Methods of using the acidic compositions are also disclosed. Exemplary methods include using the acidic compositions together with other compositions, including alkaline compositions and rinse aids employed in an alternating alkaline/acid/alkaline manner. The methods also include acidic compositions that serve multiple roles.

Abstract: Methods of acidic warewashing are disclosed. The compositions can include other materials including surfactants and chelating agents, and are preferably phosphorous free. Methods of using the acidic compositions are also disclosed. Exemplary methods include using the acidic compositions together with other compositions, including alkaline compositions and rinse aids employed in an alternating alkaline/acid/alkaline manner. The methods also include acidic compositions that serve multiple roles.

Abstract: A method of warewashing for the optimization of cleaning is obtained, excess detergent usage is minimized and further where deposit of film on ware is reduced in an alternating acidic and alkaline cleaning method. According to the invention, the type of acid and alkalinity used, or acid salt formed upon application of the acidic and alkaline washes is important to cleaning performance and phosphate or silicates should be avoided.

Abstract: Gold flakes and small nuggets are separated from heavy sand by fluidizing the mixture with an upwardly flowing water column having a very uniform velocity across its section. The upwardly flowing water column has sufficient flow to fluidize the suspended material but not enough to carry the heavy sand over the top of the column. Heavy sand is withdrawn from the upper portion of the fluidized mixture to leave the gold below the withdrawal point.