Abstract: An automated processing system has an indexer bay perpendicularly aligned with a process bay within a clean air enclosure. An indexer in the indexer bay provides stocking or storage for work in progress wafers or articles. Process chambers are located in the process bay. A transfer robot moves wafers from a pod unsealed at a docking station into a carrier at a transfer station. The carrier has tapered or stepped outside surfaces engaging corresponding inside surfaces on a rotor within a process chamber. A process robot moves between the indexer bay and process bay to carry wafers to and from the process chambers. The process robot has a robot arm vertically moveable along a lift rail. Wafers are carried offset from the robot arm, to better avoid contamination. The automated system is compact and requires less clean room floor space.

Abstract: An automated semiconductor processing system has an indexer bay perpendicularly aligned with a process bay within a clean air enclosure. An indexer in the indexer bay provides stocking or storage for work in progress semiconductor wafers. Process chambers are located in the process bay. A process robot moves between the indexer bay and process bay to carry semi-conductor wafers to and from the process chambers. The process robot has a robot arm vertically moveable along a lift rail. Semiconductor wafers are carried offset from the robot arm, to better avoid contamination. The automated system is compact and requires less clean room floor space.

Abstract: Processing tools, components of tools, and methods of making and using such devices for electrochemical processing of microelectronic workpieces. One aspect of the invention is directed toward reaction vessels for electrochemical processing of microelectronic workpieces, processing stations including such reaction vessels, and methods for using these devices. For example, one embodiment of a reaction vessel includes an outer container having an outer wall, a first outlet configured to introduce a primary fluid flow into the outer container, and at least one second outlet configured to introduce a secondary fluid flow into the outer container separate from the primary fluid flow. The reaction vessel can also include at least one electrode, and it can also have a field shaping unit.

Abstract: An apparatus and method for handling microelectronic workpieces initially positioned in a container. The container can be changeable from a first configuration where the microelectronic workpiece is generally inaccessible within the container to a second configuration where the microelectronic workpiece is accessible for removal from the container. The apparatus can include a container access device positionable proximate to an aperture of an enclosure that at least partially encloses a region for handling a microelectronic workpiece. The container access device can be movably positioned proximate to the aperture to change the configuration of the container from the first configuration to the second configuration. A container support can be positioned proximate to the aperture and can be configured to move the container to a fixed, stationary position relative to the aperture when the container is in the second configuration.

Abstract: An apparatus and method for handling microelectronic workpieces initially positioned in a container. The container can be changeable from a first configuration where the microelectronic workpiece is generally inaccessible within the container to a second configuration where the microelectronic workpiece is accessible for removal from the container. The apparatus can include a container access device positionable proximate to an aperture of an enclosure that at least partially encloses a region for handling a microelectronic workpiece. The container access device can be movably positioned proximate to the aperture to change the configuration of the container from the first configuration to the second configuration. A container support can be positioned proximate to the aperture and can be configured to move the container to a fixed, stationary position relative to the aperture when the container is in the second configuration.

Abstract: An automated semiconductor processing system has an indexer bay perpendicularly aligned with a process bay within a clean air enclosure. An indexer in the indexer bay provides stocking or storage for work in progress semiconductor wafers. Process chambers are located in the process bay: A process robot moves between the indexer bay and process bay to carry semi-conductor wafers to and from the process chambers. The process robot has a robot arm vertically moveable along a lift rail. Semiconductor wafers are carried offset from the robot arm, to better avoid contamination. The automated system is compact and requires less clean room floor space.

Abstract: An apparatus and method for handling microelectronic workpieces initially positioned in a container. The container can be changeable from a first configuration where the microelectronic workpiece is generally inaccessible within the container to a second configuration where the microelectronic workpiece is accessible for removal from the container. The apparatus can include a container access device positionable proximate to an aperture of an enclosure that at least partially encloses a region for handling a microelectronic workpiece. The container access device can be movably positioned proximate to the aperture to change the configuration of the container from the first configuration to the second configuration. A container support can be positioned proximate to the aperture and can be configured to move the container to a fixed, stationary position relative to the aperture when the container is in the second configuration.

Abstract: An automated processing system has an indexer bay perpendicularly aligned with a process bay within a clean air enclosure. An indexer in the indexer bay provides stocking or storage for work in progress wafers or articles. Process chambers are located in the process bay. A transfer robot moves wafers from a pod unsealed at a docking station into a carrier at a transfer station. The carrier has tapered or stepped outside surfaces engaging corresponding inside surfaces on a rotor within a process chamber. A process robot moves between the indexer bay and process bay to carry wafers to and from the process chambers. The process robot has a robot arm vertically moveable along a lift rail. Wafers are carried offset from the robot arm, to better avoid contamination. The automated system is compact and requires less clean room floor space.

Abstract: An apparatus and method for handling microelectronic workpieces initially positioned in a container. The container can be changeable from a first configuration where the microelectronic workpiece is generally inaccessible within the container to a second configuration where the microelectronic workpiece is accessible for removal from the container. The apparatus can include a container access device positionable proximate to an aperture of an enclosure that at least partially encloses a region for handling a microelectronic workpiece. The container access device can be movably positioned proximate to the aperture to change the configuration of the container from the first configuration to the second configuration. A container support can be positioned proximate to the aperture and can be configured to move the container to a fixed, stationary position relative to the aperture when the container is in the second configuration.

Abstract: An automated semiconductor processing system has an indexer bay perpendicularly aligned with a process bay within a clean air enclosure. An indexer in the indexer bay provides stocking or storage for work in progress semiconductor wafers. Process chambers are located in the process bay: A process robot moves between the indexer bay and process bay to carry semi-conductor wafers to and from the process chambers. The process robot has a robot arm vertically moveable along a lift rail. Semiconductor wafers are carried offset from the robot arm, to better avoid contamination. The automated system is compact and requires less clean room floor space.

Abstract: A machine for cleaning containers has inside and outside arrays of nozzles arranged to spray a cleaning solution onto containers supported on a spinning rotor. Used cleaning solution is diverted to a reclaim tank for reuse, thereby allowing low-cost cleaning with concentrated chemicals, and with the creation of less liquid waste requiring disposal. In a method for removing contaminants from flat media or silicon wafer containers or carriers, a mixture of surfactant and de-ionized water is sprayed onto containers on a spinning rotor. The used cleaning solution is collected, filtered and reused.

Abstract: A cleaning system for cleaning boxes or containers used to carry semiconductor wafers has box holder assemblies and a box door holder assembly attached to a rotor within an enclosure. Upper and lower hooks on the box holder and box door holder assemblies hold boxes and doors as the rotor spins. Boxes and their doors, such as front opening unified pods (FOUP) are both efficiently cleaned and handled.

Abstract: Processing tools, components of tools, and methods of making and using such devices for electrochemical processing of microelectronic workpieces. One aspect of the invention is directed toward reaction vessels for electrochemical processing of microelectronic workpieces, processing stations including such reaction vessels, and methods for using these devices. For example, one embodiment of a reaction vessel includes an outer container having an outer wall, a first outlet configured to introduce a primary fluid flow into the outer container, and at least one second outlet configured to introduce a secondary fluid flow into the outer container separate from the primary fluid flow. The reaction vessel can also include at least one electrode, and it can also have a field shaping unit.

Abstract: A machine for cleaning containers has inside and outside arrays of nozzles arranged to spray a cleaning solution onto containers supported on a spinning rotor. Used cleaning solution is diverted to a reclaim tank for reuse, thereby allowing low-cost cleaning with concentrated chemicals, and with the creation of less liquid waste requiring disposal. In a method for removing contaminants from flat media or silicon wafer containers or carriers, a mixture of surfactant and de-ionized water is sprayed onto containers on a spinning rotor. The used cleaning solution is collected, filtered and reused.

Abstract: A cleaning system for cleaning carriers or containers used to carry semiconductor wafers has a door cleaner adjacent to a centrifugal box cleaner. Box holder assemblies are attached to a rotor within the box cleaner. Upper and lower hooks on the box holder assemblies hold boxes as the rotor spins. The door cleaner has a base which holds doors in a vertical and upright position. An elevator lowers the base into an ultrasonic cleaning tank. The tank lid seals the tank during use. Ultrasonic cleaning fluid is filtered and cycled into and out of the tank. Boxes and their doors, such as front opening unified pods (FOUP) are both efficiently cleaned and handled.

Abstract: A centrifugal processor for flat media, such as a silicon wafer, has a rotor eccentrically positioned within a cylindrical chamber or bowl. Drainage openings or slots are located near the bottom of the bowl. The rotor is offset in a direction away from the drain openings. Fluids drain more quickly from the bowl, as the tendency of the spinning rotor to draw fluids up and around the bowl is reduced, due to the rotor offset and to the discrete drain openings, and the position and orientation of the drain openings.

Abstract: An apparatus for processing a semiconductor wafer is set forth. The apparatus comprises a processing bowl that defines a processing chamber. The bowl has an opening through which wafers may be placed in the apparatus. A wafer support structure adapted to support at least one wafer is mounted for rotation within the processing chamber. A motor drive assembly is connected to rotate the wafer support structure. At least one fluid nozzle accepts processing fluid and sprays the processing fluid on the one or more wafers carried by the wafer support structure. A door is used to seal the opening of the processing bowl. The door has an opening that is open to ambient atmosphere to facilitate passage of ambient gas into the processing chamber. An ambient gas intake assembly is disposed in the door.

Abstract: A centrifugal processor for processing flat media, such as silicon wafers, has a rotor rotatably mounted within a rotor housing. Fan blades on the rotor blow air over the wafers, to move any remaining fluid droplets away from the wafer centers, to allow centrifugal force to fling the fluid droplets off of the wafers. The centrifugal processor uses clean room air, rather than nitrogen, for drying. Operating costs are reduced while manufacturing yields are increased, as spotting at the wafer centers is avoided.

Abstract: A wiper arm (30) for a vehicle windshield wiper assembly (14) has at least a section along its longitudinal extent formed of a longitudinally extending base portion (80) and two spaced side walls (82,84) extending outwardly along opposite sides of the base portion (80) to form an open channel (85). A spray nozzle (70i is disposed in the outboard portion of the wiper arm (30) and a fluid delivery tube (60) extends longitudinally along the wiper arm (30) to deliver wash fluid from a supply to the spray nozzle (70). The outboard edges (86,88) of the outwardly sidewalls (82,84) are folded inwardly towards each other to partially close the open face (87) of the channel (85), thereby retaining the fluid delivery tube (60), which is freely disposed, within the channel.

Abstract: A multi-speed, direct current motor (120) incorporates a high speed (24) brush disposed between the low speed (22) and the common ground (26) brushes and having a non-arcuate end face (25) which, unlike the conventional arcuate brush end face (23,27), is not subject to speed-drift erosion. The non-arcuate end face (25) is configured of two offset surfaces (55,65 & 57,67) which intersect to provide a line of contact (43) between the end face (25) of the high speed brush (24) and the commutator (40) which is displaced from the center line of the high speed brush (24) in a direction counter to the direction of rotation of the motor, that is toward the leading edge (21) of the brush (24). The intersecting surfaces (55,65 & 57,67) may comprise either flat planar surfaces or contoured surfaces.